PHOTOMASK MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME

    公开(公告)号:US20240321580A1

    公开(公告)日:2024-09-26

    申请号:US18526038

    申请日:2023-12-01

    CPC classification number: H01L21/0274 G03F1/70 G03F1/82 H01L21/823431

    Abstract: A photomask manufacturing method includes defining a main region and a dummy region based on a layout data, wherein the main region corresponds to an outer boundary surrounding functional patterns defined by the layout data and the dummy region corresponds to an empty space outside the main region, and forming a dummy pattern to fill the dummy region. The forming of the dummy pattern includes placing at least one first pattern block in the dummy region to form a first sub-region, each of the at least one first pattern block having a first area, and placing, after completing the placing of the at least one first pattern block in the dummy region, at least one second pattern block in the dummy region except the first sub-region to form a second sub-region, each of the at least one second pattern block having a second area smaller than the first area.

    SYSTEM ON CHIP INCLUDING SECURE PROCESSOR AND SEMICONDUCTOR SYSTEM INCLUDING THE SAME

    公开(公告)号:US20220398349A1

    公开(公告)日:2022-12-15

    申请号:US17585881

    申请日:2022-01-27

    Abstract: A secure processor and a semiconductor system including the same is provided. Provided is a system on chip comprising a secure processor, wherein the secure processor includes: a random access memory (RAM) including a RAM cache area storing a page and a timestamp table storing a timestamp, an encryption/decryption engine configured to encrypt the page by using the timestamp, and a direct memory access (DMA) module configured to transmit the encrypted page to a swap area of a first memory disposed outside the system on chip, wherein the first memory includes a tag table area storing a tag generated by the encryption/decryption engine encrypting the page and a timestamp backup area backing up the timestamp, and the swap area, the tag table area, and the time stamp backup area are backed up in a second memory disposed outside the system on chip.

    SEMICONDUCTOR DEVICES AND METHODS OF PROTECTING DATA OF CHANNELS IN THE SAME
    4.
    发明申请
    SEMICONDUCTOR DEVICES AND METHODS OF PROTECTING DATA OF CHANNELS IN THE SAME 审中-公开
    半导体器件及其保护通道数据的方法

    公开(公告)号:US20150372816A1

    公开(公告)日:2015-12-24

    申请号:US14713120

    申请日:2015-05-15

    Abstract: A semiconductor device may include: a bus; first and second function modules configured to communicate via the bus; a first encryption module configured to encrypt first data output from the first function module using a first encryption key to generate first encrypted data; and/or a second encryption module configured to decrypt the first encrypted data using the first encryption key, to output the decrypted first data to the second function module, and to encrypt second data output from the second function module using a second encryption key to generate second encrypted data. A semiconductor device may include: a bus; first and second modules configured to communicate via the bus; and/or an encryption module configured to use different encryption policies for first data, which is output from the first module and stored in a memory, and second data, which is output from the second module and stored in the memory.

    Abstract translation: 半导体器件可以包括:总线; 配置为经由总线通信的第一和第二功能模块; 第一加密模块,被配置为使用第一加密密钥来加密从所述第一功能模块输出的第一数据,以生成第一加密数据; 和/或第二加密模块,被配置为使用第一加密密钥对第一加密数据进行解密,以将解密的第一数据输出到第二功能模块,并且使用第二加密密钥来加密从第二功能模块输出的第二数据,以产生 第二个加密数据。 半导体器件可以包括:总线; 第一和第二模块经配置以经由总线进行通信; 和/或被配置为对从第一模块输出并存储在存储器中的第一数据使用不同的加密策略的加密模块以及从第二模块输出并存储在存储器中的第二数据。

    CABLE DEVICE
    6.
    发明申请

    公开(公告)号:US20210382253A1

    公开(公告)日:2021-12-09

    申请号:US17285278

    申请日:2019-08-16

    Abstract: Disclosed herein is a cable device including a cable configured to transmit power and a connector connected to the cable, the cable device including a connector with improved electromagnetic interference (EMI) shielding performance. The cable device includes a cable, and a connector connected to the cable. The connector includes a printed circuit board including a ground electrode, and a shield case provided to accommodate the printed circuit board therein, the shield case including a contact portion provided in direct contact with the ground electrode.

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