公开(公告)号：US20140328023A1

公开(公告)日：2014-11-06

申请号：US14153327

申请日：2014-01-13

Applicant: Samsung Electronics Co., Ltd

Inventor： IN-HO CHOI ,  YONG-HOON KIM ,  SEONG-HO SHIN

IPC: H01L23/552

CPC classification number: H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1615 ,  H01L2924/16251 ,  H01L2924/16724 ,  H01L2924/16747 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00

Abstract: A semiconductor package includes a substrate, a semiconductor chip located on a top surface of the substrate, signal lines formed on the top surface of the substrate and configured to allow different types of signals to input/output thereto/therefrom, a ground line unit formed on the top surface of the substrate and configured to divide the signal lines into signal lines to/from which the same types of signals are input/output to be isolated from one another, barrier walls configured to contact the ground line unit, and a heat dissipation unit disposed on the semiconductor chip, wherein the ground line unit includes diagonal ground lines located in diagonal directions of the substrate about the semiconductor chip, and the heat dissipation unit includes a thermal interface material (TIM) located on a top surface of the semiconductor chip, and a heat dissipation plate configured to cover the TIM and the substrate.

Abstract translation: 半导体封装包括衬底，位于衬底的顶表面上的半导体芯片，形成在衬底的顶表面上并被配置为允许不同类型的信号从其输入/输出的信号线，形成的接地线单元 在基板的顶表面上，并且将信号线分成信号线，以使相同类型的信号被输入/输出为彼此隔离的信号线，被配置为接触地线单元的阻挡壁和热量 设置在半导体芯片上的散热单元，其中接地线单元包括位于半导体芯片周围的基板的对角线方向的对角线，而散热单元包括位于半导体芯片顶表面上的热界面材料（TIM） 芯片，以及配置成覆盖TIM和基板的散热板。

公开(公告)号：US20150206780A1

公开(公告)日：2015-07-23

申请号：US14579609

申请日：2014-12-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： IN-HO CHOI ,  Young-Suk Sim

IPC: H01L21/673

CPC classification number: H01L21/67017 ,  H01L21/67309 ,  H01L21/6732 ,  Y10T29/49826

Abstract: A wafer storage apparatus includes a wafer stacking portion that encloses an internal space with an open front side for receiving a plurality of wafers; a rear cover portion disposed on the back side of the wafer stacking portion; and a gas charging portion that includes a plurality of gas supply blocks disposed on the inner side of the rear cover portion, a plurality of gas supply pipes connected to the gas supply blocks via through holes in the rear cover portion, and a gas supply unit connected to the gas supply pipes.

Abstract translation: 晶片存储装置包括晶片堆叠部分，其包围具有用于容纳多个晶片的开放正面的内部空间; 设置在所述晶片堆叠部的背侧的后盖部; 以及气体充填部，其包括设置在所述后盖部的内侧的多个供气块，经由所述后盖部中的通孔与所述气体供给块连接的多个气体供给管，以及气体供给部 连接到供气管。