SEMICONDUCTOR STORAGE DEVICE
    1.
    发明申请
    SEMICONDUCTOR STORAGE DEVICE 失效
    半导体存储设备

    公开(公告)号:US20120243356A1

    公开(公告)日:2012-09-27

    申请号:US13237562

    申请日:2011-09-20

    IPC分类号: G11C7/12

    CPC分类号: G11C7/12 G11C11/419

    摘要: According to one embodiment, a memory cell stores therein data. In a bit line, a potential changes according to write data to be written in the memory cell. A precharge circuit precharges the bit line. A precharge control circuit controls precharge of the bit line based on the potential of the bit line and the write data.

    摘要翻译: 根据一个实施例,存储单元存储数据。 在位线中,根据要写入存储单元的写入数据,电位变化。 预充电电路对位线进行预充电。 预充电控制电路基于位线和写入数据的电位来控制位线的预充电。

    Semiconductor storage device
    2.
    发明授权
    Semiconductor storage device 失效
    半导体存储设备

    公开(公告)号:US08488401B2

    公开(公告)日:2013-07-16

    申请号:US13237562

    申请日:2011-09-20

    IPC分类号: G11C7/06

    CPC分类号: G11C7/12 G11C11/419

    摘要: According to one embodiment, a memory cell stores therein data. In a bit line, a potential changes according to write data to be written in the memory cell. A precharge circuit precharges the bit line. A precharge control circuit controls precharge of the bit line based on the potential of the bit line and the write data.

    摘要翻译: 根据一个实施例,存储单元存储数据。 在位线中,根据要写入存储单元的写入数据,电位变化。 预充电电路对位线进行预充电。 预充电控制电路基于位线和写入数据的电位来控制位线的预充电。

    Two-Layered Copper-Clad Laminate Material, and Method for Producing Same
    3.
    发明申请
    Two-Layered Copper-Clad Laminate Material, and Method for Producing Same 审中-公开
    两层铜包覆层压材料及其制造方法

    公开(公告)号:US20140011047A1

    公开(公告)日:2014-01-09

    申请号:US13983786

    申请日:2012-01-25

    IPC分类号: H05K1/03 C25D7/00 C23C14/20

    摘要: A two-layered copper-clad laminate material, in which one surface or both surfaces of a polyimide film having a thickness of 12.5 to 50 μm is subjected to a modification treatment by means of a glow discharge plasma treatment in an oxygen gas atmosphere, and a copper layer having a thickness of 1 to 5 μm is formed by means of sputtering or electroplating on one surface or both surfaces of the polyimide film after the modification treatment; characterized in that the integrated intensity ratio of a C1S peak at 287 to 290 eV to a C1S peak at 283 to 287 eV, obtained by analyzing the photoelectron spectroscopy (XPS) spectra of the surface of the polyimide film after the plasma treatment, is within the range of 0.03 to 0.11. The present invention aims at discovering; as a consequence of performing surface characterization by subjecting the PI film surface to XPS analysis before and after the plasma treatment, and of evaluating the dissolution properties and adhesive strength of the PI film before and after the plasma treatment; a two-layered copper-clad laminate material that is ideal to be processed during a wet PI etching step, and a production method for said two-layered copper-clad laminate material.

    摘要翻译: 通过在氧气气氛中的辉光放电等离子体处理对厚度为12.5〜50μm的聚酰亚胺膜的一面或两面进行改性处理的双层覆铜层叠材料, 在改性处理之后,通过溅射或电镀在聚酰亚胺膜的一个表面或两个表面上形成厚度为1至5μm的铜层; 其特征在于,通过分析等离子体处理后聚酰亚胺膜表面的光电子能谱(XPS)光谱获得的287〜290eV的C1S峰与283〜287eV的C1S峰的积分强度比在 范围为0.03〜0.11。 本发明旨在发现; 作为通过在等离子体处理之前和之后对PI膜表面进行XPS分析并且评估PI膜在等离子体处理之前和之后的溶解性能和粘合强度进行表面表征的结果的结果。 在湿式PI蚀刻步骤中理想的加工的双层覆铜层压材料以及所述两层覆铜层压材料的制造方法。

    Radio network controller and transmission power control method
    4.
    发明授权
    Radio network controller and transmission power control method 有权
    无线网络控制器和传输功率控制方法

    公开(公告)号:US08041381B2

    公开(公告)日:2011-10-18

    申请号:US12160524

    申请日:2007-01-10

    IPC分类号: H04B7/00

    摘要: A radio network controller includes a block error detection unit configured to receive a data block from the base station and to detect a block error, and a target SIR calculation unit configured to calculate a target SIR based on the detected block error rate. The target calculation unit sets a first time section, which indicates a time section from a detection of the block error to the notification of the target SIR is to the base station when the block error is detected, shorter than a second time section, which indicates a time section from the detection of the block error to the notification of the target SIR to the base station when the block error is not detected.

