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公开(公告)号:US20240145263A1
公开(公告)日:2024-05-02
申请号:US18099856
申请日:2023-01-20
Applicant: SEMES CO., LTD.
Inventor: Seung Hoon OH , Ki Bong KIM , Jong Doo LEE , Young Hun LEE , Mi So PARK , Jin Se PARK , Yong Sun KO
IPC: H01L21/67
CPC classification number: H01L21/67034
Abstract: According to an aspect of the present disclosure, there is provided a substrate treating apparatus comprising: a vessel part having a substrate treatment region formed therein and including a supply port through which a treating fluid is supplied to the substrate treatment region and an exhaust port through which the treating fluid is exhausted from the substrate treatment region; a fluid supply unit configured to supply the treating fluid to the substrate treatment region; an exhaust unit configured to exhaust the treating fluid from the vessel part. The exhaust unit comprises: a main line connected to the exhaust port; an extension line branched from at least one of first and second nodes of the main line and including at least one of a first orifice or a first check valve to control an exhaust speed; and an auxiliary line branched from a third node of the main line, where an orifice and a check valve are not formed. During a first process time, the treating fluid is discharged through the extension line, and the treating fluid is not discharged through the auxiliary line, and during a second process time, the treating fluid is discharged through the auxiliary line.
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公开(公告)号:US20240142171A1
公开(公告)日:2024-05-02
申请号:US18099388
申请日:2023-01-20
Applicant: SEMES CO., LTD.
Inventor: Seung Hoon OH , Ji Hyeong LEE , Jin Se PARK , Yong Joon IM , Young Hun LEE , Yong Sun KO
CPC classification number: F26B5/005 , F26B21/10 , F26B25/003 , F26B25/16 , G03F7/168
Abstract: A substrate treating apparatus of the present disclosure comprises: a chamber member having an accommodation space configured to accommodate a vessel part where a substrate treatment region constituting a supercritical treatment space are formed, and an opening configured to move the substrate inside or outside; a shutter configured to open or close the chamber member; and a first exhaust part configured to discharge an internal air from the accommodation space to the outside, wherein the temperature of the substrate treatment region is increased.
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公开(公告)号:US20230147919A1
公开(公告)日:2023-05-11
申请号:US17980995
申请日:2022-11-04
Applicant: SEMES CO., LTD.
Inventor: Gui Su PARK , Jun Young CHOI , Young Jin JANG , Yong Sun KO , Kyu Hwan CHANG , Jun Hyun LIM
IPC: H01L21/677 , H01L21/687 , B08B3/08 , B08B13/00 , G03F7/20 , F26B5/00
CPC classification number: H01L21/67718 , H01L21/68707 , B08B3/08 , B08B13/00 , G03F7/2043 , F26B5/005 , B25J11/0095
Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a first process treating unit configured to treat a substrate in a single-type method; a second process treating unit configured to treat a substrate in a batch-type method; and a posture changing unit provided between the first process treating unit and the second process treating unit and configured to change a posture of the substrate between a vertical posture and a horizontal posture, and wherein the substrate is loaded to and unloaded from the first process treating unit.
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公开(公告)号:US20230110780A1
公开(公告)日:2023-04-13
申请号:US17960392
申请日:2022-10-05
Applicant: SEMES CO., LTD.
Inventor: Jun Young CHOI , Yong Sun KO , Jun Hyun LIM , Gui Su PARK , Young Jin JANG
IPC: H01L21/677 , H01L21/67 , H01L21/683
Abstract: The present invention provides an apparatus for treating a substrate, the apparatus including: a processing tank having an accommodation space in which a processing liquid is accommodated; a support member for supporting at least one substrate in the receiving space in a vertical posture; and a posture changing robot for changing a posture of the substrate in a state of being immersed in the liquid state from the vertical posture to a horizontal posture, in which wherein the posture changing robot includes: a hand configured to grip the substrate; and an arm for moving the hand.
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公开(公告)号:US20230339790A1
公开(公告)日:2023-10-26
申请号:US17985038
申请日:2022-11-10
Applicant: SEMES CO., LTD.
Inventor: Myung A JEON , Young Seop CHOI , Bok Kyu LEE , Kyu Hwan CHANG , Yong Sun KO
IPC: C02F1/78
CPC classification number: C02F1/78 , C02F2301/08 , C02F2305/023 , C02F2103/346
Abstract: Provided are an ozone water decomposition apparatus and method that can decompose ozone water quickly and stably. The ozone water decomposition apparatus, comprising: a tank configured to accommodate ozone water and decompose the ozone water; a first supply unit configured to supply the ozone water to the tank; a second supply unit configured to supply an additive to the tank wherein the additive is supplied by a preset first or second supply amount; a circulation line configured to circulate the ozone water in the tank; and a concentration meter installed in the circulation line, wherein the ozone water decomposition apparatus comprises: after circulating the ozone water using the circulation line, measuring an ozone concentration of the ozone water using the concentration meter; subsequently supplying the additive of the first supply amount or the second supply amount based on the measured ozone concentration of the ozone water; and subsequently circulating the ozone water until the ozone concentration of the ozone water reaches a preset reference concentration.
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公开(公告)号:US20230201884A1
公开(公告)日:2023-06-29
申请号:US18068917
申请日:2022-12-20
Applicant: SEMES CO, LTD.
Inventor: Yong Hyun CHOI , Young Hun LEE , Seung Hoon OH , Mi So PARK , Tae Jong CHOI , Yong Sun KO , Jin Woo JUNG
CPC classification number: B08B3/022 , F26B5/005 , H01L21/02057
Abstract: The present invention provides a method for treating a substrate. The method for treating a substrate comprises: treating the substrate with liquid; and drying the liquid-treated substrate, and the liquid treatment step includes: a first liquid supply step of supplying a first liquid to an upper surface of the rotating substrate; and a second liquid supply step of supplying a second liquid to an upper surface of the rotating substrate, and in the second liquid supply step, a rotation speed of the substrate is adjusted such that the second liquid supplied on the substrate flows from a central region of the substrate to an edge region of the substrate.
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