公开(公告)号：US20170358847A1

公开(公告)日：2017-12-14

申请号：US15621687

申请日：2017-06-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Han-Min CHO ,  Chan-Gi Park ,  Yeon-Sang Yun ,  Tae-Wook Ham ,  Hei-Seong Kwak ,  Byoung-II Son ,  Sung-Chul Park

IPC: H01Q1/24 ,  H05K1/02 ,  H05K1/14 ,  H05K7/14 ,  H01R12/79 ,  H05K1/18 ,  H05K1/11 ,  H01R13/66 ,  H01Q1/38

Abstract: An electronic device including a housing; a printed circuit board (PCB) in the housing, wherein the PCB includes a plurality of layers with one or more conductive and insulation layers; a first electrical component formed as at least a part of or in the housing; a second electrical component above or near the PCB in the housing, wherein the first and second electrical components are separated; and at least one electrical path extending from the first electrical component to the second electrical component, wherein at least a portion of the electrical path runs on or inside the PCB, wherein the PCB includes a region including a pattern of conductive vias, wherein each of the vias extends through at least part of the plurality of layers to contact at least one of the one or more conductive layers, and wherein the electrical path runs through the region without contacting the vias.

公开(公告)号：US12218410B2

公开(公告)日：2025-02-04

申请号：US18459597

申请日：2023-09-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Han-Min Cho ,  Chan-Gi Park ,  Yeon-Sang Yun ,  Tae-Wook Ham ,  Hei-Seong Kwak ,  Byoung-Il Son ,  Sung-Chul Park

IPC: H05K1/02 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q5/35 ,  H01Q21/28 ,  H01R12/79 ,  H01R13/66 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K7/14

Abstract: Disclosed is a portable communication device including a housing; a first PCB; a wireless communication circuitry disposed on the first PCB; and a second PCB having a plurality of layers including a first PCB portion; a second PCB portion extended from the first PCB portion and more flexible than the first PCB portion; a third PCB portion extended from the second PCB portion and less flexible than the second PCB portion; a fourth PCB portion extended from the third PCB portion and more flexible than the third PCB portion; and a plurality of lines formed at a same layer of the plurality of layers as extended from the second PCB portion through the third PCB portion to the fourth PCB portion, the plurality of lines including a first ground line and a second ground line, and a first signal line between the first and second ground lines.

公开(公告)号：US11569565B2

公开(公告)日：2023-01-31

申请号：US17225509

申请日：2021-04-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Han-Min Cho ,  Chan-Gi Park ,  Yeon-Sang Yun ,  Tae-Wook Ham ,  Hei-Seong Kwak ,  Byoung-Il Son ,  Sung-Chul Park

IPC: H05K1/11 ,  H01Q1/24 ,  H01Q5/35 ,  H05K1/02 ,  H01Q21/28 ,  H01Q1/38 ,  H01R12/79 ,  H01R13/66 ,  H05K1/14 ,  H05K1/18 ,  H05K7/14

Abstract: Disclosed is an electronic device comprising a first component, a second component, and a signal path interface coupled between the first component and the second component, the signal path interface including a printed circuit board (PCB) having a rigid PCB portion and a flexible PCB portion, wherein a first signal line and a second signal line extend through the rigid PCB portion and the flexible PCB portion for transmitting signals from the first component to the second components, and a plurality of ground lines extend through the rigid PCB portion and the flexible PCB portion, and wherein each of the plurality of ground lines extending through the rigid PCB portion is connected to one or more conductive layers through conductive vias.

公开(公告)号：US10999921B2

公开(公告)日：2021-05-04

申请号：US16007268

申请日：2018-06-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chan-Gi Park ,  Yikyu Min ,  Han Min Cho ,  Yeonsang Yun ,  Tae-Wook Ham

IPC: H05K1/02 ,  H05K5/00 ,  H01Q1/22 ,  H01P3/08 ,  H01Q21/28 ,  H01Q1/24 ,  H01P3/00 ,  H01Q9/04

Abstract: A circuit board is provided in which a transmission loss is reduced. The circuit board includes a first layer; a transmission line disposed on the first layer; and a second layer stacked with the first layer. The second layer includes a first region, which is constructed of a first material, corresponding to a position of the transmission line, and a second region, which is constructed of a second material having a permittivity that is different from that of the first material, corresponding to the position of the transmission line.

