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公开(公告)号：US11527470B2
公开(公告)日：2022-12-13
申请号：US16872567
申请日：2020-05-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Shle-Ge Lee , Youngbae Kim , Ji-Yong Park
IPC: H01L23/49 , H01L23/498 , H05K1/11 , H01L23/31 , H01L29/768
Abstract: Disclosed are film packages and methods of fabricating package modules. The film package includes a film substrate that includes a chip region and a peripheral region facing each other in a first direction, a plurality of output pads that are arranged in the first direction on the chip region and on the peripheral region, and a semiconductor chip on the chip region and electrically connected to the output pads. The output pads on the chip region are arranged at regular first intervals along the first direction. The output pads include a plurality of first output pads that are arranged at a first pitch along the first direction on the chip region and a plurality of second output pads on the peripheral region. The second output pads are arranged at a second pitch greater than the first pitch of the first output pads.
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公开(公告)号：US09024362B2
公开(公告)日：2015-05-05
申请号：US13765121
申请日：2013-02-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sae-Young Kim , Ji-Yong Park , Sang-Chul Sul
IPC: H01L27/148 , H01L51/44 , H01L27/146
CPC classification number: H01L51/441 , H01L27/14603 , H01L27/14643 , H01L27/307 , Y02E10/549
Abstract: An organic image sensor includes a first organic photoelectric conversion pixel circuit on an active region of a substrate and a second organic photoelectric conversion pixel circuit on an optical black region of the substrate. The first organic photoelectric conversion pixel circuit includes a first organic photoelectric conversion element configured to generate charges responding to incident light and a first readout circuit configured to receive a first input signal including the charges generated in the first organic photoelectric conversion element. The second organic photoelectric conversion pixel circuit includes a second organic photoelectric conversion element and a second readout circuit configured to receive a second input signal generated irrespective of the incident light.
Abstract translation: 有机图像传感器包括在基板的有源区域上的第一有机光电转换像素电路和在该基板的光学黑色区域上的第二有机光电转换像素电路。 第一有机光电转换像素电路包括：第一有机光电转换元件，被配置为产生响应于入射光的电荷;以及第一读出电路，被配置为接收包括在第一有机光电转换元件中产生的电荷的第一输入信号。 第二有机光电转换像素电路包括第二有机光电转换元件和第二读出电路，其被配置为接收与入射光无关地产生的第二输入信号。
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公开(公告)号：US20240055398A1
公开(公告)日：2024-02-15
申请号：US18309250
申请日：2023-04-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Choong Bin Yim , Ji-Yong Park , Jin-Woo Park , Jong Bo Shim
IPC: H01L25/065 , H10B80/00 , H01L23/31 , H01L23/498 , H01L23/00
CPC classification number: H01L25/0655 , H10B80/00 , H01L23/3107 , H01L23/49816 , H01L24/16 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/73 , H01L2224/16227 , H01L2224/32137 , H01L2224/32245 , H01L2224/32225 , H01L2224/33051 , H01L2224/48229 , H01L2224/73204 , H01L2224/73265 , H01L2224/73215 , H01L2924/1431 , H01L2924/1443 , H01L2924/1436 , H01L2924/1437 , H01L2924/1441
Abstract: A semiconductor package includes a first substrate, a memory semiconductor package on a first surface of the first substrate, an adhesive layer between the first surface of the first substrate and the memory semiconductor package, a wire extending from an upper surface of the memory semiconductor package and connected to the first substrate, a logic semiconductor chip on the first surface of the first substrate, a first connection terminal between the first surface of the first substrate and the logic semiconductor chip, and a molding layer, wherein a first height of the memory semiconductor package is smaller than a second height of the logic semiconductor chip, and wherein an uppermost surface of the molding layer and the upper surface of the logic semiconductor chip are coplanar.
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公开(公告)号：US10015423B2
公开(公告)日：2018-07-03
申请号：US15331195
申请日：2016-10-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sang-Hoon Ha , Ji-Yong Park
IPC: H04N5/359 , H04N5/355 , H04N5/374 , H04N5/3745
CPC classification number: H04N5/3591 , H04N5/35581 , H04N5/37457
Abstract: In a method of operating an image sensor, a first pixel and a second pixel are commonly connected to a floating diffusion node. A voltage of the floating diffusion node is boosted. A first image signal of the first pixel is read through the floating diffusion node after of the voltage of the floating diffusion node is boosted. A second image signal of the second pixel is read through the floating diffusion node after the first image signal is read. The image sensor has a shared structure in which a plurality of pixels are connected to a single floating diffusion node. Blooming may be reduced in the image sensor by boosting the voltage of the floating diffusion node before reading the image signal to lower the potential barrier formed between the photodiode and the floating diffusion node and drain the saturated photocharges into the floating diffusion node.
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公开(公告)号：US20170126997A1
公开(公告)日：2017-05-04
申请号：US15331195
申请日：2016-10-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sang-Hoon Ha , Ji-Yong Park
CPC classification number: H04N5/3591 , H04N5/35581 , H04N5/37457
Abstract: In a method of operating an image sensor, a first pixel and a second pixel are commonly connected to a floating diffusion node. A voltage of the floating diffusion node is boosted. A first image signal of the first pixel is read through the floating diffusion node after of the voltage of the floating diffusion node is boosted. A second image signal of the second pixel is read through the floating diffusion node after the first image signal is read. The image sensor has a shared structure in which a plurality of pixels are connected to a single floating diffusion node. Blooming may be reduced in the image sensor by boosting the voltage of the floating diffusion node before reading the image signal to lower the potential barrier formed between the photodiode and the floating diffusion node and drain the saturated photocharges into the floating diffusion node.
