公开(公告)号：US09893420B2

公开(公告)日：2018-02-13

申请号：US14820017

申请日：2015-08-06

Applicant: ROHM CO., LTD.

Inventor： Tomohiro Ikuta ,  Yusaku Kawabata

IPC: H01L23/48 ,  H01L23/52 ,  H01Q1/50 ,  H01Q21/00 ,  H01Q1/40 ,  H01L23/31 ,  H01Q1/22 ,  H04B1/40

CPC classification number: H01Q1/50 ,  H01L23/3121 ,  H01L23/48 ,  H01L2924/0002 ,  H01Q1/2283 ,  H01Q1/40 ,  H01Q21/0006 ,  H04B1/40 ,  H01L2924/0001 ,  H01L2924/00

Abstract: The wireless module according to the present invention includes a wireless IC chip for processing transmission/reception signals, a substrate on which the wireless IC chip is mounted, an antenna provided on the substrate, and a plurality of terminals extending off from the substrate in an in-plane direction of the substrate.

公开(公告)号：US09699889B2

公开(公告)日：2017-07-04

申请号：US15169080

申请日：2016-05-31

Applicant: ROHM CO., LTD.

Inventor： Tomohiro Ikuta

IPC: H04B1/38 ,  H05K1/02 ,  H05K7/02 ,  H05K1/14 ,  H04B1/44

CPC classification number: H05K1/0243 ,  H04B1/44 ,  H05K1/144 ,  H05K1/148 ,  H05K7/026 ,  H05K2201/042 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10143 ,  H05K2201/10371 ,  H05K2201/10522

Abstract: A wireless communication module includes: a wireless circuit configured to transmit/receive a wireless signal; a first inter-board connector; a first board on which the wireless circuit and the first connector are mounted; a signal processing circuit configured to process the wireless signal transmitted/received by the wireless circuit; a second inter-board connector configured to be connected to the first connector; and a second board on which the signal processing circuit and the second connector are mounted. The first board overlaps at least partially with the second board under a condition where the first connector and the second connector are interconnected.

公开(公告)号：US09129941B2

公开(公告)日：2015-09-08

申请号：US13927736

申请日：2013-06-26

Applicant: ROHM CO., LTD.

Inventor： Tomohiro Ikuta ,  Yusaku Kawabata

IPC: H01L23/48 ,  H01L23/31 ,  H01Q1/22 ,  H04B1/40

CPC classification number: H01Q1/50 ,  H01L23/3121 ,  H01L23/48 ,  H01L2924/0002 ,  H01Q1/2283 ,  H01Q1/40 ,  H01Q21/0006 ,  H04B1/40 ,  H01L2924/0001 ,  H01L2924/00

Abstract: The wireless module according to the present invention includes a wireless IC chip for processing transmission/reception signals, a substrate on which the wireless IC chip is mounted, an antenna provided on the substrate, and a plurality of terminals extending off from the substrate in an in-plane direction of the substrate.

Abstract translation: 根据本发明的无线模块包括用于处理发送/接收信号的无线IC芯片，安装无线IC芯片的基板，设置在基板上的天线以及从基板延伸的多个端子 基板的面内方向。

公开(公告)号：US10587301B2

公开(公告)日：2020-03-10

申请号：US15310169

申请日：2015-05-08

Applicant: ROHM CO., LTD.

Inventor： Masahiro Yasuda ,  Tomohiro Ikuta

IPC: H04B1/40 ,  H01Q1/24 ,  H01Q1/22 ,  H01Q1/36 ,  H01Q9/42 ,  H01Q1/38 ,  H01Q1/48

Abstract: A wireless communications module of the present invention includes a wireless communication control unit and a plurality of external connection terminals. At least any one of the plurality of external connection terminals and the wireless communication control unit are connected via a communication frequency component removing element.

公开(公告)号：US09894753B2

公开(公告)日：2018-02-13

申请号：US15611849

申请日：2017-06-02

Applicant: ROHM CO., LTD.

Inventor： Tomohiro Ikuta

IPC: H04B1/38 ,  H05K1/02 ,  H05K7/02 ,  H05K1/14 ,  H04B1/44

CPC classification number: H05K1/0243 ,  H04B1/44 ,  H05K1/144 ,  H05K1/148 ,  H05K7/026 ,  H05K2201/042 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10143 ,  H05K2201/10371 ,  H05K2201/10522

Abstract: A wireless communication module includes: a wireless circuit configured to transmit/receive a wireless signal; a first inter-board connector; a first board on which the wireless circuit and the first connector are mounted; a signal processing circuit configured to process the wireless signal transmitted/received by the wireless circuit; a second inter-board connector configured to be connected to the first connector; and a second board on which the signal processing circuit and the second connector are mounted. The first board overlaps at least partially with the second board under a condition where the first connector and the second connector are interconnected.

公开(公告)号：US09380724B2

公开(公告)日：2016-06-28

申请号：US13850777

申请日：2013-03-26

Applicant: ROHM CO., LTD.

Inventor： Tomohiro Ikuta

IPC: H05K1/14 ,  H05K7/02

CPC classification number: H05K1/0243 ,  H04B1/44 ,  H05K1/144 ,  H05K1/148 ,  H05K7/026 ,  H05K2201/042 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10143 ,  H05K2201/10371 ,  H05K2201/10522

Abstract: A wireless communication module includes: a wireless circuit configured to transmit/receive a wireless signal; a first inter-board connector; a first board on which the wireless circuit and the first connector are mounted; a signal processing circuit configured to process the wireless signal transmitted/received by the wireless circuit; a second inter-board connector configured to be connected to the first connector; and a second board on which the signal processing circuit and the second connector are mounted. The first board overlaps at least partially with the second board under a condition where the first connector and the second connector are interconnected.

Abstract translation: 无线通信模块包括：无线电路，被配置为发送/接收无线信号; 第一个板间连接器; 无线电路和第一连接器安装在其上的第一板; 信号处理电路，被配置为处理由无线电路发送/接收的无线信号; 第二板间连接器，被配置为连接到所述第一连接器; 以及安装信号处理电路和第二连接器的第二板。 在第一连接器和第二连接器相互连接的状态下，第一板至少部分地与第二板重叠。