公开(公告)号：US12238878B2

公开(公告)日：2025-02-25

申请号：US17894543

申请日：2022-08-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seungchang Baek ,  Hyeongsam Son ,  Changhyeok Shin ,  Yoonhee Lee ,  Junghyun Im ,  Sungho Cho ,  Jungwoo Choi ,  Hangyu Hwang ,  Minwoo Yoo

IPC: H01Q1/24 ,  H05K5/02

Abstract: An electronic device is provided. The electronic device includes a display, a frame structure including a first conductive member defining an external appearance of the electronic device and operated as an antenna element of the electronic device, a second conductive member coupled and electrically connected to the first conductive member, and a nonconductive member that supports the display together with the second conductive member, a bonding layer including a first layer at least partially disposed between the first conductive member and the nonconductive member, and a second layer at least partially disposed between the second conductive member and the nonconductive member, and at least one conductive connection member disposed at a portion, at which the first conductive member and the second conductive member are coupled to each other, and contacting the first conductive member and the second conductive member.

公开(公告)号：US12214532B2

公开(公告)日：2025-02-04

申请号：US17554664

申请日：2021-12-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changsu Kim ,  Hyunjung Jung ,  Hangyu Hwang ,  Sangsik Na ,  Hongbum Park

IPC: B29C45/37 ,  H04M1/02 ,  B29K69/00

Abstract: An electronic device is provided. The electronic device includes a housing; and a coating layer formed on at least a portion of a surface of the housing, wherein the coating layer comprises a paint, the paint including a one-component acrylate-based paint having a property of being cured by an ultraviolet (UV) light, or a one-component or two-component paint containing acryl and urethane and having a property of being cured by heat, wherein the coating layer has a pattern structure including an uneven pattern through laser processing on a portion of a coating film formed by applying the paint, and wherein two or more regions having different glossiness may exist on the surface of the housing by the pattern structure of the coating layer.

公开(公告)号：US12301742B2

公开(公告)日：2025-05-13

申请号：US18120021

申请日：2023-03-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junghyun Im ,  Joungki Park ,  Jinwoo Park ,  Seungchang Baek ,  Yoonhee Lee ,  Jungwoo Choi ,  Sungho Cho ,  Hangyu Hwang ,  Jongchul Choi

IPC: H04M1/00 ,  H04M1/02

Abstract: An electronic device according to an embodiment may include a housing comprising: an outer portion defining at least a portion of an exterior of the electronic device and comprising a first conductive material, an inner portion comprising a second conductive material having a first melting point different from that of the first conductive material and at least partially defining a space for receiving multiple electronic components arranged inside the electronic device, and a middle portion comprising a third conductive material having a second melting point and an injection molded insulator, wherein the third conductive material of the middle portion and the first conductive material of the outer portion are coupled to form a concave-convex structure, a difference between the first melting point and the second melting point is in a first range, and the third conductive material of the middle portion is electrically connected to the second conductive material of the inner portion.

公开(公告)号：US12035489B2

公开(公告)日：2024-07-09

申请号：US17861387

申请日：2022-07-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngjong Shin ,  Hangyu Hwang ,  Changsu Kim ,  Hyeonwoo Lee ,  Sungho Cho ,  Jeonga Kang ,  Hyunsuk Choi

IPC: H05K5/00 ,  G02B3/00 ,  G02B5/04 ,  H05K5/02 ,  H05K5/03

CPC classification number: H05K5/02 ,  G02B3/005 ,  G02B5/045 ,  H05K5/0086 ,  H05K5/03 ,  G02B3/0025 ,  G02B3/0031

Abstract: According to an embodiment of the disclosure, an electronic device may include a housing including a rear plate including a first region having a first concavo-convex pattern formed therein, and a second region having a second concavo-convex pattern formed therein, and a processor disposed inside the housing. The first concavo-convex pattern and the second concavo-convex pattern may be integrally formed with the rear plate, and a first depth of the first concavo-convex pattern may be different from a second depth of the second concavo-convex pattern.

公开(公告)号：US12204372B2

公开(公告)日：2025-01-21

申请号：US18172667

申请日：2023-02-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngsoo Ha ,  Yoonhee Lee ,  Hangyu Hwang

IPC: G06F1/16 ,  G06F3/01 ,  G06F3/02 ,  G06V10/10 ,  G06V40/13

Abstract: According to an embodiment, an electronic device includes a housing providing an inner space, a sensor disposed in the inner space, and a key button including an electrode electrically connected to the sensor and configured to obtain biometric information through a contact with an external object through the sensor, wherein the key button includes a metal layer, a deposited layer including a hole connected to a part of the metal layer and disposed on the metal layer, and a conductive material disposed in the hole and contact with the metal layer exposed through the hole, wherein a diameter of one side of the hole facing an outside is greater than a thickness of the deposited layer.

