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    CABLE DEVICE
    1.
    发明申请
    CABLE DEVICE 有权

    公开(公告)号：US20210382253A1

    公开(公告)日：2021-12-09

    申请号：US17285278

    申请日：2019-08-16

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jin Sub KIM ,  Baek Seok KO ,  Sun Woo KIM ,  Dong Jin PARK

    IPC: G02B6/42 ,  H01R13/6594 ,  H01R13/6581

    Abstract: Disclosed herein is a cable device including a cable configured to transmit power and a connector connected to the cable, the cable device including a connector with improved electromagnetic interference (EMI) shielding performance. The cable device includes a cable, and a connector connected to the cable. The connector includes a printed circuit board including a ground electrode, and a shield case provided to accommodate the printed circuit board therein, the shield case including a contact portion provided in direct contact with the ground electrode.

    SEMICONDUCTOR DEVICE
    3.
    发明申请
    SEMICONDUCTOR DEVICE 有权

    公开(公告)号：US20210375877A1

    公开(公告)日：2021-12-02

    申请号：US17165539

    申请日：2021-02-02

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jin Sub KIM ,  Jun Kwan KIM ,  Woo Choel NOH ,  Kyoung-Hee KIM ,  Ik Soo KIM ,  Yong Jin SHIN

    IPC: H01L27/108

    Abstract: A semiconductor device includes a lower electrode on a substrate, a capacitor dielectric film extending on the lower electrode along a side surface of the lower electrode that is perpendicular to the substrate, an upper electrode on the capacitor dielectric film, an interface layer including a hydrogen blocking film and a hydrogen bypass film on the upper electrode, the hydrogen blocking film including a conductive material, and a contact plug penetrating the interface layer and electrically connected to the upper electrode.

    DISPLAY MODULE AND DISPLAY APPARATUS HAVING THE SAME
    6.
    发明申请
    DISPLAY MODULE AND DISPLAY APPARATUS HAVING THE SAME 有权
    显示模块和显示装置

    公开(公告)号：US20130162506A1

    公开(公告)日：2013-06-27

    申请号：US13724702

    申请日：2012-12-21

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jung Kyun KIM ,  Sung Ki KIM ,  Sru KIM ,  Jin Sub KIM ,  Jun Seok AN ,  Kye Hoon LEE ,  Heong Seog LEE ,  Jin Hyun CHO

    IPC: G06F1/32 ,  G09F13/04 ,  H05K7/20 ,  F21V29/00

    CPC classification number: G02F1/13452 ,  F21V29/50 ,  G02F1/133385 ,  G02F1/1336 ,  G02F1/133603 ,  G02F1/133608 ,  G02F2001/133628 ,  G06F1/32 ,  G09F13/04 ,  G09F13/0413 ,  H05K7/20963

    Abstract: A display module including a backlight to more effectively dissipate heat generated at light emitting diodes (LEDs) and heat dissipation units to effectively dissipate heat generated at driver chips and prevent movement of the driver chips by attaching porous fillers to the heat dissipation units, and a display apparatus having the same are provided. The display module includes a display panel, a backlight disposed on a rear side of the display panel and including a plurality of printed circuit boards, a bottom chassis adapted to accommodate the backlight unit and provided with a plurality of seating grooves, a driving printed circuit board, a plurality of flexible printed circuit films which electrically connect the display panel and the driving printed circuit board, at least one heat dissipater disposed on an opposite surface of a corresponding one of the flexible printed circuit and provided with a porous filler.

    Abstract translation: 一种显示模块，包括背光，以更有效地散发在发光二极管（LED）和散热单元处产生的热量，以有效地散发在驱动器芯片处产生的热量，并通过将多孔填料附着到散热单元来防止驱动器芯片的移动，以及 提供具有该显示装置的显示装置。 显示模块包括显示面板，设置在显示面板的后侧的背光，并且包括多个印刷电路板，适于容纳背光单元并具有多个安置槽的底部底座，驱动印刷电路 多个柔性印刷电路膜，其将显示面板和驱动印刷电路板电连接，至少一个散热器，设置在相应的柔性印刷电路的相对表面上并设置有多孔填料。

    MULTILAYER THIN FILM MANUFACTURING METHOD AND ELECTRONIC PRODUCT
    7.
    发明申请
    MULTILAYER THIN FILM MANUFACTURING METHOD AND ELECTRONIC PRODUCT 审中-公开
    多层薄膜制造方法和电子产品

    公开(公告)号：US20150125640A1

    公开(公告)日：2015-05-07

    申请号：US14530208

    申请日：2014-10-31

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Seo Joon LEE ,  Jin Sub KIM ,  Hyong Jun YOO ,  Min Chul JUNG ,  Jin Hyun CHO

    IPC: H05K5/04

    CPC classification number: C08J7/045 ,  C08J2300/00 ,  C08J2427/18 ,  C23C14/0015 ,  C23C14/025 ,  C23C14/568 ,  Y10T428/13 ,  Y10T428/1352

    Abstract: A manufacturing method that forms a multilayer thin film on the inner surface of a housing forming a transparent appearance of an electronic product to provide a deep metal texture and an electronic product having a metal texture provided at the inner surface of the housing. The multilayer thin film manufacturing method includes reforming an inner surface of a housing having an outer surface and the inner surface through plasma processing, depositing at least one hardness reinforcement layer on the inner surface, and depositing a color layer on the hardness reinforcement layer.

    Abstract translation: 一种制造方法，在形成电子产品的透明外观的壳体的内表面上形成多层薄膜，以提供深层金属质感，以及具有设置在壳体内表面的金属结构的电子产品。 多层薄膜制造方法包括通过等离子体处理对具有外表面和内表面的壳体的内表面进行重整，在内表面上沉积至少一个硬度增强层，以及在硬度增强层上沉积着色层。

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