公开(公告)号：US12106604B2

公开(公告)日：2024-10-01

申请号：US17571664

申请日：2022-01-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Moonhwan Jeong ,  Yoonsang Kim ,  Sujung Bae ,  Inho Choi ,  Seon Heo

IPC: G06T5/50 ,  G06N3/04 ,  G06N20/00 ,  G06T5/70 ,  G06V40/16

CPC classification number: G06V40/161 ,  G06N3/04 ,  G06N20/00 ,  G06T5/50 ,  G06T5/70 ,  G06V40/166 ,  G06V40/171

Abstract: An electronic device according to an embodiment disclosed herein may include a communication circuit, a processor; and a memory configured to be operatively connected to the processor. The memory according to an embodiment may store instructions that, when executed, cause the processor to: recognize an area comprising at least part of a face in an image to be transmitted to an external device; generate perturbation data about the recognized area based on a machine learning model stored in the memory; apply the perturbation data to the recognized area; and transmit the image to which the perturbation data has been applied to the external device. Various other embodiments are possible.

公开(公告)号：US20240105703A1

公开(公告)日：2024-03-28

申请号：US18322795

申请日：2023-05-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyun Lim ,  Kwangjin Lee ,  Hyunjong Moon ,  Inho Choi

IPC: H01L25/18 ,  G06K19/073 ,  G06V40/13 ,  H01L23/00 ,  H01L23/538 ,  H01L25/00

CPC classification number: H01L25/18 ,  G06K19/07354 ,  G06V40/1306 ,  G06V40/1329 ,  H01L23/5388 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L25/50 ,  H01L24/16 ,  H01L24/73 ,  H01L24/84 ,  H01L2224/16145 ,  H01L2224/37013 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40101 ,  H01L2224/40106 ,  H01L2224/40157 ,  H01L2224/40499 ,  H01L2224/4103 ,  H01L2224/41051 ,  H01L2224/41176 ,  H01L2224/73205 ,  H01L2224/84005 ,  H01L2924/01039 ,  H01L2924/0665

Abstract: A fingerprint sensor package includes: a first substrate including a core insulating layer including a first surface and a second surface and a through-hole, a first bonding pad on the second surface, and an external connection pad between an edge of the second surface and the first bonding pad; a second substrate in the through-hole and including a third surface and a fourth surface, and including first sensing patterns on the third surface, spaced apart in a first direction, and extending in a second direction, second sensing patterns spaced apart from each other in the second direction and extending in the first direction, and a second bonding pad on the fourth surface; a conductive support electrically connecting the first bonding pad and the second bonding pad and supporting the first substrate and the second substrate; a controller chip on the second substrate; and a molding layer on the second surface.

公开(公告)号：US11711883B2

公开(公告)日：2023-07-25

申请号：US17393474

申请日：2021-08-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minseok Choi ,  Injae Lee ,  Inho Choi ,  Sungyeol Kim ,  Sunghyup Kim ,  Jeonggil Kim ,  Jongbin Park

IPC: H05G2/00 ,  G03F7/20 ,  G03F7/00

CPC classification number: H05G2/006 ,  G03F7/70033 ,  G03F7/7055 ,  H05G2/008

Abstract: A droplet accelerating assembly includes an acceleration chamber extending in a first direction parallel to an ejection direction of the droplet, the acceleration chamber having a first side connected to the droplet generator, a second side opposite the first side in the first direction, the second side including a discharge hole, and a fluid flow path, a pressure controller connected to the fluid flow path of the acceleration chamber, the pressure controller being configured to adjust an internal pressure of the acceleration chamber, an electrifier in the acceleration chamber, the electrifier being configured to electrify the droplet ejected by the droplet generator into an electrified droplet, and an accelerator in the acceleration chamber, the accelerator being configured to accelerate the electrified droplet.

公开(公告)号：US11538268B2

公开(公告)日：2022-12-27

申请号：US17500434

申请日：2021-10-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyun Lim ,  Younghwan Park ,  Kwangjin Lee ,  Inho Choi ,  Hyuntaek Choi

IPC: G06V40/13

Abstract: A fingerprint sensor package includes a package substrate including an upper surface in which a sensing region and a peripheral region surrounding the sensing region are defined, and a lower surface facing the upper surface; a plurality of first sensing patterns located are arranged in the sensing region, are apart from each other in a first direction, and extend in a second direction crossing the first direction; a plurality of second sensing patterns that are arranged in the sensing region, are apart from each other in the second direction, and extend in the first direction; a coating member covering the sensing region; an upper ground pattern in the peripheral region and apart from the coating member to surround the coating member in the first and second directions; and a controller chip on the lower surface of the package substrate; and a plurality of capacitors.

公开(公告)号：US11954938B2

公开(公告)日：2024-04-09

申请号：US18131133

申请日：2023-04-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gwangjin Lee ,  Jaehyun Lim ,  Heeyoub Kang ,  Hyunjong Moon ,  Yun Seok Choi ,  Inho Choi

IPC: G06V40/13 ,  G06K19/073 ,  G06K19/077

CPC classification number: G06V40/1306 ,  G06K19/07354 ,  G06K19/07747

Abstract: A fingerprint sensor package includes a first substrate having a core insulating layer with a first surface and a second surface, and a through-hole passing through the first surface and the second surface, a first bonding pad disposed on the second surface of the core insulating layer, and an external connection pad, a second substrate disposed in the through-hole of the core insulating layer and including a plurality of first sensing patterns, a plurality of second sensing patterns, and a second bonding pad, a conductive wire connecting the first bonding pad and the second bonding pad to each other, a controller chip disposed on the second substrate, and a molding layer disposed on the second surface of the core insulating layer, filling the through-hole, covering the second substrate and the first bonding pad, and spaced apart from the external connection pad.

