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公开(公告)号:US11032459B2
公开(公告)日:2021-06-08
申请号:US16053128
申请日:2018-08-02
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hwajoong Jung , Manho Kim , Taehyuk Kim , Taeyun Kim , Yonghwan Choi , Kihuk Lee
Abstract: An apparatus and method for a camera module is provided. The camera module includes a substrate, a first image sensor disposed in a first area on one side of the substrate, a second image sensor disposed in a second area on the one side, a reinforcement member disposed in an area around the first area and the second area so as to support at least a portion of the substrate, a first housing disposed in an area including at least a portion of the first area so as to be stacked on the first image sensor and one part of the reinforcement member while accommodating a first lens part corresponding to the first image sensor, and a second housing disposed in an area including at least a portion of the second area so as to be stacked on the second image sensor and the other part of the reinforcement member.
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公开(公告)号:US11817889B2
公开(公告)日:2023-11-14
申请号:US17529831
申请日:2021-11-18
Inventor: Seongkyu Song , Joonwoo Kim , Taeyun Kim , Sangheon Pack , Jaewook Lee , Jungsoo Jung
CPC classification number: H04B7/18513 , H04W76/12 , H04W88/16
Abstract: A communication method and an apparatus in a wireless communication system are provided. The communication method includes identifying, by a first satellite including a session management function within a space core network (SCN), a protocol data unit (PDU) session establishment request from a UE, selecting, by the first satellite, a satellite gateway for communicating with a ground gateway, and requesting, by the first satellite, the satellite gateway to allocate a port number which is matched to identification information of a first general packet radio service (GPRS) tunneling protocol-user (GTP-U) tunnel to be used for transmission and reception of packets for a PDU session requested by the UE in a path between a satellite base station which the UE accesses and the satellite gateway, wherein the packets are transmitted or received to and from a terrestrial core network (TCN) by using address information which is converted based on the port number.
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公开(公告)号:US20190068846A1
公开(公告)日:2019-02-28
申请号:US16053128
申请日:2018-08-02
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hwajoong Jung , Manho Kim , Taehyuk Kim , Taeyun Kim , Yonghwan Choi , Kihuk Lee
Abstract: An apparatus and method for a camera module is provided. The camera module includes a substrate, a first image sensor disposed in a first area on one side of the substrate, a second image sensor disposed in a second area on the one side, a reinforcement member disposed in an area around the first area and the second area so as to support at least a portion of the substrate, a first housing disposed in an area including at least a portion of the first area so as to be stacked on the first image sensor and one part of the reinforcement member while accommodating a first lens part corresponding to the first image sensor, and a second housing disposed in an area including at least a portion of the second area so as to be stacked on the second image sensor and the other part of the reinforcement member.
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公开(公告)号:US20250069682A1
公开(公告)日:2025-02-27
申请号:US18665817
申请日:2024-05-16
Applicant: Samsung Electronics Co., Ltd.
Inventor: Wonyoung Jang , Taewon Kim , Sanghee Kang , Taeyun Kim
Abstract: A memory device including a repair circuit and an operating method of the memory device are provided. The operating method includes outputting a signal representing a pre-decoded faulty row address based on predecoding a faulty row address, outputting a signal representing a pre-decoded row address based on predecoding a row address, outputting hit signals based on comparing a bit value of the pre-decoded faulty row address with a bit value of the pre-decoded row address, outputting a repair enable signal based on the hit signals, and performing a row repair operation based on the repair enable signal.
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公开(公告)号:US20240371431A1
公开(公告)日:2024-11-07
申请号:US18511443
申请日:2023-11-16
Applicant: Samsung Electronics CO., LTD.
Inventor: Taeyun Kim , Donghwee Kim , Junmyung Woo
IPC: G11C11/4091 , G11C11/4074 , G11C11/4094
Abstract: A bitline sense amplifier includes an amplifier circuit having a plurality of PMOS elements and a plurality of NMOS elements, a first switch circuit supplying a first power supply voltage to the plurality of PMOS elements, and a second switch circuit supplying one of a second power supply voltage, lower than the first power supply voltage, a first boost voltage higher than the second power supply voltage, and a second boost voltage, lower than the second power supply voltage, to the plurality of NMOS elements. The second switch circuit sequentially applies the first boost voltage, the second boost voltage, and the second power supply voltage to the plurality of NMOS elements based on an execution of a read operation.
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公开(公告)号:US20240290414A1
公开(公告)日:2024-08-29
申请号:US18515681
申请日:2023-11-21
Applicant: Samsung Electronics Co., Ltd.
