公开(公告)号：US20230203672A1

公开(公告)日：2023-06-29

申请号：US18146489

申请日：2022-12-27

Applicant: SEMES CO., LTD.

Inventor： Jun Kil HWANG ,  Min Jung KIM ,  Hee Hwan KIM ,  Seong Soo LEE

IPC: C23F1/46 ,  B08B3/02 ,  B08B3/08 ,  B08B3/04

CPC classification number: C23F1/46 ,  B08B3/022 ,  B08B3/08 ,  B08B3/041 ,  B08B2203/007 ,  H01L21/02057

Abstract: Disclosed is a method of adjusting a concentration of a chemical liquid in a treatment liquid, the method including: treating a substrate by supplying a treatment liquid stored in a main tank from a nozzle in a heated state to the substrate, and recovering the treatment liquid used in the treatment of the substrate to the main tank directly or via still another tank, and then reusing the recovered treatment liquid, a concentration adjustment operation of adjusting a concentration of the treatment liquid in the main tank is performed in a standby time period in which the substrate is not treated with the treatment liquid, and the concentration adjustment operation is performed by discharging the treatment liquid in a heated state from the nozzle to evaporate a part of the diluting solution, and recovering the discharged treatment liquid to the main tank.

公开(公告)号：US20250069897A1

公开(公告)日：2025-02-27

申请号：US18769749

申请日：2024-07-11

Applicant: SEMES CO., LTD.

Inventor： Min Jung KIM ,  Moon Sik CHOI

IPC: H01L21/3213 ,  H01L21/67

Abstract: Disclosed is a substrate processing apparatus including: a support unit for supporting a substrate and rotating the substrate; a solution discharge unit for discharging a processing solution including a first material and a second material onto the substrate to remove a film on the substrate; and a controller for controlling the solution discharge unit, in which the controller sets, when the solution discharge unit discharges the processing solution to a first position and a second position on the substrate, a hydrogen ion concentration of the processing solution discharged to the first position to be different from a hydrogen ion concentration of the processing solution discharged to the second position, and the first position is a center of the substrate or is located closer to the center of the substrate than the second position.

公开(公告)号：US20240153792A1

公开(公告)日：2024-05-09

申请号：US18387713

申请日：2023-11-07

Applicant: SEMES CO., LTD. ,  SAMSUNG ELECTRONICS CO., LTD.

Inventor： Min Jung KIM ,  Jin Ah HAN ,  Hee Hwan KIM ,  Yong Hoon HONG ,  Kyoung Suk KIM ,  Jong Hyeok PARK ,  Jin Hyung PARK ,  Dae Hyuk CHUNG ,  Ji Hoon CHA

IPC: H01L21/67 ,  H01L21/306

CPC classification number: H01L21/6708 ,  H01L21/30604

Abstract: An apparatus and method for processing a substrate can reduce the concentration of process by-products in a chemical solution. The apparatus includes a substrate rotating device configured to rotate a seated substrate in a spinning manner, a chemical solution supply device configured to supply a chemical solution to the substrate, a chemical solution discharge line configured to discharge the chemical solution having undergone a process to an outside, a chemical solution circulation line configured to circulate the chemical solution having undergone the process to the chemical solution supply device, and a discharged chemical solution selection device configured to discharge a chemical solution containing a first amount of process by-products to the outside through the chemical solution discharge line and to circulate a chemical solution containing a second amount of process by-products through the chemical solution circulation line, wherein the first amount of process by-products is larger than the second amount of process by-products.

公开(公告)号：US20230366100A1

公开(公告)日：2023-11-16

申请号：US18298416

申请日：2023-04-11

Applicant: SEMES CO., LTD.

Inventor： Min Jung KIM ,  Seong Soo LEE ,  Jun Kil HWANG

IPC: C23F1/08

CPC classification number: C23F1/08

Abstract: A substrate processing apparatus includes a substrate processing unit for processing a substrate by discharging a chemical liquid to the substrate; a chemical storage unit connected to the substrate processing unit by a chemical liquid supply line and a chemical liquid recovery line; and a liquid replenishment unit including an evaporation measurement member for measuring the amount of evaporation of water contained in the chemical liquid, and a water supply member for supplying water to the chemical liquid.