Abstract:
A capacitive sensor for monitoring stresses acting in a construction structure and having a multi-layer structure provided with an upper conductive layer defining an upper outer surface of the sensor. A lower conductive layer defines a lower outer surface. At least a first structural layer of insulating material is in contact with the upper conductive layer and at least a second structural layer of insulating material is in contact with the lower conductive layer. At least a first plate layer of conductive material and at least a second plate layer, of conductive material, and at least one dielectric layer is interposed between the first plate layer and the second plate layer to define at least one detection capacitor inside the multi-layer structure of the sensor. The upper and lower conductive layers jointly defining an electromagnetic screen for screening the detection capacitor against electromagnetic interference originating from outside the capacitive sensor.
Abstract:
A capacitive sensor for monitoring stresses acting in a construction structure and having a multi-layer structure provided with an upper conductive layer defining an upper outer surface of the sensor. A lower conductive layer defines a lower outer surface. At least a first structural layer of insulating material is in contact with the upper conductive layer and at least a second structural layer of insulating material is in contact with the lower conductive layer. At least a first plate layer of conductive material and at least a second plate layer, of conductive material, and at least one dielectric layer is interposed between the first plate layer and the second plate layer to define at least one detection capacitor inside the multi-layer structure of the sensor. The upper and lower conductive layers jointly defining an electromagnetic screen for screening the detection capacitor against electromagnetic interference originating from outside the capacitive sensor.
Abstract:
An apparatus and method are disclosed to implement digital signal processing operations involving multiply-accumulate (MAC) operations, by using a modified balanced data structure and accessing architecture. This architecture maintains a data-path connecting one address generation unit, one register file and one MAC execution unit. The register file has a hierarchical grouping organization of individual registers, which reduces bubble cycles caused by memory misalignments. This architecture uses parallel execution and can achieve two or more MAC operations per cycle.
Abstract:
An apparatus and method are disclosed to implement digital signal processing operations involving multiply-accumulate (MAC) operations, by using a modified balanced data structure and accessing architecture. This architecture maintains a data-path connecting one address generation unit, one register file and one MAC execution unit. The register file has a hierarchical grouping organization of individual registers, which reduces bubble cycles caused by memory misalignments. This architecture uses parallel execution and can achieve two or more MAC operations per cycle.
Abstract:
Embodiments are directed towards a system on chip (SoC) that implements a deep convolutional network heterogeneous architecture. The SoC includes a system bus, a plurality of addressable memory arrays coupled to the system bus, at least one applications processor core coupled to the system bus, and a configurable accelerator framework coupled to the system bus. The configurable accelerator framework is an image and deep convolutional neural network (DCNN) co-processing system. The SoC also includes a plurality of digital signal processors (DSPs) coupled to the system bus, wherein the plurality of DSPs coordinate functionality with the configurable accelerator framework to execute the DCNN.
Abstract:
A stress sensor formed by a membrane plate; a first bonding region arranged on top of the membrane plate; a cover plate arranged on top of the first bonding region, the first bonding region bonding the membrane plate to the cover plate; three-dimensional piezoresistive elements extending across the membrane plate that are embedded in the bonding layer; and planar piezoresistive elements that extend across the membrane plate and are surrounded by and separated from the bonding layer.
Abstract:
Apparatus and method for a modified, balanced throughput data-path architecture is given for efficiently implementing the digital signal processing algorithms of filtering, convolution and correlation in computer hardware, in which both data and coefficient buffers can be implemented as sliding windows. This architecture uses a multiplexer and a data path branch from the Address Generator unit to the multiply-accumulate execution unit. By selecting between the data path of Address Generator to execution unit and the data path of register to execution unit, the unbalanced throughput and multiply-accumulate bubble cycles caused by misaligned addressing on coefficients can be overcome. The modified balanced throughput data-path architecture can achieve a high multiply-accumulate operation rate per cycle in implementing digital signal processing algorithms.
Abstract:
A register file organization is used to support multiple accesses from more than one processor or pipeline. This shared register file is organized for a multiple processor device that includes a high performance (HP) and a low power (LP) core. The shared register file includes separate HP and LP storage units coupled to separate HP and LP write and read ports.