公开(公告)号：US06446335B1

公开(公告)日：2002-09-10

申请号：US09542918

申请日：2000-04-04

申请人： Richard Lee Carlson ,  Bruce Dale King ,  Rudolph Manuel Lopez ,  Alex Irwin Panasiuk ,  George G. Zamora

发明人： Richard Lee Carlson ,  Bruce Dale King ,  Rudolph Manuel Lopez ,  Alex Irwin Panasiuk ,  George G. Zamora

IPC分类号： H01R4304

CPC分类号： H01L23/49572 ,  H01L24/24 ,  H01L24/45 ,  H01L24/82 ,  H01L2224/16 ,  H01L2224/2402 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/73267 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/0298 ,  H05K3/361 ,  H05K2203/0195 ,  H05K2203/1189 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49179 ,  Y10T29/49181 ,  H01L2224/48 ,  H01L2924/00

摘要： A method of thermal compression bonding conductors of a multiconductor flat cable or electrical component by melting through a base layer from the reverse side of a base layer supporting the conductors. The multiconductor flat cable or electrical component comprises a base layer with conductors disposed thereon and a flat cover having an opening provided therein at a bonding site, preferably by die cutting. The flat cover with the opening is laminated to the base layer, overlaying the conductors, so that the conductors are mechanically stabilized by the base layer while being exposed through the bonding opening. The shape of the multiconductor flat cable or electrical component of the present invention may be highly varied. In one embodiment, the flat multiconductor electrical component circumferentially extends around a central area, for example, totally encompassing in IC chip which may be connected to the conductors thereof at a bonding site. The conductors fan out from the IC chip to connections at the outer perimeter, and the top cover is eliminated completely.

摘要翻译： 通过从支撑导体的基底层的背面通过基底层熔化而导致多导体扁平电缆或电气部件的热压接的方法。 多导体扁平电缆或电气部件包括其上布置有导体的基底层和优选通过模切而在接合位置处设置有开口的平坦盖。 具有开口的平坦盖层叠到基层上，覆盖导体，使得导体在通过接合开口暴露的同时由基底层进行机械稳定化。 本发明的多导体扁平电缆或电气部件的形状可以是高度变化的。 在一个实施例中，扁平多导体电气部件围绕中心区域周向地延伸，例如完全包含在IC芯片中，IC芯片可以在结合位置连接到其导体。 导体从IC芯片扇出到外周的连接处，顶盖完全消除。

公开(公告)号：US6093894A

公开(公告)日：2000-07-25

申请号：US883167

申请日：1997-06-26

申请人： Richard Lee Carlson ,  Bruce Dale King ,  Rudolph Manuel Lopez ,  Alex Irwin Panasiuk ,  George G. Zamora

发明人： Richard Lee Carlson ,  Bruce Dale King ,  Rudolph Manuel Lopez ,  Alex Irwin Panasiuk ,  George G. Zamora

IPC分类号： H01L23/495 ,  H05K1/00 ,  H05K3/36 ,  H01B11/02 ,  H05K1/02

CPC分类号： H01L23/49572 ,  H01L24/24 ,  H01L24/82 ,  H05K3/361 ,  H01L2224/16 ,  H01L2224/2402 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/73267 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/0298 ,  H05K2203/0195 ,  H05K2203/1189 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49179 ,  Y10T29/49181

摘要： A bonding opening exposing conductors through a cover of a multiconductor flat cable or electrical component to allow direct bonding thereof is described. The multiconductor flat cable or electrical component having a base layer with conductors disposed thereon and a flat cover having an opening provided therein at a bonding site, preferably by die cutting. The flat cover with the opening is laminated to the base layer, overlaying the conductors, so that the conductors are mechanically stabilized by the base layer while being exposed through the bonding opening. The shape of the multiconductor flat cable or electrical component of the present invention may be highly varied. In one embodiment, the flat multiconductor electrical component circumferentially extends around a central area, for example, totally encompassing in IC chip which may be connected to the conductors thereof at a bonding site. The conductors fan out from the IC chip to connections at the outer perimeter, and the top cover is eliminated completely.

摘要翻译： 描述了通过多导体扁平电缆或电气部件的盖子的导体的接合开口，以允许其直接接合。 多导体扁平电缆或电气部件具有设置在其上的导体的基底层和在接合位置处优选通过模切而在其中设置有开口的平坦盖。 具有开口的平坦盖层叠到基层上，覆盖导体，使得导体在通过接合开口暴露的同时由基底层进行机械稳定化。 本发明的多导体扁平电缆或电气部件的形状可以是高度变化的。 在一个实施例中，扁平多导体电气部件围绕中心区域周向地延伸，例如完全包含在IC芯片中，IC芯片可以在结合位置连接到其导体。 导体从IC芯片扇出到外周的连接处，顶盖完全消除。