公开(公告)号：US10076801B2

公开(公告)日：2018-09-18

申请号：US15443347

申请日：2017-02-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Min-woo Song ,  Sung-il Cho ,  Se-gi Byun ,  Jin Yu

IPC: B23K1/20 ,  H01L21/48 ,  H01L23/498 ,  H01L23/00 ,  C01B31/02 ,  B23K1/19 ,  B82Y40/00 ,  B82Y30/00

CPC classification number: B23K1/203 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/19 ,  B23K2101/42 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/158 ,  H01L21/4853 ,  H01L21/4864 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16227 ,  H01L2224/81024 ,  H01L2224/81815 ,  H01L2224/81911 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2924/15311 ,  Y10S977/742 ,  Y10S977/745 ,  Y10S977/75 ,  Y10S977/752 ,  Y10S977/842 ,  Y10S977/89 ,  Y10S977/932

Abstract: A method of manufacturing a semiconductor package including coating a flux on a connection pad provided on a first surface of a substrate, the flux including carbon nanotubes (CNTs), placing a solder ball on the connection pad coated with the flux, forming a solder layer attached to the connection pad from the solder ball through a reflow process, and mounting a semiconductor chip on the substrate such that the solder layer faces a connection pad in the semiconductor chip may be provided.