Inventor: Taewon Kim , Sanghee Kang , Kiho Hyun , Taeyun Kim
CPC classification number: G11C29/44 , G11C29/12015 , G11C29/24
Abstract: A method of testing a repair circuit of a memory device. The method may include storing first addresses in a first register of the repair circuit, wherein the first register is configured to store faulty addresses during a normal operation of the memory device, and the repair circuit is configured to perform a repair operation to replace the faulty addresses with redundancy addresses, storing test addresses in a second register of the repair circuit, wherein the test addresses are provided from a test host, outputting hit signals by comparing bit values of the addresses stored in the first register with bit values of the addresses stored in the second register, outputting repair enable signals based on the hit signals, and determining a status of a path where the repair enable signals are generated based on logic levels of the repair enable signals.
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公开(公告)号:US11974036B2
公开(公告)日:2024-04-30
申请号:US17592962
申请日:2022-02-04
Applicant: Samsung Electronics Co., Ltd.
Inventor: Manho Kim , Taeyun Kim , Kihuk Lee , Wonjun Jeong , Hwajoong Jung , Changhwan Jin
CPC classification number: H04N23/57 , G09G3/035 , H04N23/51 , H04N23/54 , H04N23/65 , H05K1/028 , H05K1/14 , G09G2330/021 , H05K2201/10128
Abstract: An electronic device is provided that includes a first housing, a second housing configured to be slidable from the first housing, and a main printed circuit board (PCB) disposed inside the first housing and including a processor mounted therein. The electronic device also includes a camera module disposed in the second housing, and a display module. The display module includes a display having a first region exposed externally and a second region within an internal space of the first housing, while in a slide-in state of the second housing. The display module also includes a first flexible PCB (FPCB) connected to the main PCB. At least a portion of the first FPCB is movable as the second housing slides out from the first housing. The camera module is electrically connected to the first FPCB to transmit and receive electrical signals to and from the processor mounted on the main PCB.
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公开(公告)号:US11924065B2
公开(公告)日:2024-03-05
申请号:US17374716
申请日:2021-07-13
Inventor: Seongkyu Song , Joonwoo Kim , Sangheon Pack , Jaewook Lee , Taeyun Kim , Youbin Jeon , Jungsoo Jung
IPC: H04L41/5041 , H04L41/0806 , H04L41/14 , H04L41/147 , H04W24/02 , H04W88/18
CPC classification number: H04L41/5045 , H04L41/0806 , H04L41/145 , H04L41/147 , H04W24/02 , H04W88/18
Abstract: A method, performed by an electronic device, of placing a micro network function, includes: determining at least one micro network function used for a service; predicting control signaling overhead of at least one cell including at least one cell edge cloud, based on a history of control signaling overhead of the at least one cell; and placing the at least one micro network function in the at least one cell edge cloud, based on the predicted control signaling overhead of the at least one cell.
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公开(公告)号:US20220182521A1
公开(公告)日:2022-06-09
申请号:US17592962
申请日:2022-02-04
Applicant: Samsung Electronics Co., Ltd.
Inventor: Manho KIM , Taeyun Kim , Kihuk Lee , Wonjun Jeong , Hwajoong Jung , Changhwan Jin
Abstract: An electronic device is provided that includes a first housing, a second housing configured to be slidable from the first housing, and a main printed circuit board (PCB) disposed inside the first housing and including a processor mounted therein. The electronic device also includes a camera module disposed in the second housing, and a display module. The display module includes a display having a first region exposed externally and a second region within an internal space of the first housing, while in a slide-in state of the second housing. The display module also includes a first flexible PCB (FPCB) connected to the main PCB. At least a portion of the first FPCB is movable as the second housing slides out from the first housing. The camera module is electrically connected to the first FPCB to transmit and receive electrical signals to and from the processor mounted on the main PCB.
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公开(公告)号:US11129278B2
公开(公告)日:2021-09-21
申请号:US16206029
申请日:2018-11-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hwajoong Jung , Manho Kim , Youngseok Kim , Hyungjin Rho , Chiyoung Park , Taeyun Kim , Yonghwan Choi , Kihuk Lee
IPC: G02B7/02 , H05K1/18 , H05K1/11 , G03B17/02 , G02B7/09 , G02B27/64 , G03B13/36 , G03B5/00 , G02B7/08
Abstract: A camera module is provided. The camera includes a circuit board to which an image sensor disposed is disposed, one or more first conductive portions at one or more regions of the circuit board, one or more elastic connectors, including an elastic member and a metal film surrounding at least part of an outer portion of the elastic member, the elastic connector is disposed on the first conductive region, a lens device including one or more lenses and a driver capable of moving the lens device, a housing which accommodates the lens device, and a second conductive portion in one or more regions of the housing. The housing may be disposed above the elastic connector such that the second conductive portion is electrically coupled to the first conductive portion due to a contact with the elastic connector.
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