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公开(公告)号：US20230068295A1
公开(公告)日：2023-03-02
申请号：US17870840
申请日：2022-07-22
Applicant: SEMES CO., LTD.
Inventor： Sung Ho KIM , Yoon Ok Jang , Bo Yeon Hwang , Hyun Min Lee , Kwang Jun Choi
Abstract: A substrate processing apparatus and a substrate processing method are provided, which can improve the yield by minimizing the occurrence of stains. The substrate processing method includes forming on the substrate a plurality of ink patterns spaced apart from each other by jetting ink onto the substrate by using a plurality of nozzles, calculating the density of each of the plurality of ink patterns, and selecting at least one nozzle for jetting ink into one pixel area based on respectively calculated densities of the plurality of ink patterns.
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Patent Agency Ranking
2.发明授权公开(公告)号：US11787171B2
公开(公告)日：2023-10-17
申请号：US17337967
申请日：2021-06-03
Applicant: SEMES CO., LTD.
Inventor： Sung Ho Kim , Yoon Ok Jang , Hyun Min Lee , Jun Seok Lee , Kwang Jun Choi
CPC classification number: B41J2/04505 , B41J2/04508 , B41J2/04551 , B41J2/04558 , B41J3/407
Abstract: An ink impact point correction apparatus for automatically measuring and correcting an impact point of ink using a pattern on a substrate, on which a coordinate system is displayed, and a substrate treating system including the same are provided. The ink impact point correction apparatus includes a recognition unit for acquiring information on the impact point of ink at a plurality of points located on a substrate; and a correction unit for correcting a position of an ink discharge point on the substrate based on the information on the impact point, wherein a coordinate pattern in the form of a coordinate system is formed at the plurality of points.
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公开(公告)号：US11867999B2
公开(公告)日：2024-01-09
申请号：US17405667
申请日：2021-08-18
Applicant: SEMES CO., LTD.
Inventor： Jun Seok Lee , Yoon-Ok Jang , Sung Ho Kim , Kwang Jun Choi , Hyun Min Lee
IPC: G02F1/1335
CPC classification number: G02F1/133514 , G02F1/133516 , B41J2202/09
Abstract: A color filter is provided. The color filter includes a substrate, a bank formed on a substrate to partition a plurality of pixel units into each other, a plurality of first structures formed on the pixel unit, and having a width narrower than a width of the pixel unit, and a height lower than a height of the bank, and an ink film filled in the pixel unit and having a height higher than the height of the first structures.
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公开(公告)号：US11707944B2
公开(公告)日：2023-07-25
申请号：US17407936
申请日：2021-08-20
Applicant: SEMES CO., LTD.
Inventor： Jun Seok Lee , Yoon-Ok Jang , Sung Ho Kim , Kwang Jun Choi , Hyun Min Lee
CPC classification number: B41M7/0018 , B41M1/34
Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus may include a stage including an accommodation area, onto or from which a substrate is loaded or unloaded, and a treatment area, in which the substrate is treated, a liquid discharge head that supplies a treatment liquid to the substrate, and a liquid receiving part that receives the treatment liquid pre-discharged by the liquid discharge head in the treatment area.
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公开(公告)号：US12011934B2
公开(公告)日：2024-06-18
申请号：US17870840
申请日：2022-07-22
Applicant: SEMES CO., LTD.
Inventor： Sung Ho Kim , Yoon Ok Jang , Bo Yeon Hwang , Hyun Min Lee , Kwang Jun Choi
CPC classification number: B41J2/2054 , B41J2/2132 , B41J2/2142
Abstract: A substrate processing apparatus and a substrate processing method are provided, which can improve the yield by minimizing the occurrence of stains. The substrate processing method includes forming on the substrate a plurality of ink patterns spaced apart from each other by jetting ink onto the substrate by using a plurality of nozzles, calculating the density of each of the plurality of ink patterns, and selecting at least one nozzle for jetting ink into one pixel area based on respectively calculated densities of the plurality of ink patterns.
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6.发明申请公开(公告)号：US20220009224A1
公开(公告)日：2022-01-13
申请号：US17337967
申请日：2021-06-03
Applicant: SEMES CO., LTD.
Inventor： Sung Ho Kim , Yoon Ok Jang , Hyun Min Lee , Jun Seok Lee , Kwang Jun Choi
IPC: B41J2/045
Abstract: An ink impact point correction apparatus for automatically measuring and correcting an impact point of ink using a pattern on a substrate, on which a coordinate system is displayed, and a substrate treating system including the same are provided. The ink impact point correction apparatus includes a recognition unit for acquiring information on the impact point of ink at a plurality of points located on a substrate; and a correction unit for correcting a position of an ink discharge point on the substrate based on the information on the impact point, wherein a coordinate pattern in the form of a coordinate system is formed at the plurality of points.
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