公开(公告)号：US20240222174A1

公开(公告)日：2024-07-04

申请号：US18395570

申请日：2023-12-24

Applicant: SEMES CO., LTD.

Inventor： Seul Gi CHOI ,  Jun Hyun LIM ,  Young Jin JANG ,  Eun Jung LEE ,  Hee Jun YOUN ,  Gui Su PARK

IPC: H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67712 ,  H01L21/67057 ,  H01L21/67706

Abstract: Proposed is a substrate transferring apparatus, and a liquid processing apparatus and substrate processing equipment including the same, which prevent a pattern leaning phenomenon during a substrate processing process. The substrate transferring apparatus that transfers substrates between cleaning tanks in the batch-type liquid processing apparatus includes a rail extended on a ceiling of a first cleaning tank in which a first processing liquid is stored and a second cleaning tank in which a second processing liquid is stored, a crane moving along the rail, and a vessel configured to be moved vertically by the crane. The vessel may include a first sub vessel and a second sub vessel that combine with each other to form a space for accommodating a substrate immersed in the first processing liquid.

公开(公告)号：US20240217114A1

公开(公告)日：2024-07-04

申请号：US18343774

申请日：2023-06-29

Applicant: SEMES CO., LTD.

Inventor： Hee Jun YOUN ,  Jun Young CHOI

IPC: B25J11/00 ,  B25J15/00

CPC classification number: B25J11/0095 ,  B25J11/0085 ,  B25J15/0028 ,  B25J15/009

Abstract: The inventive concept provides a substrate transfer robot. The substrate transfer robot includes a fastening body; a support body protruding to a front from the fastening body, and supporting a bottom surface of the substrate if the substrate is positioned in a first posture; a gripper member coupled to the fastening body and relatively movable with respect to the support body; and a gripper driver moving the gripper member between a first position and a second position, and wherein the gripper member includes: a first gripper positioned at a side of the support body; and a second gripper positioned at another side of the support body, and wherein an alignment pin for aligning a position of the substrate is installed at the support body, and if a position at which the substrate is aligned with the support body is referred to as a reference position, the first position is a position at which the first gripper and the second gripper contact a substrate positioned at the reference position to grip the substrate, and the second position is a position at which the first gripper and the second gripper are spaced apart from the substrate positioned at the reference position, and the first posture is a posture that a top surface of the substrate is horizontal to the ground.

公开(公告)号：US20240203761A1

公开(公告)日：2024-06-20

申请号：US18391599

申请日：2023-12-20

Applicant: SEMES CO., LTD.

Inventor： Jun Young CHOI ,  Gui Su PARK ,  Young Jin JANG ,  Eun Jung LEE ,  Hee Jun YOUN

IPC: H01L21/67

CPC classification number: H01L21/67086 ,  H01L21/67057

Abstract: There are provided a substrate treating apparatus and method for etch rate deviation improvement. The substrate treating apparatus includes: a treating bath providing space for receiving a substrate treating solution for treating substrates; a treating solution source providing the substrate treating solution into the treating bath such that the substrates are immersed and treated in the substrate treating solution; and a bubble generation module connected to the treating bath and generating bubbles in the substrate treating solution by injecting gas.