Abstract:
A photomask manufacturing method includes defining a main region and a dummy region based on a layout data, wherein the main region corresponds to an outer boundary surrounding functional patterns defined by the layout data and the dummy region corresponds to an empty space outside the main region, and forming a dummy pattern to fill the dummy region. The forming of the dummy pattern includes placing at least one first pattern block in the dummy region to form a first sub-region, each of the at least one first pattern block having a first area, and placing, after completing the placing of the at least one first pattern block in the dummy region, at least one second pattern block in the dummy region except the first sub-region to form a second sub-region, each of the at least one second pattern block having a second area smaller than the first area.
Abstract:
Provided is a method of operating a semiconductor device. A method of operating a semiconductor device includes storing secure data in a secure area of a memory in response to detecting a system failure; encrypting the secure data stored in the secure area by using a random key to generate encrypted secure data; storing the encrypted secure data in the secure area; and dumping the secure area and a non-secure area of the memory.
Abstract:
A secure processor and a semiconductor system including the same is provided. Provided is a system on chip comprising a secure processor, wherein the secure processor includes: a random access memory (RAM) including a RAM cache area storing a page and a timestamp table storing a timestamp, an encryption/decryption engine configured to encrypt the page by using the timestamp, and a direct memory access (DMA) module configured to transmit the encrypted page to a swap area of a first memory disposed outside the system on chip, wherein the first memory includes a tag table area storing a tag generated by the encryption/decryption engine encrypting the page and a timestamp backup area backing up the timestamp, and the swap area, the tag table area, and the time stamp backup area are backed up in a second memory disposed outside the system on chip.
Abstract:
A semiconductor device may include: a bus; first and second function modules configured to communicate via the bus; a first encryption module configured to encrypt first data output from the first function module using a first encryption key to generate first encrypted data; and/or a second encryption module configured to decrypt the first encrypted data using the first encryption key, to output the decrypted first data to the second function module, and to encrypt second data output from the second function module using a second encryption key to generate second encrypted data. A semiconductor device may include: a bus; first and second modules configured to communicate via the bus; and/or an encryption module configured to use different encryption policies for first data, which is output from the first module and stored in a memory, and second data, which is output from the second module and stored in the memory.
Abstract:
A broadcast signal receiving apparatus and a method of controlling thereof are disclosed, and more particularly, to a technology for detecting whether or not an antenna cable is connected to the broadcast signal receiving apparatus. The broadcast signal receiving apparatus includes an antenna connection terminal provide with a detection pin configured to generate a voltage drop by making contact with an antenna cable, and a controller configured to determine whether the antenna cable is connected to the antenna connection terminal by detecting the voltage drop of the detection pin.
Abstract:
Disclosed herein is a cable device including a cable configured to transmit power and a connector connected to the cable, the cable device including a connector with improved electromagnetic interference (EMI) shielding performance. The cable device includes a cable, and a connector connected to the cable. The connector includes a printed circuit board including a ground electrode, and a shield case provided to accommodate the printed circuit board therein, the shield case including a contact portion provided in direct contact with the ground electrode.