公开(公告)号：US12183818B2

公开(公告)日：2024-12-31

申请号：US17417677

申请日：2019-12-23

Applicant: SOUTHEAST UNIVERSITY ,  CSMC TECHNOLOGIES FAB2 CO., LTD.

Inventor： Weifeng Sun ,  Rongcheng Lou ,  Kui Xiao ,  Feng Lin ,  Jiaxing Wei ,  Sheng Li ,  Siyang Liu ,  Shengli Lu ,  Longxing Shi

IPC: H01L29/78 ,  H01L21/04 ,  H01L29/10 ,  H01L29/16 ,  H01L29/66

Abstract: A power semiconductor device includes: a substrate; drain metal; a drift region; a base region; a gate structure; a first conductive type doped region contacting the base region on the side of the base region distant from the gate structure; a source region provided in the base region and between the first conductive type doped region and the gate structure; contact metal that is provided on the first conductive type doped region and forms a contact barrier having rectifying characteristics together with the first conductive type doped region below; and source metal wrapping the contact metal and contacting the source region.

公开(公告)号：US11515395B2

公开(公告)日：2022-11-29

申请号：US17624336

申请日：2020-09-25

Applicant: SOUTHEAST UNIVERSITY ,  CSMC TECHNOLOGIES FAB2 CO., LTD

Inventor： Siyang Liu ,  Ningbo Li ,  Dejin Wang ,  Kui Xiao ,  Chi Zhang ,  Sheng Li ,  Xinyi Tao ,  Weifeng Sun ,  Longxing Shi

IPC: H01L29/872 ,  H01L29/20 ,  H01L29/66 ,  H01L21/02 ,  H01L29/06 ,  H01L29/861

Abstract: A gallium nitride power device, including: a gallium nitride substrate; cathodes; a plurality of gallium nitride protruding structures arranged on the gallium nitride substrate and between the cathodes, a groove is formed between adjacent gallium nitride protruding structures; an electron transport layer, covering a top portion and side surfaces of each of the gallium nitride protruding structures; a gallium nitride layer, arranged on the electron transport layer and filling each of the grooves; a plurality of second conductivity type regions, where each of the second conductivity type regions extends downward from a top portion of the gallium nitride layer into one of the grooves, and the top portion of each of the gallium nitride protruding structures is higher than a bottom portion of each of the second conductivity type regions; and an anode, arranged on the gallium nitride layer and the second conductivity type regions.

公开(公告)号：US11322606B2

公开(公告)日：2022-05-03

申请号：US16969437

申请日：2019-10-21

Applicant: SOUTHEAST UNIVERSITY

Inventor： Weifeng Sun ,  Siyang Liu ,  Sheng Li ,  Chi Zhang ,  Xinyi Tao ,  Ningbo Li ,  Longxing Shi

IPC: H01L29/778

Abstract: A heterojunction semiconductor device comprises a substrate; a second barrier layer is disposed on the second channel layer and a second channel is formed; a trench gate structure is disposed in the second barrier layer; the trench gate structure is embedded into the second barrier layer and is composed of a gate medium and a gate metal located in the gate medium; an isolation layer is disposed in the second channel layer and separates the second channel layer into an upper layer and a lower layer; a first barrier layer is disposed between the lower layer of the second channel layer and the first channel layer and a first channel is formed; a bottom of the metal drain is flush with a bottom of the first barrier layer; and a first metal source is disposed between the second metal source and the first channel layer.

公开(公告)号：US12027516B1

公开(公告)日：2024-07-02

申请号：US18568277

申请日：2022-12-29

Applicant: SOUTHEAST UNIVERSITY

Inventor： Siyang Liu ,  Sheng Li ,  Chi Zhang ,  Weifeng Sun ,  Mengli Liu ,  Yanfeng Ma ,  Longxing Shi

IPC: H01L29/778 ,  H01L27/06 ,  H01L29/20 ,  H01L49/02

CPC classification number: H01L27/0629 ,  H01L28/20 ,  H01L29/2003 ,  H01L29/7786 ,  H01L29/7787

Abstract: A GaN power semiconductor device integrated with a self-feedback gate control structure comprises a substrate, a buffer layer, a channel layer and a barrier layer. A gate control area is formed by a first metal source electrode, a first P-type GaN cap layer, a first metal gate electrode, a first metal drain electrode, a second P-type GaN cap layer and a second metal gate electrode. An active working area is formed by the first metal source electrode, a third P-type GaN cap layer, a third metal gate electrode, a second metal drain electrode, the second P-type GaN cap layer and a second metal source electrode. The overall gate leaking current of the device is regulated by the gate control area, the integration level is high, the parasitic effect is small, and the charge-storage effect can be effectively relieved, thus improving the threshold stability of the device.

公开(公告)号：US11158708B1

公开(公告)日：2021-10-26

申请号：US16486494

申请日：2018-09-25

Applicant: SOUTHEAST UNIVERSITY

Inventor： Weifeng Sun ,  Siyang Liu ,  Lizhi Tang ,  Sheng Li ,  Chi Zhang ,  Jiaxing Wei ,  Shengli Lu ,  Longxing Shi

IPC: H01L29/16 ,  H01L29/78 ,  H01L29/06

Abstract: The invention provides a graphene channel silicon carbide power semiconductor transistor, and its cellular structure thereof. Characterized in that, a graphene strip serving as a channel is embedded in a surface of the P-type body region and two ends of the graphene strip are respectively contacted with a boundary between the N+-type source region and the P-type body region and a boundary between the P-type body region and the N-type drift region, and the graphene strip is distributed in a cellular manner in a gate width direction, a conducting channel of a device is still made of graphene; in the case of maintaining basically invariable on-resistance and current transmission capacity, the P-type body regions are separated by the graphene strip, thus enhancing a function of assisting depletion, which further reduces an overall off-state leakage current of the device, and improves a breakdown voltage.