Abstract:
A relatively high-speed, high-efficiency CMOS two branch driver core that may operate under relatively low supply voltage may include thin oxide CMOS transistors configured to generate rail-to-rail output swings larger than twice a supply voltage and without exceeding safe operating area limits. Each of the two branches may include two stacked CMOS inverter pairs configured to drive a respective load capacitance coupled between respective CMOS inverter outputs, in phase opposition to the other branch. A pre-driver circuit input with a differential modulating signal may output two synchronous differential voltage drive signals of a swing of half of the supply voltage and DC-shifted by half of the supply voltage with respect to each other and that may be applied to the respective CMOS inverter inputs of the two branches.
Abstract:
An electrical-optical modulator may function at high data rates and may be realized in comparably low cost silicon base technology, typically in BJT, BiCMOS or CMOS technologies. The output signal path may include a high transition frequency BJT and by using an active load constituted by a MOS driven by an inverted version of the modulating signal that drives the BJT, the falling edge of the output signal is sped up.
Abstract:
A relatively high-speed, high-efficiency CMOS two branch driver core that may operate under relatively low supply voltage may include thin oxide CMOS transistors configured to generate rail-to-rail output swings larger than twice a supply voltage and without exceeding safe operating area limits. Each of the two branches may include two stacked CMOS inverter pairs configured to drive a respective load capacitance coupled between respective CMOS inverter outputs, in phase opposition to the other branch. A pre-driver circuit input with a differential modulating signal may output two synchronous differential voltage drive signals of a swing of half of the supply voltage and DC-shifted by half of the supply voltage with respect to each other and that may be applied to the respective CMOS inverter inputs of the two branches.
Abstract:
A modular hub driver architecture may include a multi-delay block configured to provide an enhanced delay match among N distinct stages of a distributed modulating electro-optical interface core. The electro-optical multi-core modulator driver may include an input impedance matching stage and a pre-conditioning circuit configured to generate a number M, an integer divisor of N, of delayed replicas of an electrical modulating signal. The electro-optical multi-core modulator may include an array of M launch buffers of the replica signals, and an array of M multi-delay blocks, each including delay circuit modules differently cascaded on distinct signal paths, and configured to receive, at respective inputs, the M replica signals and to output N/M differently delayed replicas of the input signals, each driving a correspondent output stage of one on the N electro-optical interface cores.
Abstract:
A device includes an optical resonator having four ports including a first port, a second port, a third port, and a fourth port. A first electronic circuit is configured to calculate a first information representative of a power difference between optical signals supplied by two of the four ports. A method of operating a device is also disclosed.
Abstract:
A device includes an optical resonator having four ports including a first port, a second port, a third port, and a fourth port. A first electronic circuit is configured to calculate a first information representative of a power difference between optical signals supplied by two of the four ports. A method of operating a device is also disclosed.
Abstract:
An intra-board chip-to-chip optical communications system has a high bit rate and high data throughput based on the use of a silicon photonic interposer. The system includes a multi-substrate electro-optical structure for communications with CMOS and/or BiCMOS IC chips of a PCB. The structure includes a multi-chip module primary substrate mounted over the supporting PCB. The multi-chip module primary substrate implements high frequency electrical interconnections between transceiver circuit chips, mounted on the silicon photonic interposer, and the IC chips.
Abstract:
An intra-board chip-to-chip optical communications system has a high bit rate and high data throughput based on the use of a silicon photonic interposer. The system includes a multi-substrate electro-optical structure for communications with CMOS and/or BiCMOS IC chips of a PCB. The structure includes a multi-chip module primary substrate mounted over the supporting PCB. The multi-chip module primary substrate implements high frequency electrical interconnections between transceiver circuit chips, mounted on the silicon photonic interposer, and the IC chips.
Abstract:
A differential or pseudo-differential TIA includes an auxiliary differential amplifier input transistor pair cross-coupled to the output nodes to cancel undesired output signal components. The advantages of a classical differential topology are retained while performance at a high data rate is significantly improved.
Abstract:
The differential trans-impedance amplifier uses trans-resistance(s) connected between the input nodes of a first differential amplifier, to implement a trans-impedance differential amplifier in a differential fashion and has two identical resistances, each connected between the photodiode and a respective DC voltage rail of a common bias network of the photodiode adapted to reverse bias the photodiode. The biasing resistances may be much larger than the trans-resistance(s) to prevent drawing any significant signal current from the photodiode. The amplifier may retain the advantages of a classical differential topology while effectively overcoming drawbacks that arise in high data rate applications.