公开(公告)号：US20120017435A1

公开(公告)日：2012-01-26

申请号：US13200983

申请日：2011-10-06

申请人： Seung Hyun Sohn ,  Yul Kyo Chung ,  Byoung Chan Kim ,  Moon Il Kim ,  Kwan Kyu Kim ,  Yee Na Shin

发明人： Seung Hyun Sohn ,  Yul Kyo Chung ,  Byoung Chan Kim ,  Moon Il Kim ,  Kwan Kyu Kim ,  Yee Na Shin

IPC分类号： H05K3/30

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K3/025 ,  H05K3/4602 ,  H05K2201/10674 ,  H05K2203/0152 ,  H05K2203/063 ,  H05K2203/1152 ,  H05K2203/1469 ,  Y10T29/49124 ,  Y10T29/4913 ,  H01L2924/00

摘要： A method of manufacturing a PCB having electronic components embedded therein, including: preparing a copper foil layer including a thin copper foil coated with a resin layer; fixing electronic components onto the resin layer; forming a core layer in which the electronic components are embedded; forming internal layer circuits which are electrically connected to the electronic components; forming an insulating layer on the internal layer circuits; and forming external layer circuits on the insulating layer such that the external layer circuits are electrically connected to the internal layer circuits.

摘要翻译： 一种制造其中嵌有电子元件的PCB的方法，包括：制备包括涂覆有树脂层的薄铜箔的铜箔层; 将电子部件固定到树脂层上; 形成其中嵌入有电子部件的芯层; 形成电连接到所述电子部件的内层电路; 在内层电路上形成绝缘层; 以及在所述绝缘层上形成外层电路，使得所述外层电路电连接到所述内层电路。

公开(公告)号：US20090277673A1

公开(公告)日：2009-11-12

申请号：US12215414

申请日：2008-06-27

申请人： Seung Hyun Sohn ,  Yul Kyo Chung ,  Byoung Chan Kim ,  Moon Il Kim ,  Kwan Kyu Kim ,  Yee Na Shin

发明人： Seung Hyun Sohn ,  Yul Kyo Chung ,  Byoung Chan Kim ,  Moon Il Kim ,  Kwan Kyu Kim ,  Yee Na Shin

IPC分类号： H05K1/00 ,  H05K3/00

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K3/025 ,  H05K3/4602 ,  H05K2201/10674 ,  H05K2203/0152 ,  H05K2203/063 ,  H05K2203/1152 ,  H05K2203/1469 ,  Y10T29/49124 ,  Y10T29/4913 ,  H01L2924/00

摘要： Provided is a PCB having electronic components embedded therein, the PCB including a core layer having electronic components embedded therein and a resin layer formed thereon and thereunder; internal layer circuits formed on the resin layer and being electrically connected to the electronic components; an insulating layer formed on the internal layer circuits; and external layer circuits formed on the insulating layer and being electrically connected to the internal layer circuits.

摘要翻译： 本发明提供一种嵌入其中的电子部件的PCB，该PCB包括嵌入其中的电子部件的芯层和在其上形成的树脂层。 形成在树脂层上并与电子部件电连接的内层电路; 形成在所述内层电路上的绝缘层; 以及形成在绝缘层上并与内部层电路电连接的外部层电路。

公开(公告)号：US20080158777A1

公开(公告)日：2008-07-03

申请号：US11979770

申请日：2007-11-08

申请人： Seung Hyun Sohn ,  Yul Kyo Chung ,  Seung Eun Lee ,  Yee Na Shin

发明人： Seung Hyun Sohn ,  Yul Kyo Chung ,  Seung Eun Lee ,  Yee Na Shin

IPC分类号： H01G4/06 ,  H01G4/00

CPC分类号： H05K1/162 ,  H01G4/232 ,  H01G4/30 ,  H01G4/33 ,  H05K1/0231 ,  H05K1/185 ,  H05K3/4644 ,  H05K2201/0179 ,  H05K2201/09509 ,  H05K2201/09763 ,  H05K2201/09781

摘要： There are provided a capacitor and a thin film capacitor-embedded multi-layer wiring board. The capacitor includes: first and second electrodes connected to first and second polarities; a dielectric layer formed therebetween; and at least one floating electrode disposed inside the dielectric layer and having overlaps with the first and second electrodes. The wiring board includes: an insulating body having a plurality of insulating layers thereon; a plurality of conductive patterns and conductive vias formed on the insulating layers, respectively, to constitute an interlayer circuit; and a thin film capacitor embedded in the insulating body, wherein the thin film capacitor includes a first electrode layer, a first dielectric layer, at least one floating electrode layer, a second dielectric layer and a second electrode layer sequentially formed, and wherein the first and second electrode layers are connected to the interlayer circuit and the floating electrode layer is not directly connected thereto.

