SEMICONDUCTOR DEVICE AND MEMORY SYSTEM INCLUDING THE SAME

    公开(公告)号:US20230032415A1

    公开(公告)日:2023-02-02

    申请号:US17722805

    申请日:2022-04-18

    Abstract: A semiconductor device includes: a plurality of pads connected to a memory device receiving a data signal using first to fourth clock signals having different phases; a data transmission/reception circuit inputting and outputting the data signal to a plurality of data pads of the plurality of pads and including a data delay cell adjusting a phase of the data signal; a clock output circuit outputting first to fourth clock signals to a plurality of clock pads of the plurality of pads and including first to fourth clock delay cells adjusting phases of the first to fourth clock signals; and a controller adjusting a delay amount of at least one of the first to fourth clock delay cells and the data delay cell so that each of the first to fourth clock signals is aligned with the data signal in the memory device.

    SHIELDING SYSTEM FOR MOBILE DEVICE AND METHOD FOR ASSEMBLING THE SYSTEM
    7.
    发明申请
    SHIELDING SYSTEM FOR MOBILE DEVICE AND METHOD FOR ASSEMBLING THE SYSTEM 审中-公开
    用于移动设备的屏蔽系统和用于组装该系统的方法

    公开(公告)号:US20130153286A1

    公开(公告)日:2013-06-20

    申请号:US13710956

    申请日:2012-12-11

    CPC classification number: H05K9/0007 H05K3/00 H05K9/0028 Y10T29/49124

    Abstract: A shielding system for a mobile device and a method for assembling the system are provided. The shielding system includes a Printed Circuit Board (PCB) with a first area and a thickness, and a shield enclosure, spaced apart and above a front side of the PCB at a certain distance, for enclosing components on the PCB. Parts of the shield enclosure are coupled to at least one of a lateral side and a back side of the PCB.

    Abstract translation: 提供了一种用于移动设备的屏蔽系统和用于组装该系统的方法。 屏蔽系统包括具有第一区域和厚度的印刷电路板(PCB)和屏蔽外壳,隔离并且在PCB的正面上方一定距离,用于封装PCB上的部件。 屏蔽外壳的部分耦合到PCB的侧面和背面中的至少一个。

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