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公开(公告)号：US20240361195A1
公开(公告)日：2024-10-31
申请号：US18642297
申请日：2024-04-22
申请人： ROHM CO., LTD.
发明人： Masahiro SAKURAGI
IPC分类号： G01L9/00
CPC分类号： G01L9/0045 , G01L9/0044 , G01L9/0051
摘要： A sensor includes a substrate. A cavity is formed in the substrate. The substrate includes a membrane spaced from and facing a bottom surface of the cavity. A plurality of protruding portions are formed on one of the bottom surface of the cavity and an inner surface of the membrane.
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公开(公告)号：US20240183734A1
公开(公告)日：2024-06-06
申请号：US18525746
申请日：2023-11-30
申请人： ROHM CO., LTD.
发明人： Masahiro SAKURAGI
CPC分类号： G01L19/0092 , G01L9/0052 , G01L17/00 , G01P15/09
摘要： The present disclosure provides a MEMS sensor. The MEMS sensor includes: a substrate, on which a first sensor region for an acceleration sensor is formed; a first cavity, formed in the first sensor region of the substrate; a first weight portion, including a first membrane formed on the first cavity; a beam portion, supporting the first weight portion; and a piezoresistor, formed in the beam portion. A first opposing surface of the first weight portion facing the first cavity and a second opposing surface of the beam portion facing the first cavity are formed on same plane.
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公开(公告)号：US20210039946A1
公开(公告)日：2021-02-11
申请号：US16984999
申请日：2020-08-04
申请人： ROHM CO., LTD.
发明人： Masahiro SAKURAGI
摘要： A MEMS sensor includes a silicon substrate that has a first surface and a second surface on a side opposite to the first surface and that has a cavity in the first surface, a silicon diaphragm that has a first surface and a second surface on aside opposite to the first surface and in which the second surface is joined directly to the first surface of the silicon substrate, and a piezoresistance formed at the first surface of the silicon diaphragm, and, in the MEMS sensor, a plane orientation of the first surface of the silicon substrate and a plane orientation of the first surface of the silicon diaphragm differ from each other.
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公开(公告)号：US20180346322A1
公开(公告)日：2018-12-06
申请号：US15989259
申请日：2018-05-25
申请人： ROHM CO., LTD.
发明人： Masahiro SAKURAGI
CPC分类号： B81C1/00047 , B81B3/0021 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81B2207/012 , B81C2201/0116 , B81C2201/053 , G01L19/0069 , G01L19/143
摘要： A method for manufacturing a MEMS device includes a hole forming step of forming a plurality of holes concaved from a principal surface in a substrate material including a semiconductor, a connecting-hollow-portion forming step of forming a connecting hollow portion that connects the plurality of holes together, and a movable-portion forming step of, by partially moving the semiconductor of the substrate material so as to close at least one part of the plurality of holes, forming a hollow portion that exists inside the substrate material and a movable portion that coincides with the hollow portion when viewed in a thickness direction of the substrate material.
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公开(公告)号：US20240361196A1
公开(公告)日：2024-10-31
申请号：US18635919
申请日：2024-04-15
申请人： ROHM CO., LTD.
发明人： Masahiro SAKURAGI
IPC分类号： G01L9/00
CPC分类号： G01L9/0051
摘要： A sensor includes a substrate. A cavity is formed in the substrate. The substrate includes a membrane spaced from and facing a bottom surface of the cavity. A first depressed portion is formed in a central portion of the cavity as seen in a plan view.
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公开(公告)号：US20240183732A1
公开(公告)日：2024-06-06
申请号：US18525773
申请日：2023-11-30
申请人： ROHM CO., LTD.
发明人： Masahiro SAKURAGI
IPC分类号： G01L9/00
CPC分类号： G01L9/0072
摘要： The present disclosure provides a MEMS sensor. The MEMS sensor includes: a semiconductor substrate having a first surface and a second surface opposite to the first surface, and including a cavity; a membrane on the first surface to seal the cavity; a first region of a first conductivity type formed at a bottom of the cavity; and a second region of a second conductivity type formed on the membrane, facing the first region and separated from the first region by the cavity.
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公开(公告)号：US20170284881A1
公开(公告)日：2017-10-05
申请号：US15428244
申请日：2017-02-09
申请人： ROHM CO., LTD.
发明人： Masahiro SAKURAGI
CPC分类号： G01L9/0045 , G01L9/0051 , G01L19/0069 , G01L19/0654 , G01L19/147 , H05K1/111 , H05K1/183 , H05K2201/09781 , H05K2201/10151
摘要： An electronic part (air pressure detecting device) 1 includes a sensor element (air pressure sensor element) 2 that includes an ambient air contacting surface S including an ambient air contacting region Sa to be exposed to ambient air, and a supporting substrate 4, arranged to support the sensor element 2. The sensor element 2 is bonded to one surface 4a of the supporting substrate 4 in a state where its ambient air contacting surface S faces the one surface 4a of the supporting substrate 4 and a gap, through which the ambient air flows, is formed between the ambient air contacting surface S and the one surface 4a of the supporting substrate 4.
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