公开(公告)号：US11749880B2

公开(公告)日：2023-09-05

申请号：US18090214

申请日：2022-12-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Han-Min Cho ,  Chan-Gi Park ,  Yeon-Sang Yun ,  Tae-Wook Ham ,  Hei-Seong Kwak ,  Byoung-Il Son ,  Sung-Chul Park

IPC: H01Q1/24 ,  H01Q5/35 ,  H05K1/02 ,  H01Q21/28 ,  H01Q1/38 ,  H01R12/79 ,  H01R13/66 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K7/14

CPC classification number: H01Q1/243 ,  H01Q1/38 ,  H01Q5/35 ,  H01Q21/28 ,  H01R12/79 ,  H01R13/6691 ,  H05K1/028 ,  H05K1/0218 ,  H05K1/0243 ,  H05K1/115 ,  H05K1/142 ,  H05K1/148 ,  H05K1/18 ,  H05K7/1427 ,  H05K2201/0999 ,  H05K2201/09609 ,  H05K2201/10098

Abstract: Disclosed is a portable communication device including a housing, a first printed circuit board (PCB) disposed in the housing, a wireless communication circuit mounted on the first PCB, and a second PCB including a connection part connected with the first PCB, a first PCB portion extended from the connection part and having greater flexibility than the connection part, a second PCB portion extended from the first PCB portion and having less flexibility than the first PCB portion, a third PCB portion extended from the second PCB portion and having greater flexibility than the second PCB portion, a fourth PCB portion extended from the third PCB portion and having less flexibility than the first PCB portion, a signal line extended to the connection part along the first, second, third, and fourth PCB portions, and vias arranged in at least a partial area of the second PCB portion or the fourth PCB portion, wherein a portion of the signal line is located between some of the vias.

公开(公告)号：US10978789B2

公开(公告)日：2021-04-13

申请号：US16939708

申请日：2020-07-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Han-Min Cho ,  Chan-Gi Park ,  Yeon-Sang Yun ,  Tae-Wook Ham ,  Hei-Seong Kwak ,  Byoung-Il Son ,  Sung-Chul Park

IPC: H05K7/00 ,  H01Q1/24 ,  H01Q5/35 ,  H05K1/02 ,  H01Q21/28 ,  H01Q1/38 ,  H01R12/79 ,  H01R13/66 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K7/14

Abstract: Disclosed is an electronic device including a housing, a printed circuit board (PCB) in the housing, wherein the PCB includes a plurality of layers with one or more conductive and insulation layers, a first electrical component formed as at least a part of or in the housing, a second electrical component above or near the PCB in the housing, wherein the first and second electrical components are separated, and at least one electrical path extending from the first electrical component to the second electrical component, wherein at least a portion of the electrical path runs on or inside the PCB, wherein the PCB includes a region including a pattern of conductive vias, wherein each of the vias extends through at least part of the plurality of layers to contact at least one of the one or more conductive layers, and wherein the electrical path runs through the region without contacting the vias.

公开(公告)号：US10727568B2

公开(公告)日：2020-07-28

申请号：US15621687

申请日：2017-06-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Han-Min Cho ,  Chan-Gi Park ,  Yeon-Sang Yun ,  Tae-Wook Ham ,  Hei-Seong Kwak ,  Byoung-Il Son ,  Sung-Chul Park

IPC: H05K1/11 ,  H01Q1/24 ,  H01Q5/35 ,  H05K1/02 ,  H01Q21/28 ,  H01Q1/38 ,  H01R12/79 ,  H01R13/66 ,  H05K1/14 ,  H05K1/18 ,  H05K7/14

Abstract: An electronic device including a housing; a printed circuit board (PCB) in the housing, wherein the PCB includes a plurality of layers with one or more conductive and insulation layers; a first electrical component formed as at least a part of or in the housing; a second electrical component above or near the PCB in the housing, wherein the first and second electrical components are separated; and at least one electrical path extending from the first electrical component to the second electrical component, wherein at least a portion of the electrical path runs on or inside the PCB, wherein the PCB includes a region including a pattern of conductive vias, wherein each of the vias extends through at least part of the plurality of layers to contact at least one of the one or more conductive layers, and wherein the electrical path runs through the region without contacting the vias.