公开(公告)号：US11822260B2

公开(公告)日：2023-11-21

申请号：US17939293

申请日：2022-09-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongbin Park ,  Minseok Choi ,  Inho Choi ,  Jeonggil Kim

IPC: G03F7/20 ,  G03F7/00

CPC classification number: G03F7/70925 ,  G03F7/70033 ,  G03F7/7085 ,  G03F7/70975

Abstract: An apparatus for removing a residue of an EUV light source vessel including an internal side surface having a curved surface is provided. The apparatus includes a frame portion configured to be disposed on a bottom surface of an EUV light source vessel and a head portion above the frame portion. The head portion is configured to be rotatably moved on a circular trajectory while maintaining a desired (and/or alternatively predetermined) distance from the curved surface of the EUV light source vessel. The head portion may have a heating member configured to emit heat toward the curved surface of the EUV light source vessel. The heating member may have a shape curved in an arc corresponding to a portion of the circular trajectory.

公开(公告)号：US09041222B2

公开(公告)日：2015-05-26

申请号：US14487287

申请日：2014-09-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yonghoon Kim ,  Keung Beum Kim ,  Seongho Shin ,  Seung-Yong Cha ,  Inho Choi

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  H01L23/498 ,  H01L25/10 ,  H01L25/18 ,  H01L25/065

CPC classification number: H01L24/17 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/1437 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A semiconductor device is provided, which comprises a first semiconductor package, a second semiconductor package, and a connection structure. The first semiconductor package includes a first substrate. The first substrate includes a first region and a second region. The second semiconductor package is mounted on the first semiconductor package. The connection structure electrically connects the second semiconductor package and the first semiconductor package. The connection structure comprises first connection patterns at the first region. The first connection patterns provide a data signal at the first region. The connection structure further comprises second connection patterns at the second region. The second connection patterns provide a control/address signal at the second region. A number of the second connection patterns is less than a number of the first connection patterns.

Abstract translation: 提供一种半导体器件，其包括第一半导体封装，第二半导体封装和连接结构。 第一半导体封装包括第一衬底。 第一基板包括第一区域和第二区域。 第二半导体封装安装在第一半导体封装上。 连接结构电连接第二半导体封装和第一半导体封装。 连接结构包括在第一区域的第一连接图案。 第一连接图案在第一区域提供数据信号。 连接结构还包括在第二区域处的第二连接图案。 第二连接模式在第二区域提供控制/寻址信号。 多个第二连接图案小于第一连接图案的数量。

公开(公告)号：US20240142886A1

公开(公告)日：2024-05-02

申请号：US18322161

申请日：2023-05-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Injae Lee ,  Sungyong Bae ,  Daegeun Yoon ,  Inho Choi ,  Sunghyup Kim ,  Euishin Kim ,  Jeonggil Kim ,  Yebin Nam ,  Dongjin Lee ,  Jonggu Lee ,  Dohyun Jung ,  Dongsik Jeong

IPC: G03F7/20 ,  H01L21/68

CPC classification number: G03F7/70908 ,  G03F7/70716 ,  H01L21/68

Abstract: A substrate processing apparatus includes a table in an exposure chamber that is configured to perform an exposure process on a semiconductor substrate, a guiding device including a first horizontal driving body slidably movable in a first horizontal direction and a guide rail on the first horizontal driving body and having a trench extending in a second horizontal direction, a positioning device connected to the guiding device, the positioning device including a slider, a second horizontal driving body and a substrate stage, the slider configured to slidably move in the second horizontal direction along the trench, the second horizontal driving body connected or fixed to the slider, the substrate stage on the second horizontal driving body and configured to support the semiconductor substrate, and a blocking member between the guide rail and the substrate stage to block an inflow of foreign substances onto the substrate stage.

公开(公告)号：US11216999B2

公开(公告)日：2022-01-04

申请号：US16556379

申请日：2019-08-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Inho Choi ,  Kwangchoon Kim

IPC: G06T11/80 ,  G06F3/01 ,  G06T11/40

Abstract: An electronic device may include: a camera, a display, a processor operatively coupled to the camera and the display, and a memory operatively coupled to the processor. The memory may store a plurality of avatar templates containing a plurality of gestures and instructions. The instructions, when executed by the processor may control the electronic device to: obtain an image of an external object using the camera, obtain a value of at least one parameter corresponding to an emotion state based on the obtained image, select an avatar template including a first gesture from among the plurality of avatar templates based on the value of the at least one parameter, generate an avatar sticker including a second gesture different from the first gesture based on the selected avatar template and the value of the at least one parameter, and display the generated avatar sticker on at least a portion of the display.

公开(公告)号：US11131568B2

公开(公告)日：2021-09-28

申请号：US17002071

申请日：2020-08-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungeun Jo ,  Youngshin Kwon ,  Minjin Kim ,  Woonbae Kim ,  Youngdoo Jung ,  Eunhee Jung ,  Inho Choi

IPC: G01D11/24 ,  G01N33/00

Abstract: Disclosed are sensor packages, methods of manufacturing the same, and methods of manufacturing lid structures. The sensor package comprises a package substrate, a gas sensor on the package substrate, a lid on the package substrate and having a hole extending between a first inner surface and a first outer surface of the lid, the first inner surface of the lid facing toward the package substrate and the first outer surface of the lid facing away from the package substrate, and a waterproof film in the hole of the lid. The waterproof film is formed on the first inner surface and the first outer surface of the lid.