公开(公告)号：US20240042493A1

公开(公告)日：2024-02-08

申请号：US18219588

申请日：2023-07-07

Applicant: SEMES CO., LTD.

Inventor： Myung A. JEON ,  Young Seop Choi ,  Young Jin Kim ,  Eun Hyeok Choi ,  Bok Kyu Lee ,  Je Myung Cha ,  Kyu Hwan Chang

IPC: B08B3/02 ,  B08B3/08

CPC classification number: B08B3/022 ,  B08B3/024 ,  B08B3/08

Abstract: A spray unit in which a plurality of nozzle heads are integrally coupled and a substrate treatment apparatus including the spray unit are provided. The substrate treatment apparatus includes: a substrate support unit supporting a substrate and including a spin head, which rotates the substrate; a treatment liquid retrieval unit retrieving substrate treatment liquids used in treating the substrate; and a spray unit including a plurality of nozzle heads and pipes, which are connected to the nozzle heads, and providing the substrate treatment liquids onto the substrate through the nozzle heads and the pipes, wherein the nozzle heads are moved at the same time.

公开(公告)号：US11511321B2

公开(公告)日：2022-11-29

申请号：US16662020

申请日：2019-10-23

Applicant: SEMES CO., LTD.

Inventor： Young Jin Kim ,  Jin Tack Yu ,  Bu Young Jung ,  Byung Sun Bang ,  Seung Hoon Oh ,  Young Jun Choi ,  Jong Hyeon Woo

IPC: B08B3/04 ,  H01L21/67 ,  H01L21/02

Abstract: A substrate processing method includes forming a high surface tension liquid film by supplying high surface tension liquid on a substrate surface, replacing the high surface tension liquid film with low surface tension liquid by supplying the low surface tension liquid to a center area of a substrate so that the low surface tension liquid impinges on the high surface tension liquid film formed on the center area of the substrate, and supplying high surface tension liquid for a predetermined period of time during the supplying the low surface tension liquid.

公开(公告)号：US20240050990A1

公开(公告)日：2024-02-15

申请号：US18169630

申请日：2023-02-15

Applicant: SEMES CO., LTD.

Inventor： Do Hyung Kim ,  Dae Hun Kim ,  Young Jin Kim ,  Tae Ho Kang ,  Jun Gwon Lee ,  Young Joon Han ,  Eun Hyeok Choi

IPC: B08B1/00 ,  H01L21/67 ,  B08B3/02 ,  A46B9/00 ,  A46B9/02 ,  A46D1/00

CPC classification number: B08B1/002 ,  H01L21/67046 ,  B08B3/02 ,  A46B9/005 ,  A46B9/02 ,  A46D1/0207 ,  A46B2200/3073

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing having a treating space; a support unit configured to support a substrate in the treating space; and a brush unit configured to clean the substrate supported on the support unit, and wherein the brush unit includes: a body having a circular-shaped cross-section; and a plurality of contact pads protruding from the body and defining a plurality of groove portions for discharging foreign substances dropped from a substrate, each groove portion defined between adjacent contact pads, and wherein a width of the groove portion near a center of the body is different from a width of the groove portion near an edge of the body.

公开(公告)号：US11361962B2

公开(公告)日：2022-06-14

申请号：US16673267

申请日：2019-11-04

Applicant: SEMES CO., LTD.

Inventor： Seung Hoon Oh ,  Jin Tack Yu ,  Bu Young Jung ,  Byung Sun Bang ,  Young Jin Kim ,  Young Jun Choi ,  Jong Hyeon Woo

IPC: H01L21/02 ,  G03F7/16 ,  H01L21/687 ,  H01L21/67

Abstract: An embodiment of the present invention provides a substrate processing method. The substrate processing method, which performs a liquid processing process by injecting a processing liquid on a substrate on a spin chuck disposed inside a plurality of recovery cups that are disposed in multiple layers, includes: in a transitional period of time in which height change of any one of the recovery cups occurs, adjusting rotational speed of the spin chuck, which is configured to support the substrate, in conjunction with the height change of the recovery cup.