公开(公告)号：US12064907B2

公开(公告)日：2024-08-20

申请号：US17283888

申请日：2019-10-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changsu Kim ,  Sangsik Na ,  Rathore Pranveer Singh ,  Youngjin Yi ,  Jongbae Jeon ,  Donghyeon Hwang ,  Hangyu Hwang ,  Jinhyeong Park ,  Youngik Son

IPC: H05K5/00 ,  B29C45/14 ,  H05K5/04 ,  B29L31/34

CPC classification number: B29C45/14336 ,  H05K5/0017 ,  H05K5/04 ,  B29C2793/009 ,  B29L2031/34

Abstract: A method for manufacturing an electronic device, according to one embodiment of the present invention, may comprise the operations of: inserting and injecting a polymeric material into a structure, which is a plate-shaped metal structure comprising a first surface and a second surface, the structure comprising: at least one opening penetrating the first surface and the second surface; and at least one recess having a first depth from the first surface and extending to have a repeating pattern selected from among a W-shape, a sawtooth shape, and a straight line shape, when viewed from above the first surface; and confirming that the recess is filled with the polymeric material. Various other embodiments are possible.

公开(公告)号：US11612066B2

公开(公告)日：2023-03-21

申请号：US17301845

申请日：2021-04-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junghyun Im ,  Hyosang Lim ,  Heekwang Lim ,  Seungchang Baek ,  Hyeongsam Son ,  Sungho Cho ,  Hangyu Hwang ,  Jongchul Choi

IPC: H05K5/02 ,  H05K5/00

Abstract: An electronic device includes a front plate, a back plate that faces away from the front plate, a display, a frame, a polymer member, and an adhesive layer. The display is disposed between the front plate and the back plate and visible through the front plate. The frame surrounds an interior space between the front plate and the back plate and formed of a metallic material. The frame includes a first metal part and a second metal part. The polymer member is coupled to the frame and contains a polymer material. The adhesive layer bonds the polymer member and the frame. The frame includes an opening formed in a first part thereof. The opening is formed through the first metal part and being formed to a specified depth through the second metal part. The polymer member forms at least part of an inner surface of the opening.

公开(公告)号：US12101901B2

公开(公告)日：2024-09-24

申请号：US17590039

申请日：2022-02-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoonhee Lee ,  Hangyu Hwang ,  Junghyun Im

IPC: H05K5/00 ,  G06F1/16 ,  H01Q1/24 ,  H04M1/02 ,  H05K5/02

CPC classification number: H05K5/0243 ,  G06F1/1656 ,  H01Q1/243 ,  H04M1/0283

Abstract: Various embodiments of the present disclosure relate to an electronic device including a housing and a method of manufacturing the housing. The electronic device includes a housing forming an exterior of the electronic device. The housing is constituted to include a non-conductive part including a non-conductive protrusion protruded from at least some area of the non-conductive part, a conductive deposition layer disposed on a top surface of the non-conductive part except on the non-conductive protrusion, and a decoration layer formed on the top of the conductive deposition layer. Accordingly, the housing is lightweight and can perform a function of an antenna radiator. Other various embodiments are possible.

公开(公告)号：US11903147B2

公开(公告)日：2024-02-13

申请号：US17069965

申请日：2020-10-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hangyu Hwang ,  Youngjong Shin ,  Sangbeom Ko ,  Sungho Cho ,  Sunyoung Ji ,  Younghee Choi ,  Changyoun Hwang

IPC: H05K5/00 ,  B29C45/26 ,  H04B1/3827 ,  H04M1/02 ,  B29C45/37 ,  B29L31/34

CPC classification number: H05K5/0004 ,  B29C45/372 ,  H04M1/0283 ,  B29L2031/3475

Abstract: An electronic device and method for forming a housing of the same is disclosed. The electronic device includes: a housing including: a first plate forming a front surface of the housing, a second plate integrally forming a rear surface and side surface of the housing, wherein a space is enclosed between the front surface, side surface and rear surface, and wherein the second plate includes a first surface forming the side and rear surfaces of the housing, and a second surface disposed opposite to the first surface, and a display disposed in the space and at least partially visible through the first plate, wherein at least a portion of the second surface includes a pattern having surface roughness having a height of 0.1 μm to 1 μm.

公开(公告)号：US11553605B2

公开(公告)日：2023-01-10

申请号：US17141334

申请日：2021-01-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunjung Jung ,  Hangyu Hwang ,  Kwangyoun Lee ,  Sungho Cho ,  Changyoun Hwang

IPC: H05K7/02 ,  H05K7/04 ,  H05K5/00 ,  G02B30/30 ,  H05K5/03

Abstract: An electronic device is disclosed. The electronic device includes: a window; a display disposed in a first direction of the window; a housing including a first surface and a second surface extended from the first surface toward the window; a first film layer disposed on an inner surface of the housing and including: a first area that overlaps at least a portion of the first surface and is substantially transparent or translucent; and a second area that is extended from an edge of the first area along the second surface, and is substantially opaque; and a second film layer disposed on the first film layer in a second direction opposite to the first direction, the second film layer overlapping an entirety of the first area of the first film layer and overlapping a portion of the second area. Other embodiments are possible.