公开(公告)号：US20170372906A1

公开(公告)日：2017-12-28

申请号：US15409813

申请日：2017-01-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yun Kyeong JANG ,  Sang Jin KIM ,  Dong Woon PARK ,  Joon Soo PARK ,  Chang Jae YANG ,  Kwang Sub YOON ,  Hye Kyoung JUE

IPC: H01L21/28 ,  H01L21/033 ,  H01L21/8234

CPC classification number: H01L21/28123 ,  H01L21/0337 ,  H01L21/28132 ,  H01L21/32139 ,  H01L21/823431 ,  H01L21/823456

Abstract: A method for fabricating a semiconductor device includes stacking a semiconductor layer, a first sacrificial layer, and a second sacrificial layer, patterning the second sacrificial layer to form a second sacrificial pattern, forming a spacer pattern on both sides of the second sacrificial pattern, wherein a pitch of the spacer pattern is constant, and a width of the spacer pattern is constant, removing the second sacrificial pattern, forming a mask layer that covers the spacer pattern, forming a supporting pattern on the mask layer, wherein a width of the supporting pattern is greater than a width of the spacer pattern, and the supporting pattern is overlapped with the spacer pattern, transferring the supporting pattern and the spacer pattern onto the first sacrificial layer to form gate and supporting patterns, and transferring the gate and supporting patterns onto the semiconductor layer to form a gate and a supporting gate.

公开(公告)号：US20200048820A1

公开(公告)日：2020-02-13

申请号：US16537260

申请日：2019-08-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong Bum LEE ,  Sang Jin KIM ,  Eung Ryeol SEO

IPC: D06F58/28 ,  H05K7/20 ,  H05K7/14 ,  H05K5/03 ,  D06F58/10

Abstract: A clothes care apparatus capable of improving cooling performance of a printed circuit board assembly includes a body, a first chamber provided inside the body and configured to receive clothes, a second chamber provided inside the body but separated from the first chamber, a printed circuit board housing configured to form one side wall of the second chamber and provided with a receiving space separated from the second chamber in the second chamber, the receiving space to which air outside the body flows, and a printed circuit board assembly arranged in the receiving space to be cooled by air flowing into the receiving space from the outside of the body.

公开(公告)号：US20170248321A1

公开(公告)日：2017-08-31

申请号：US15442014

申请日：2017-02-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Qasim KHAN ,  Myoung Keun KWON ,  Sang Jin KIM ,  Dong Ho PARK ,  Dong Bum LEE ,  Sang-Jin LEE ,  Jung Hak LEE

IPC: F24C15/02

CPC classification number: F24C15/02 ,  F24C15/022 ,  F24C15/024 ,  F24C15/04 ,  F24C15/06

Abstract: Provided herein is an oven in which a door has a double door structure that includes a first door formed of a transparent material and a second door formed of an opaque material to simultaneously ensure visibility and heat insulation. The oven includes a main body, a cooking compartment provided inside the main body and having an open front surface, a first door rotatably coupled to the main body to open and close the cooking compartment, formed of a transparent material to make an inside of the cooking compartment visible from the outside, and locked to and unlocked from the main body by a locking device, and a second door formed of an opaque material, rotatably coupled to a front surface of the first door, and locked to and unlocked from the first door by the locking device.