摘要翻译： 提供电容器和薄膜电容器嵌入式多层布线板。 电容器包括：连接到第一和第二极性的第一和第二电极; 在它们之间形成介电层; 以及至少一个浮置电极，其布置在电介质层的内部并与第一和第二电极重叠。 布线板包括：绝缘体，其上具有多个绝缘层; 分别形成在绝缘层上的多个导电图案和导电通孔，以构成层间电路; 以及嵌入在所述绝缘体中的薄膜电容器，其中所述薄膜电容器包括依次形成的第一电极层，第一电介质层，至少一个浮置电极层，第二电介质层和第二电极层，并且其中所述第一电极层 并且第二电极层连接到层间电路，并且浮动电极层不直接连接到其上。

公开(公告)号：US20110163437A1

公开(公告)日：2011-07-07

申请号：US12805122

申请日：2010-07-13

申请人： Yee Na Shin ,  Seung Wook Park

发明人： Yee Na Shin ,  Seung Wook Park

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L24/24 ,  H01L23/3171 ,  H01L24/82 ,  H01L2224/02311 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/185 ,  H05K2201/10674

摘要： There is provided a semiconductor package. A semiconductor package according to an aspect of the invention may include a core part having a semiconductor chip mounted within a receiving space therein; an insulation part provided on one surface of the core part; and a via part provided by filling a hole-processed surface formed simultaneously through the insulation part and a passivation layer for protecting an electrode pattern part on the semiconductor chip.

摘要翻译： 提供半导体封装。 根据本发明的一个方面的半导体封装可以包括具有安装在其中的接收空间内的半导体芯片的芯部分; 绝缘部，设置在所述芯部的一个表面上; 以及通过填充通过绝缘部同时形成的空穴处理表面而提供的通孔部分，以及用于保护半导体芯片上的电极图案部分的钝化层。

公开(公告)号：US08450844B2

公开(公告)日：2013-05-28

申请号：US12805122

申请日：2010-07-13

申请人： Yee Na Shin ,  Seung Wook Park

发明人： Yee Na Shin ,  Seung Wook Park

IPC分类号： H01L23/48

CPC分类号： H01L24/24 ,  H01L23/3171 ,  H01L24/82 ,  H01L2224/02311 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/185 ,  H05K2201/10674

摘要： There is provided a semiconductor package. A semiconductor package according to an aspect of the invention may include a core part having a semiconductor chip mounted within a receiving space therein; an insulation part provided on one surface of the core part; and a via part provided by filling a hole-processed surface formed simultaneously through the insulation part and a passivation layer for protecting an electrode pattern part on the semiconductor chip.

摘要翻译： 提供半导体封装。 根据本发明的一个方面的半导体封装可以包括具有安装在其中的接收空间内的半导体芯片的芯部分; 绝缘部，设置在所述芯部的一个表面上; 以及通过填充通过绝缘部同时形成的空穴处理表面而提供的通孔部分，以及用于保护半导体芯片上的电极图案部分的钝化层。

公开(公告)号：US20130027896A1

公开(公告)日：2013-01-31

申请号：US13358247

申请日：2012-01-25

申请人： Seung Eun LEE ,  Hyun Ho Kim ,  Yee Na Shin

发明人： Seung Eun LEE ,  Hyun Ho Kim ,  Yee Na Shin

IPC分类号： H05K1/18 ,  H05K3/30

CPC分类号： H05K1/185 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/24227 ,  H01L2224/24246 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/12042 ,  H01L2924/3511 ,  H05K1/0206 ,  H05K2201/10416 ,  H05K2203/1469 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/83005

摘要： The present invention relates to an electronic component embedded printed circuit board including: a substrate in which a cavity is formed; a plurality of electronic components embedded in the cavity; a metal member inserted between the plurality of electronic components; and insulating layers formed on both surfaces of the substrate to cover the plurality of electronic components, and it is possible to effectively improve heat radiation characteristics.

摘要翻译： 电子部件嵌入式印刷电路板技术领域本发明涉及电子部件嵌入式印刷电路基板，其特征在于，包括：形成有空腔的基板; 嵌入在所述空腔中的多个电子部件; 插入在所述多个电子部件之间的金属部件; 以及形成在基板的两个表面上以覆盖多个电子部件的绝缘层，并且可以有效地改善散热特性。