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Patent Agency Ranking
公开(公告)号：US20160148881A1
公开(公告)日：2016-05-26
申请号：US14855572
申请日：2015-09-16
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ji-Yong Park , Woonbae Kim , Kyoungsei Choi
IPC: H01L23/60 , H01L23/498
CPC classification number: H01L23/60 , H01L23/145 , H01L23/49827 , H01L23/49838 , H01L23/49866 , H01L23/49894 , H01L23/552 , H01L24/00
Abstract: Semiconductor packages are provided. The semiconductor packages may include a base film having a top surface and a bottom surface, a circuit pattern disposed on the top surface of the base film and connected to a ground terminal, a via hole penetrating the base film, a lower shielding layer that is electrically connected to the circuit pattern and fills the whole region of the via hole and cover the bottom surface of the base.
Abstract translation: 提供半导体封装。 半导体封装可以包括具有顶表面和底表面的基膜，设置在基膜的顶表面上并连接到接地端子的电路图案，穿透基膜的通孔，下屏蔽层， 电连接到电路图案并填充通孔的整个区域并覆盖基座的底表面。
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公开(公告)号：US10056933B2
公开(公告)日：2018-08-21
申请号：US15675225
申请日：2017-08-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seung-Hwan Lee , Ji-Yong Park
CPC classification number: H04B1/3888 , A45C11/00 , A45C2011/002 , G06F1/1626 , G06F1/1632 , G06F1/1671 , G06F1/1692 , G06F3/048 , G06F3/14 , G06F2200/1634 , H04M1/0202 , H04M1/0214 , H04M1/04 , H04M1/72527
Abstract: An accessory device of a portable electronic device is provided. The accessory device includes a first cover that is detachably attached to at least a portion of the electronic device, a second cover that is connected to the first cover, at least a portion of the second cover covering at least a portion of a display of the electronic device, and an electronic circuit that is arranged inside the first cover or the second cover. The electronic circuit may include a memory that stores at least some of codes or data that indicate one or more of identification information, a characteristic, a configuration, a structure, and a function that are associated with a protection cover. Various pieces of corresponding information may be output according to the kinds of applied accessories. Therefore, the consumers' product preference can be improved and the reliability of the electronic device can be secured.
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公开(公告)号：US09735825B2
公开(公告)日：2017-08-15
申请号：US14912778
申请日：2014-08-19
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seung-Hwan Lee , Ji-Yong Park
CPC classification number: H04B1/3888 , A45C11/00 , A45C2011/002 , G06F3/048 , G06F3/14 , G06F2200/1634 , H04M1/0202 , H04M1/0214 , H04M1/04 , H04M1/72527
Abstract: Various embodiments of the present disclosure provide an accessory device of a portable electronic device. The accessory device includes a first cover that is detachably attached to at least a portion of the electronic device, a second cover that is connected to the first cover, at least a portion of the second cover covering at least a portion of a display of the electronic device, and an electronic circuit that is arranged inside the first cover or the second cover. The electronic circuit may include a memory that stores at least some of codes or data that indicate one or more of identification information, a characteristic, a configuration, a structure, and a function that are associated with a protection cover. Various pieces of corresponding information may be output according to the kinds of applied accessories. Therefore, the consumers' product preference can be improved and the reliability of the electronic device can be secured.
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公开(公告)号：US09601445B2
公开(公告)日：2017-03-21
申请号：US14855572
申请日：2015-09-16
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ji-Yong Park , Woonbae Kim , Kyoungsei Choi
IPC: H01L23/552 , H01L23/60 , H01L23/498 , H01L23/14 , H01L23/00
CPC classification number: H01L23/60 , H01L23/145 , H01L23/49827 , H01L23/49838 , H01L23/49866 , H01L23/49894 , H01L23/552 , H01L24/00
Abstract: Semiconductor packages are provided. The semiconductor packages may include a base film having a top surface and a bottom surface, a circuit pattern disposed on the top surface of the base film and connected to a ground terminal, a via hole penetrating the base film, a lower shielding layer that is electrically connected to the circuit pattern and fills the whole region of the via hole and cover the bottom surface of the base.
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公开(公告)号：US20240128173A1
公开(公告)日：2024-04-18
申请号：US18320456
申请日：2023-05-19
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ji-Yong Park , Jong Bo Shim , Dae Hun Lee , Choong Bin Yim
IPC: H01L23/498 , H01L21/56 , H01L23/00 , H01L23/12 , H01L23/31 , H01L23/367 , H01L25/065
CPC classification number: H01L23/49816 , H01L21/563 , H01L21/565 , H01L23/12 , H01L23/3128 , H01L23/3135 , H01L23/3675 , H01L24/13 , H01L24/14 , H01L24/73 , H01L25/0657 , H01L2224/13025 , H01L2224/1403 , H01L2224/14131
Abstract: A semiconductor package includes a first package substrate having a first region and a second region, which do not overlap each other, a first connection element having a first height on the first region, a first semiconductor chip having a second height connected to the first connection element, a second connection element having a third height on the second region, a third connection element having a fourth height on the second connection element and electrically connected to the second connection element, a second package on the third connection element, the second package including a second package substrate and a second semiconductor chip, and a first mold layer covering at least a portion of the first semiconductor chip, covering at least a portion of the second connection element, covering the first package substrate, exposing upper surfaces of the first semiconductor chip and the second connection element, and having a fifth height.
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