摘要:
An improvement is disclosed in a brush cleaning apparatus for cleaning a major surface of a wafer and including wafer guide wheels for transporting the wafer. The improvement includes a polish pad material disposed on a circumference of the guide wheels. The polish pad material is a material used in chemical-mechanical polishing of the wafer. The polish pad material contacts an edge portion of the wafer during cleaning thereof, thereby removing contaminants from the edge portion of the wafer, so that edge cleaning is performed in situ in addition to the brush cleaning of the major surface of the wafer.
摘要:
A method of reconditioning a polishing pad using a chemical-mechanical polishing apparatus is disclosed, wherein the polishing pad contacts a workpiece in the presence of a slurry to perform chemical-mechanical polishing on the workpiece. The method comprises contacting the polishing pad with a reconditioning pad. The reconditioning pad is made of a polishing pad material similar to that of the polishing pad.
摘要:
A method and apparatus for cleaning polishing debris from the surface of a polishing pad by wetting the surface with a liquid and irradiating the wetted surface with a beam of light. The light beam has sufficient intensity at the polishing surface of the pad to vaporize at least a portion of the liquid such that the vaporized liquid causes at least a portion of the debris to be expelled from the polishing surface of the pad.
摘要:
An improvement is disclosed in a brush cleaning apparatus for cleaning a major surface of a wafer and including wafer guide wheels for transporting the wafer. The improvement includes a polish pad material disposed on a circumference of the guide wheels. The polish pad material is a material used in chemical-mechanical polishing of the wafer. The polish pad material contacts an edge portion of the wafer during cleaning thereof, thereby removing contaminants from the edge portion of the wafer, so that edge cleaning is performed in situ in addition to the brush cleaning of the major surface of the wafer.
摘要:
An apparatus for performing semiconductor planarizing operations is disclosed. In an exemplary embodiment, the apparatus includes a carrier assembly for maintaining a workpiece therein in a face up orientation. A roller assembly includes a first cylindrical roller and a cylindrical second roller, the first and second rollers being linked to one another through a pair of arms. Each of the first and second rollers may be independently positioned with respect to a horizontal plane, the horizontal plane being substantially parallel to a top surface of the workpiece.
摘要:
A conditioning tool including a rotary conditioning pad; a lower shaft attached to the conditioning pad; an upper shaft having an upper end and a lower end, the lower end attached to the lower shaft via a flexible coupling; and a motor attached to the upper end of the upper shaft and adapted to rotate the shaft. The tool further includes a mechanism for measuring an angle of the conditioning pad relative to a reference plane. The conditioning tool may further include a conditioning arm, various control mechanisms, and a controller for receiving feedback from the angle measuring mechanism and the various control mechanisms and for controlling the various control mechanisms in response to the feedback. A chemical-mechanical polishing apparatus and a conditioning method for providing a uniform polishing surface of a chemical-mechanical polishing pad are also disclosed.
摘要:
A combination of a FOUP (front opening unified pod) system and a reticle system utilized for the transport of wafers and a reticle system, the latter of which are used for transporting reticles from a first fabrication site to a further site at another location, and which provides for a unified system enabling the automated and trackable delivery of the reticles between these sites. Provided is a modified FOUP base structure, which is adapted to retain a reticle and to be able to employ existing equipment in a fabrication site which only necessitates a minimal modification of the equipment in order to render the latter universally adaptable to the combination of the systems.
摘要:
A overhead transport service vehicle system includes a carriage frame structured and arranged to carry a user. A hoisting mechanism utilizes at least one lifting device for lifting and lowering the carriage frame and at least one moving device for causing movement of the hoisting mechanism along one of a track or rail. A control controls at least one of the at least one lifting device and the at least one moving device.
摘要:
A cable attachment assembly, a hoist and a transportation system using the cable attachment assembly. The cable attachment assembly including: a plate pivotable about a first axis; first and second pivot assemblies pivotable about respective second and third axes, the first, second and third axes parallel to each other; a first cable retainer in the first pivot assembly, the first cable retainer adapted to rotateably retain an end of a first cable in the first cable pivot assembly, the first cable rotatable about a fourth axis; a second cable retainer in the second pivot assembly, the second cable retainer adapted to rotateably retain an end of a second cable in the second pivot assembly, the second cable rotatable about a fifth axis; wherein the fourth and fifth axes parallel to each other and the fourth and fifth axes are perpendicular to the first, second and third axis.
摘要:
A overhead transport service vehicle system includes a carriage frame structured and arranged to carry a user. A hoisting mechanism utilizes at least one lifting device for lifting and lowering the carriage frame and at least one moving device for causing movement of the hoisting mechanism along one of a track or rail. A control controls at least one of the at least one lifting device and the at least one moving device.