公开(公告)号：US10825699B2

公开(公告)日：2020-11-03

申请号：US16224891

申请日：2018-12-19

Applicant: SEMES CO., LTD.

Inventor： Buyoung Jung ,  Jonghan Kim ,  Young Jin Jang ,  Jin Tack Yu ,  Youngjun Choi ,  Daehun Kim ,  Byungsun Bang ,  Jonghyeon Woo ,  Heehwan Kim ,  Cheol-Yong Shin ,  Gui Su Park

IPC: H01L21/67 ,  H01L21/683

Abstract: Disclosed are a standby port and a substrate processing apparatus having the same. The standby port exhausts fumes generated when a processing liquid is discharged into the standby port before the supply of the processing liquid onto a substrate, thereby preventing pollution of a chamber atmosphere.

公开(公告)号：US10758875B2

公开(公告)日：2020-09-01

申请号：US15856197

申请日：2017-12-28

Applicant: SEMES CO., LTD.

Inventor： Byungsun Bang ,  Jin Tack Yu ,  Youngjun Choi ,  Jonghan Kim ,  Young Jin Jang

IPC: B01F3/22 ,  B08B3/08 ,  H01L21/67 ,  B01F3/08 ,  B08B3/02 ,  B08B3/10 ,  B05B1/34 ,  B01F5/00 ,  B05B7/04

Abstract: Disclosed are an apparatus and a method for liquid-treating a substrate. The substrate treating apparatus includes a liquid supply unit configured to supply a treatment liquid in which a first liquid and a second liquid are mixed, onto the substrate unit, wherein the liquid supply unit includes a nozzle configured to discharge the treatment liquid, a first liquid supply line supplying the first liquid to the nozzle, and a second liquid supply supplying the second liquid to the nozzle, and the nozzle includes a body having a mixing space in which the first liquid and the second liquid are mixed and a buffer space extending from the mixing space, in the interior thereof, and a collision member located in the buffer space and configured to decrease a flow velocity of the treatment liquid supplied to the buffer space.

公开(公告)号：US11361962B2

公开(公告)日：2022-06-14

申请号：US16673267

申请日：2019-11-04

Applicant: SEMES CO., LTD.

Inventor： Seung Hoon Oh ,  Jin Tack Yu ,  Bu Young Jung ,  Byung Sun Bang ,  Young Jin Kim ,  Young Jun Choi ,  Jong Hyeon Woo

IPC: H01L21/02 ,  G03F7/16 ,  H01L21/687 ,  H01L21/67

Abstract: An embodiment of the present invention provides a substrate processing method. The substrate processing method, which performs a liquid processing process by injecting a processing liquid on a substrate on a spin chuck disposed inside a plurality of recovery cups that are disposed in multiple layers, includes: in a transitional period of time in which height change of any one of the recovery cups occurs, adjusting rotational speed of the spin chuck, which is configured to support the substrate, in conjunction with the height change of the recovery cup.

公开(公告)号：US11511321B2

公开(公告)日：2022-11-29

申请号：US16662020

申请日：2019-10-23

Applicant: SEMES CO., LTD.

Inventor： Young Jin Kim ,  Jin Tack Yu ,  Bu Young Jung ,  Byung Sun Bang ,  Seung Hoon Oh ,  Young Jun Choi ,  Jong Hyeon Woo

IPC: B08B3/04 ,  H01L21/67 ,  H01L21/02

Abstract: A substrate processing method includes forming a high surface tension liquid film by supplying high surface tension liquid on a substrate surface, replacing the high surface tension liquid film with low surface tension liquid by supplying the low surface tension liquid to a center area of a substrate so that the low surface tension liquid impinges on the high surface tension liquid film formed on the center area of the substrate, and supplying high surface tension liquid for a predetermined period of time during the supplying the low surface tension liquid.

公开(公告)号：US10699918B2

公开(公告)日：2020-06-30

申请号：US15484377

申请日：2017-04-11

Applicant: SEMES CO., LTD.

Inventor： Buyoung Jung ,  Jin Tack Yu ,  Gil Hun Song ,  Sun Yong Park

IPC: H01L21/67 ,  B05B1/14 ,  B08B3/08

Abstract: Provided is a substrate treating apparatus. The substrate treating apparatus comprises: a housing having a treating space therein; a spin head for supporting and rotating a substrate in the treating space; and a chemical supply unit having an injection nozzle for supplying a chemical to the substrate which is supported by the spin head, wherein the injection nozzle comprises a nozzle body, and wherein the nozzle body comprises an inner space for receiving a chemical and minute holes which are connected with the inner space for discharging the chemicals to downward.

公开(公告)号：US20180337070A1

公开(公告)日：2018-11-22

申请号：US15979956

申请日：2018-05-15

Applicant: SEMES CO., LTD.

Inventor： Byungsun Bang ,  Buyoung Jung ,  Jungbong Choi ,  Bong Joo Kim ,  Youngil Lee ,  Gil Hun Song ,  Gui Su Park ,  Kwang Ryul Kim ,  Kwang-Seop Lee ,  Jin Tack Yu

IPC: H01L21/67 ,  H01L21/02 ,  B08B7/00 ,  B08B3/04 ,  B08B3/08 ,  B08B7/04 ,  C03C23/00 ,  B23K26/402

CPC classification number: H01L21/67028 ,  B08B3/041 ,  B08B3/08 ,  B08B7/0042 ,  B08B7/04 ,  B23K26/402 ,  C03C23/0025 ,  H01L21/0206 ,  H01L21/0217

Abstract: Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating method includes removing a portion of the thin film by irradiating a laser to the substrate, and after the removing of the portion of the thin film, removing the remaining portion of the thin film by supplying a chemical to the substrate.