公开(公告)号：US20160133549A1

公开(公告)日：2016-05-12

申请号：US14981452

申请日：2015-12-28

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Keita TAKADA ,  Tadatoshi DANNO ,  Hirokazu KATO

IPC: H01L23/495 ,  H01L23/31

CPC classification number: H01L23/49513 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3142 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49582 ,  H01L23/562 ,  H01L24/34 ,  H01L24/37 ,  H01L24/40 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40091 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A semiconductor device is inhibited from being degraded in reliability. The semiconductor device has a tab including a top surface, a bottom surface, and a plurality of side surfaces. Each of the side surfaces of the tab has a first portion continued to the bottom surface of the tab, a second portion located outwardly of the first portion and continued to the top surface of the tab, and a third portion located outwardly of the second portion and continued to the top surface of the tab to face the same direction as each of the first and second portions. In planar view, the outer edge of the semiconductor chip is located between the third portion and the second portion of the tab, and the outer edge of an adhesive material fixing the semiconductor chip to the tab is located between the semiconductor chip and the second portion.

公开(公告)号：US20150069594A1

公开(公告)日：2015-03-12

申请号：US14539479

申请日：2014-11-12

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Keita TAKADA ,  Tadatoshi DANNO ,  Hirokazu KATO

IPC: H01L23/495 ,  H01L23/31

CPC classification number: H01L23/49513 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3142 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49582 ,  H01L23/562 ,  H01L24/34 ,  H01L24/37 ,  H01L24/40 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40091 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A semiconductor device is inhibited from being degraded in reliability. The semiconductor device has a tab including a top surface, a bottom surface, and a plurality of side surfaces. Each of the side surfaces of the tab has a first portion continued to the bottom surface of the tab, a second portion located outwardly of the first portion and continued to the top surface of the tab, and a third portion located outwardly of the second portion and continued to the top surface of the tab to face the same direction as each of the first and second portions. In planar view, the outer edge of the semiconductor chip is located between the third portion and the second portion of the tab, and the outer edge of an adhesive material fixing the semiconductor chip to the tab is located between the semiconductor chip and the second portion.

Abstract translation: 可以防止半导体器件劣化。 半导体器件具有包括顶表面，底表面和多个侧表面的突片。 突片的每个侧表面具有连续到突片的底表面的第一部分，位于第一部分的外部并且延伸到突片的顶表面的第二部分，以及位于第二部分外侧的第三部分 并且延伸到突片的顶表面以面向与第一和第二部分中的每一个相同的方向。 在平面图中，半导体芯片的外边缘位于突片的第三部分和第二部分之间，并且将半导体芯片固定到突片的粘合剂材料的外边缘位于半导体芯片和第二部分之间 。