公开(公告)号：US10946483B2

公开(公告)日：2021-03-16

申请号：US16517789

申请日：2019-07-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young-Chul Kwon ,  Man-Hee Han

IPC: B23K26/53 ,  H01L21/78 ,  B23K26/06 ,  B23K26/073 ,  B23K26/067 ,  B23K26/08 ,  B23K26/70

Abstract: A laser apparatus may include a spectrum controller and a spectrum modulator. The spectrum controller may control a center wavelength and/or a bandwidth of a spectrum of a laser beam. The spectrum modulator may modulate the spectrum of the laser beam having the center wavelength and/or the bandwidth controlled by the spectrum controller. Thus, the laser beam may have the spectrum optimal for a semiconductor fabrication process. Particularly, the substrate may be accurately diced using the laser beam having the optimal spectrum.

公开(公告)号：US10410990B2

公开(公告)日：2019-09-10

申请号：US15937984

申请日：2018-03-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Man-Hee Han ,  Dae-Sang Chan ,  Sung-Il Cho ,  Jung-Lae Jung

IPC: H01L23/00 ,  B23K1/00 ,  B23K1/005 ,  B23K3/08 ,  B23K101/40

Abstract: A jig for bonding a semiconductor chip may include a pressurizing portion and at least one opening. The pressuring portion may be configured to pressurize an upper surface of the semiconductor chip bonded to a package substrate via a bump and a flux using a laser. The opening may be surrounded by the pressurizing portion. The laser irradiated to the bump and the flux may be transmitted through the opening. A vapor generated from the flux by the laser may be discharged through the opening. Thus, the contamination of the jig caused by the vapor may be prevented so that a transmissivity of the laser through the jig may be maintained.

公开(公告)号：US20190103376A1

公开(公告)日：2019-04-04

申请号：US15937984

申请日：2018-03-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Man-Hee Han ,  Dae-Sang Chan ,  Sung-il Cho ,  Jung-Lae Jung

IPC: H01L23/00 ,  B23K1/00 ,  B23K1/005 ,  B23K3/08

CPC classification number: H01L24/75 ,  B23K1/0016 ,  B23K1/0056 ,  B23K3/087 ,  B23K2101/40 ,  H01L24/16 ,  H01L24/81 ,  H01L24/95 ,  H01L2224/16225 ,  H01L2224/7501 ,  H01L2224/751 ,  H01L2224/75261 ,  H01L2224/75263 ,  H01L2224/75302 ,  H01L2224/75312 ,  H01L2224/75314 ,  H01L2224/75754 ,  H01L2224/7598 ,  H01L2224/81001 ,  H01L2224/81011 ,  H01L2224/81022 ,  H01L2224/81024 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2224/13099

Abstract: A jig for bonding a semiconductor chip may include a pressurizing portion and at least one opening. The pressuring portion may be configured to pressurize an upper surface of the semiconductor chip bonded to a package substrate via a bump and a flux using a laser. The opening may be surrounded by the pressurizing portion. The laser irradiated to the bump and the flux may be transmitted through the opening. A vapor generated from the flux by the laser may be discharged through the opening. Thus, the contamination of the jig caused by the vapor may be prevented so that a transmissivity of the laser through the jig may be maintained.