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1.发明申请PYRIDINIUM-BASED COMPOUND, EPOXY RESIN COMPOSITION COMPRISING SAME, AND APPARATUS MANUFACTURED USING SAME 有权基于吡啶鎓的化合物，包含其的环氧树脂组合物和使用其制备的装置公开(公告)号：US20160333136A1
公开(公告)日：2016-11-17
申请号：US15111337
申请日：2014-05-09
Applicant: SAMSUNG SDI CO., LTD.
Inventor： Dong Hwan LEE , Min Gyum KIM , Jung Seob KIM , Jin Min CHEON , Hwan Sung CHEON , Seung HAN
IPC: C08G59/40 , H01L23/29 , B01J31/02 , C08L63/00 , C07D213/04 , C07D213/85
CPC classification number: C08G59/4014 , B01J31/02 , B01J31/0271 , C07D213/04 , C07D213/30 , C07D213/84 , C07D213/85 , C08G59/245 , C08G59/621 , C08G59/686 , C08L63/00 , H01L23/295 , H01L23/3121 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125
Abstract: The present invention relates to a pyridinium-based compound of chemical formula 1, an epoxy resin composition comprising the same, and an apparatus manufactured by using the same.
Abstract translation: 本发明涉及化学式1的吡啶鎓系化合物，包含该化合物的环氧树脂组合物和使用该化合物的制造装置。
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2.发明申请公开(公告)号：US20180053703A1
公开(公告)日：2018-02-22
申请号：US15554304
申请日：2015-07-16
Applicant: SAMSUNG SDI CO., LTD.
Inventor： Kyoung Chul BAE , Dong Hwan LEE
CPC classification number: H01L23/295 , C08G59/621 , C08G59/686 , C08K3/22 , C08K3/34 , C08K3/36 , C08K2003/2227 , C08K2201/001 , C08K2201/003 , C08K2201/006 , C08K2201/011 , C09D163/00 , H01L23/293 , C08L63/00
Abstract: An epoxy resin composition for sealing a semiconductor device, of the present invention, contains an inorganic filler, and the inorganic filler contains a nanomaterial containing silicon (Si) and aluminium (Al).
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3.发明申请CURING CATALYST FOR EPOXY RESIN COMPOSITION, EPOXY RESIN COMPOSITION COMPRISING SAME, AND APPARATUS MANUFACTURED BY USING SAME 有权用于环氧树脂组合物的固化催化剂，包含其的环氧树脂组合物和使用其制备的装置公开(公告)号：US20160326303A1
公开(公告)日：2016-11-10
申请号：US15111348
申请日：2014-05-16
Applicant: SAMSUNG SDI CO., LTD.
Inventor： Jung Seob KIM , Min Gyum KIM , Dong Hwan LEE , Jin Min CHEON , Hwan Sung CHEON , Seung HAN
CPC classification number: C08G59/687 , C08G59/686 , C09K3/1006 , H01L23/293 , H01L23/295
Abstract: The present invention relates to a curing catalyst for an epoxy resin composition represented by chemical formula 1, an epoxy resin composition comprising the same, and an apparatus manufactured using the same.
Abstract translation: 本发明涉及一种由化学式1表示的环氧树脂组合物的固化催化剂，包含该固化催化剂的环氧树脂组合物和使用其制备的装置。
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4.发明申请COMPOUND CONTAINING PHOSPHONIUM ION, EPOXY RESIN COMPOSITION CONTAINING SAME, AND DEVICE MANUFACTURED BY USING SAME 审中-公开包含磷酸盐的复合物，含有环氧树脂的组合物和使用其制造的装置公开(公告)号：US20160159971A1
公开(公告)日：2016-06-09
申请号：US14907643
申请日：2014-02-27
Applicant: SAMSUNG SDI CO., LTD
Inventor： Jin Min CHEON , Min Gyum KIM , Jung Seob KIM , Dong Hwan LEE , Hwan Sung CHEON , Seung HAN
IPC: C08G59/68 , C07F9/54 , C07C311/16 , C08L63/04 , C08L63/00 , C08G59/62 , C08G59/24 , C07D239/42 , C07C311/51
CPC classification number: C08G59/688 , C07C311/51 , C07D239/42 , C07F9/5442 , C07F9/5456 , C08G59/245 , C08G59/621 , C08L63/00 , C08L63/04 , C08L2205/05
Abstract: The present invention relates to a compound containing phosphonium ion of a chemical formula 1, an epoxy resin composition containing the same, and a device manufactured by using the same.
Abstract translation: 本发明涉及化学式1的含有鏻离子的化合物，含有该化合物的鏻离子的化合物，以及使用该鏻离子的装置。
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Patent Agency Ranking
公开(公告)号：US20220145066A1
公开(公告)日：2022-05-12
申请号：US17479259
申请日：2021-09-20
Applicant: SAMSUNG SDI CO., LTD.
Inventor： Yong Yeop PARK , Dong Hwan LEE , Kyoung Chul BAE , Min Joon SEO , Chul Ho LEE
Abstract: An epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the epoxy resin composition, the epoxy resin composition including an epoxy resin; a curing agent; an inorganic filler; and a curing catalyst, the epoxy resin including an epoxy resin represented by Formula 1:
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6.发明申请公开(公告)号：US20170306079A1
公开(公告)日：2017-10-26
申请号：US15523501
申请日：2016-01-22
Applicant: SAMSUNG SDI CO., LTD.
