公开(公告)号：US20180053703A1

公开(公告)日：2018-02-22

申请号：US15554304

申请日：2015-07-16

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Kyoung Chul BAE ,  Dong Hwan LEE

IPC: H01L23/29 ,  C08K3/22 ,  C08K3/36

CPC classification number: H01L23/295 ,  C08G59/621 ,  C08G59/686 ,  C08K3/22 ,  C08K3/34 ,  C08K3/36 ,  C08K2003/2227 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/006 ,  C08K2201/011 ,  C09D163/00 ,  H01L23/293 ,  C08L63/00

Abstract: An epoxy resin composition for sealing a semiconductor device, of the present invention, contains an inorganic filler, and the inorganic filler contains a nanomaterial containing silicon (Si) and aluminium (Al).

公开(公告)号：US20220145066A1

公开(公告)日：2022-05-12

申请号：US17479259

申请日：2021-09-20

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Yong Yeop PARK ,  Dong Hwan LEE ,  Kyoung Chul BAE ,  Min Joon SEO ,  Chul Ho LEE

IPC: C08L63/00 ,  C08G59/22 ,  C08K3/22 ,  C08G59/68 ,  C08G59/62 ,  C08G59/42 ,  C08G59/12

Abstract: An epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the epoxy resin composition, the epoxy resin composition including an epoxy resin; a curing agent; an inorganic filler; and a curing catalyst, the epoxy resin including an epoxy resin represented by Formula 1: