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10 条记录 (耗时 0.014 秒)

    Film product, film packages and package modules using the same
    1.
    发明授权
    Film product, film packages and package modules using the same 有权

    公开(公告)号：US10304764B2

    公开(公告)日：2019-05-28

    申请号：US15465146

    申请日：2017-03-21

    申请人： Samsung Electronics Co., Ltd.

    发明人： Yechung Chung ,  Woonbae Kim ,  Soyoung Lim ,  Jeong-Kyu Ha

    IPC分类号： H01L23/498 ,  H01L23/00

    摘要： In an embodiment, the film product includes a film substrate having a first surface and a second surface opposite the first surface. The film substrate has a length in a first direction and a width in a second direction perpendicular to the first direction. A first plurality of pads is on one of the first surface and the second surface, and the first plurality of pads is arranged in a third direction, the third direction being diagonal with respect to at least one of the first direction and the second direction. At least one merge line is electrically connecting at least two of the first plurality of pads.

    CHIP-ON-FILM PACKAGE AND MANUFACTURING METHOD THEREOF
    6.
    发明公开
    CHIP-ON-FILM PACKAGE AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：US20240321902A1

    公开(公告)日：2024-09-26

    申请号：US18612828

    申请日：2024-03-21

    申请人： Samsung Electronics Co., Ltd.

    发明人： Narae Shin ,  Jeongkyu Ha ,  Woonbae Kim ,  Yechung Chung ,  Jaemin Jung

    IPC分类号： H01L27/12

    CPC分类号： H01L27/124

    摘要： A chip of film package comprises a film substrate having a chip mounting region, an inner lead bonding region arranged within the chip mounting region, and an outer lead bonding region spaced apart from the inner lead bonding region in a first direction, and providing upper and lower surfaces opposite to each other, a first upper wiring pattern arranged on the upper surface of the film substrate and extending in the first direction from the inner lead bonding region to the outer lead bonding region, a second upper wiring pattern spaced apart from the first upper wiring pattern in the first direction, an upper solder resist layer covering an upper surface of the first upper wiring pattern; and a lower solder resist layer covering an upper surface of the lower wiring pattern.

    Semiconductor Packages
    7.
    发明申请
    Semiconductor Packages 有权
    半导体封装

    公开(公告)号：US20160148881A1

    公开(公告)日：2016-05-26

    申请号：US14855572

    申请日：2015-09-16

    申请人： Samsung Electronics Co., Ltd.

    发明人： Ji-Yong Park ,  Woonbae Kim ,  Kyoungsei Choi

    IPC分类号： H01L23/60 ,  H01L23/498

    CPC分类号： H01L23/60 ,  H01L23/145 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L23/552 ,  H01L24/00

    摘要： Semiconductor packages are provided. The semiconductor packages may include a base film having a top surface and a bottom surface, a circuit pattern disposed on the top surface of the base film and connected to a ground terminal, a via hole penetrating the base film, a lower shielding layer that is electrically connected to the circuit pattern and fills the whole region of the via hole and cover the bottom surface of the base.

    摘要翻译： 提供半导体封装。 半导体封装可以包括具有顶表面和底表面的基膜，设置在基膜的顶表面上并连接到接地端子的电路图案，穿透基膜的通孔，下屏蔽层， 电连接到电路图案并填充通孔的整个区域并覆盖基座的底表面。

    Semiconductor package including image sensor chip, transparent substrate, and joining structure
    8.
    发明授权
    Semiconductor package including image sensor chip, transparent substrate, and joining structure 有权

    公开(公告)号：US11581348B2

    公开(公告)日：2023-02-14

    申请号：US16830710

    申请日：2020-03-26

    申请人： SAMSUNG ELECTRONICS CO., LTD.

    发明人： Woonbae Kim

    IPC分类号： H01L27/146 ,  H01L23/58 ,  H01L23/48 ,  H01L23/498 ,  H01L23/00 ,  H01L23/02

    摘要： A semiconductor package may include an image sensor chip, a transparent substrate spaced apart from the image sensor chip, a joining structure in contact with a top surface of the image sensor chip and a bottom surface of the transparent substrate, on an edge region of the top surface of the image sensor chip, and a circuit substrate electrically connected to the image sensor chip. The image sensor chip may include a penetration electrode which penetrates at least a portion of an internal portion of the image sensor chip, and a terminal pad, which is on the edge region of the top surface of the image sensor chip and is connected to the penetration electrode. The joining structure may include a spacer and an adhesive layer which is between and attached to the spacer and the image sensor chip. The joining structure may the terminal pad.

    Electronic device including slidable body
    9.
    发明授权
    Electronic device including slidable body 有权

    公开(公告)号：US10944853B2

    公开(公告)日：2021-03-09

    申请号：US16807487

    申请日：2020-03-03

    申请人： Samsung Electronics Co., Ltd.

    发明人： Younghoon Lee ,  Woonbae Kim ,  Chulhwan Lee ,  Sungkyu Hwang ,  Cheolsoo Kim ,  Minwook Jin ,  Howon Lee ,  Chulho Bae ,  Junghoon Lee

    IPC分类号： H04B1/38 ,  H04M1/02

    摘要： According to certain embodiments, an electronic device may include a housing, a slidable body; a driver including: a drive motor, a rotatable drive shaft for the drive motor, and a nut frame including a latch projection, protruding in a direction of the slidable body, and a slide hinge disposed on the slidable body and coupled to the driver, wherein the slide hinge includes: a slide plate coupled to the slidable body, and a locker including a latch groove, into which the latch protrusion is inserted, wherein, when the latch projection is inserted into the latch groove, the slidable body is moved by the driver, and wherein the slide plate defines an escape area configured to receive at least a portion of the nut frame and/or the latch protrusion, when an external impact causes the latch protrusion to separate from the latch groove.