Inventor： Min Gyum KIM , Jin Woo CHOI , Ki Hyeok KWON , Dong Hwan LEE , Joo Young CHUNG , Jin Min CHEON
IPC: C08G59/68 , H01L23/29 , C08K3/36 , C07F9/54 , C07C255/53 , C07C49/83 , C07C39/15 , H01L23/31 , C07C39/10
CPC classification number: C08G59/688 , C07C39/08 , C07C39/10 , C07C39/15 , C07C39/17 , C07C39/235 , C07C49/83 , C07C255/53 , C07C2603/18 , C07F9/5442 , C08K3/36 , H01L23/293 , H01L23/3107 , H01L2224/16227 , H01L2224/73204 , H01L2924/18161
Abstract: The present invention relates to a phosphonium-based compound represented by chemical formula 1, an epoxy resin composition containing the same, and a semiconductor device manufactured by using the same.
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7.发明申请PHOSPHONIUM COMPOUND, EPOXY RESIN COMPOSITION INCLUDING THE SAME AND SEMICONDUCTOR DEVICE PREPARED USING THE SAME 有权磷化合物，包括其的环氧树脂组合物和使用其制备的半导体器件公开(公告)号：US20170018473A1
公开(公告)日：2017-01-19
申请号：US15209871
申请日：2016-07-14
Applicant: SAMSUNG SDI CO., LTD.
Inventor： Ki Hyeok KWON , Min Gyum KIM , Joo Young CHUNG , Jin Min CHEON , Jin Woo CHOI , Seung HAN , Dong Hwan LEE
CPC classification number: C09J163/00 , C07F7/045 , C07F9/5442 , C08L63/00 , C08L2201/08 , C08L2203/206 , C09J2203/326 , H01L23/293 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/18161 , H01L2924/00014 , H01L2924/00012
Abstract: A phosphonium compound, an epoxy resin composition including the same, a semiconductor device encapsulated with the same, and a method of encapsulating a semiconductor device, the phosphonium compound being represented by Formula 1:
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8.发明申请PHOSPHONIUM COMPOUND, PREPARATION METHOD THEREOF, EPOXY RESIN COMPOSITION INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE PREPARED BY USING THE SAME 有权磷化合物，其制备方法，包括其的环氧树脂组合物和使用其制备的半导体器件公开(公告)号：US20160368937A1
公开(公告)日：2016-12-22
申请号：US15189057
申请日：2016-06-22
Applicant: SAMSUNG SDI CO., LTD.
Inventor： Dong Hwan LEE , Min Gyum KIM , So Yoon KIM , Woo Chul NA , Yoon Man LEE , Ji Yoon CHO , Ki Hyeok KWON , KyoungChul BAE , Eun Jung LEE , Joo Young CHUNG , Jin Min CHEON , Jin Woo CHOI , Seung HAN
IPC: C07F9/54 , H01L23/29 , C07C235/56 , C09D163/00 , C09D7/12
CPC classification number: C07F9/5442 , C07C235/64 , C08G59/621 , C08G59/688 , C09D163/00 , H01L23/295 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/92 , H01L2224/16227 , H01L2224/16245 , H01L2224/2929 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/92125 , H01L2924/18161 , H01L2924/3512 , H01L2924/00
Abstract: A phosphonium compound, a method of preparing the same, an epoxy resin composition including the same, and a semiconductor device encapsulated with the same, the compound being represented by Formula 1:
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9.发明申请PHOSPHONIUM COMPOUND, EPOXY RESIN COMPOSITION INCLUDING THE SAME AND SEMICONDUCTOR DEVICE PREPARED FROM THE SAME 有权磷化合物，包含其的环氧树脂组合物及其制备的半导体器件公开(公告)号：US20160115184A1
公开(公告)日：2016-04-28
申请号：US14918916
申请日：2015-10-21
Applicant: SAMSUNG SDI CO., LTD.
Inventor： Min Gyum KIM , Ki Hyeok KWON , Dong Hwan LEE , Joo Young CHUNG , Jin Min CHEON , Jin Woo CHOI
IPC: C07F9/54 , C09D163/00 , H01L23/29 , C07C233/65
CPC classification number: C07F9/5442 , C07C39/08 , C07C39/12 , C07C39/17 , C07C233/65 , C07C235/64 , C07C235/66 , C07C259/10 , C07C323/20 , C07C2603/18 , C08G59/621 , C08G59/688 , C08K5/49 , C08K5/50 , C09D163/00 , H01L23/295 , H01L23/3121 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/92 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/2929 , H01L2224/29298 , H01L2224/32225 , H01L2224/73204 , H01L2224/81192 , H01L2224/92125 , H01L2924/14 , H01L2924/181 , H01L2924/00012 , H01L2924/014 , H01L2924/00
Abstract: A phosphonium compound, an epoxy resin composition, a method of preparing a phosphonium compound, and a semiconductor device encapsulated with the epoxy resin composition, the compound being represented by Formula 1:
Abstract translation: 鏻化合物，环氧树脂组合物，鏻化合物的制备方法以及用环氧树脂组合物包封的半导体器件，由式1表示的化合物：
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