    摘要翻译: 无线网络控制器包括块错误检测单元,被配置为从基站接收数据块并检测块错误;目标SIR计算单元,被配置为基于检测到的块错误率来计算目标SIR。 目标计算单元在检测到块错误时比第二时间段设置第一时间段,其表示从块错误的检测到目标SIR的通知的时间段到基站,第二时间段指示 在没有检测到块错误的情况下从检测到块错误到目标SIR的通知的时间部分。

    Coupling part, photosensitive drum, process cartridge and electrophotographic image forming apparatus
    6.
    发明授权
    Coupling part, photosensitive drum, process cartridge and electrophotographic image forming apparatus 失效
    耦合部分,感光鼓,处理盒和电子照相成像设备

    公开(公告)号:US07660545B2

    公开(公告)日:2010-02-09

    申请号:US12271415

    申请日:2008-11-14

    IPC分类号: G03G15/00 G03G21/16

    摘要: A process cartridge detachably mountable to a main assembly of an electrophotographic image forming apparatus, wherein the main assembly includes a motor, a main assembly side gear for receiving driving force from the motor, a hole defined by twisted surfaces, the hole being substantially coaxial with the gear, and a main assembly side grounding contact provided in the hole, the process cartridge includes an electrophotographic photosensitive drum; process mechanisms actable on the photosensitive drum; and a projection engageable with the twisted surfaces, the projection being provided at a longitudinal end of the photosensitive drum, wherein when the main assembly side gear rotates with the hole and projection engaged with each other, rotational driving force is transmitted from the gear to the photosensitive drum through engagement between the hole and the projection; and a cartridge side grounding contact electrically connected with the electrophotographic photosensitive drum for electrically grounding the electrophotographic photosensitive drum when the process cartridge is mounted to the main assembly of the apparatus, the cartridge side grounding contact being provided on the projection so as to be electrically connectable with the main assembly side grounding contact

    摘要翻译: 一种可拆卸地安装到电子照相成像设备的主组件的处理盒,其中主组件包括电动机,用于接收来自电动机的驱动力的主组件侧齿轮,由扭曲表面限定的孔,该孔基本上与 齿轮和设置在孔中的主组件侧接地触点,处理盒包括电子照相感光鼓; 可在感光鼓上作用的加工机构; 以及与所述扭转表面接合的突起,所述突起设置在所述感光鼓的纵向端部,其中当所述主组件侧齿轮随着所述孔和突起彼此接合而旋转时,旋转驱动力从所述齿轮传递到 感光鼓通过孔和突起之间的接合; 以及与电子照相感光鼓电连接的盒侧接地触点,用于当处理盒安装到设备的主组件时将电子照相感光鼓电接地,盒侧接地触点设置在突起上以便可电连接 与主组件侧接地

    Apparatus and method for picking-up semiconductor dies
    7.
    发明申请
    Apparatus and method for picking-up semiconductor dies 审中-公开
    用于拾取半导体管芯的装置和方法

    公开(公告)号:US20090101282A1

    公开(公告)日:2009-04-23

    申请号:US12231706

    申请日:2008-09-05

    IPC分类号: B07C99/00

    CPC分类号: H01L21/67132 Y10T156/1983

    摘要: A die pick-up apparatus and method using a wiper that has a tip end moving in and out of an adherence surface of a die stage and a shutter that is moved with the wiper while blocking a suction window formed in the adherence surface. When picking up a semiconductor die, the tip end of the wiper is aligned with a first end of the die, the wiper is moved along the adherence surface while the tip end of the wiper is protruded from the adherence surface with the die being suction-held by a collet. A suction opening is sequentially opened between a first end surface of the suction window and a seat surface of the wiper as the wiper is moved, and a dicing sheet attached to the die is suctioned into the suction opening that has been opened and sequentially peeled off from the die.

    摘要翻译: 一种模具拾取装置和方法,其使用具有尖端移动进入和离开模具台的粘附表面的刮水器以及与擦拭器一起移动的挡板,同时阻挡形成在粘附表面中的吸入窗口。 当拾取半导体管芯时,擦拭器的尖端与模具的第一端对准,擦拭器沿粘附表面移动,同时擦拭器的末端从附着表面突出, 由夹头夹持。 随着擦拭器的移动,抽吸窗口的第一端面和擦拭器的座面之间依次打开抽吸口,将附着在模具上的切割片吸入已打开并依次剥离的抽吸口 从死亡。

    Apparatus and method for picking-up semiconductor dies
    8.
    发明申请
    Apparatus and method for picking-up semiconductor dies 审中-公开
    用于拾取半导体管芯的装置和方法

    公开(公告)号:US20090075459A1

    公开(公告)日:2009-03-19

    申请号:US12231752

    申请日:2008-09-05

    IPC分类号: H01L21/304 H01L21/67

    CPC分类号: H01L21/67132 H01L21/6838

    摘要: A die pick-up apparatus and method using a die stage having an adherence surface, a suction window formed in the adherence surface and larger than a semiconductor die to be picked up, and a cover plate that slides along the adherence surface and opens and closes the suction window. When picking up the semiconductor die, the surface of the cover plate is caused to be closely contacted to a dicing sheet that is attached to the die so that the die is within the boundary of the upper surface of the cover plate that closes the suction window, and then the dicing sheet is sequentially peeled off as, while the die is being suctioned by a collet, the cover plate gradually slides to sequentially open the suction window and allow the dicing sheet to be suctioned into the opened suction window.

    摘要翻译: 一种模具拾取装置和方法,使用具有粘附表面的模具台,形成在粘附表面上的大于被拾取的半导体模具的吸入窗口,以及沿着粘附表面滑动并打开和关闭的盖板 抽窗。 当拾取半导体管芯时,使盖板的表面与附接到模具的切割片紧密接触,使得模具在关闭吸入窗口的盖板的上表面的边界内 然后在模具被夹头吸引的同时依次剥离切割片,盖板逐渐滑动以依次打开抽吸窗口并允许切割片被吸入打开的抽吸窗口中。

    Coupling part, photosensitive drum, process cartridge and electrophotographic image forming apparatus
    9.
    发明申请
    Coupling part, photosensitive drum, process cartridge and electrophotographic image forming apparatus 有权
    耦合部分,感光鼓,处理盒和电子照相成像设备

    公开(公告)号:US20060008287A1

    公开(公告)日:2006-01-12

    申请号:US11221766

    申请日:2005-09-09

    IPC分类号: G03G15/00

    摘要: A process cartridge detachably mountable to a main assembly of an electrophotographic image forming apparatus, wherein the main assembly includes a motor, a main assembly side gear for receiving driving force from the motor, a hole defined by twisted surfaces, the hole being substantially coaxial with the gear, and a main assembly side grounding contact provided in the hole, the process cartridge includes an electrophotographic photosensitive drum; process mechanisms actable on the photosensitive drum; and a projection engageable with the twisted surfaces, the projection being provided at a longitudinal end of the photosensitive drum, wherein when the main assembly side gear rotates with the hole and projection engaged with each other, rotational driving force is transmitted from the gear to the photosensitive drum through engagement between the hole and the projection; and a cartridge side grounding contact electrically connected with the electrophotographic photosensitive drum for electrically grounding the electrophotographic photosensitive drum when the process cartridge is mounted to the main assembly of the apparatus, the cartridge side grounding contact being provided on the projection so as to be electrically connectable with the main assembly side grounding contact

    摘要翻译: 一种可拆卸地安装到电子照相成像设备的主组件的处理盒,其中主组件包括电动机,用于接收来自电动机的驱动力的主组件侧齿轮,由扭曲表面限定的孔,该孔基本上与 齿轮和设置在孔中的主组件侧接地触点,处理盒包括电子照相感光鼓; 可在感光鼓上作用的加工机构; 以及与所述扭转表面接合的突起,所述突起设置在所述感光鼓的纵向端部,其中当所述主组件侧齿轮随着所述孔和突起彼此接合而旋转时,旋转驱动力从所述齿轮传递到 感光鼓通过孔和突起之间的接合; 以及与电子照相感光鼓电连接的盒侧接地触点,用于当处理盒安装到设备的主组件时将电子照相感光鼓电接地,盒侧接地触点设置在突起上以便可电连接 与主组件侧接地

    Process cartridge and electrophotographic image forming apparatus
    10.
    发明授权
    Process cartridge and electrophotographic image forming apparatus 失效
    处理盒和电子照相成像设备

    公开(公告)号:US06324363B1

    公开(公告)日:2001-11-27

    申请号:US08939128

    申请日:1997-09-26

    IPC分类号: G03G2116

    摘要: A process cartridge detachably mountable to a main assembly of an electrophotographic image forming apparatus, wherein the main assembly includes a motor, a main assembly side gear for receiving driving force from the motor and a hole defined by twisted surfaces, the hole being substantially coaxial with the gear, the process cartridge includes an electrophotographic photosensitive drum; process means actable on the photosensitive drum; and a projection engageable with the twisted surfaces, the projection being provided at a longitudinal end of the photosensitive drum, wherein the projection is non-twisted, and when the main assembly side gear rotates with the hole and projection engaged with each other, rotational driving force is transmitted from the gear to the photosensitive drum through engagement between the hole and the projection.

    摘要翻译: 一种可拆卸地安装到电子照相成像设备的主组件的处理盒,其中主组件包括电动机,用于接收来自电动机的驱动力的主组件侧齿轮和由扭曲表面限定的孔,该孔基本上与 该处理盒包括电子照相感光鼓; 可在感光鼓上作用的处理装置; 以及与所述扭转表面接合的突起,所述突起设置在所述感光鼓的纵向端部处,其中所述突起不被扭曲,并且当所述主组件侧齿轮随着所述孔和突起彼此接合而旋转时,旋转驱动 力通过孔和突起之间的接合从齿轮传递到感光鼓。