公开(公告)号：US20150344299A1

公开(公告)日：2015-12-03

申请号：US14821010

申请日：2015-08-07

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Hong-Da Chang ,  Hsin-Yi Liao ,  Chun-An Huang ,  Shih-Kuang Chiu ,  Chien-An Chen

IPC: B81C1/00

CPC classification number: B81C1/00301 ,  B81B2201/0264 ,  B81C1/00269 ,  B81C2203/0154 ,  H01L29/84 ,  H01L2224/48091 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A wafer level package having a pressure sensor and a fabrication method thereof are provided. A wafer having the pressure sensor is bonded to a lid, and electrical connecting pads are formed on the wafer. After the lid is cut, wire-bonding and packaging processes are performed. Ends of bonding wires are exposed and serve as an electrical connecting path. A bottom opening is formed on a bottom surface of the wafer, in order to form a pressure sensor path.

Abstract translation: 提供了具有压力传感器及其制造方法的晶片级封装。 将具有压力传感器的晶片接合到盖上，并且在晶片上形成电连接焊盘。 在切割盖子之后，进行引线键合和封装处理。 接合线的端部暴露并用作电连接路径。 为了形成压力传感器路径，在晶片的底面上形成底部开口。

公开(公告)号：US08741693B2

公开(公告)日：2014-06-03

申请号：US14078845

申请日：2013-11-13

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chun-An Huang ,  Hsin-Yi Liao ,  Shih-Kuang Chiu

IPC: H01L21/00 ,  H01L29/84 ,  H01L21/50

CPC classification number: H01L29/84 ,  B81B7/007 ,  B81B2207/096 ,  B81C1/00301 ,  H01L21/50 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package structure includes a micro-electromechanical element having a plurality of electrical contacts; a package layer enclosing the micro-electromechanical element and the electrical contacts, with a bottom surface of the micro-electromechanical element exposed from a lower surface of the package layer; a plurality of bonding wires embedded in the package layer, each of the bonding wires having one end connected to one of the electrical contacts, and the other end exposed from the lower surface of the package layer; and a build-up layer structure provided on the lower surface of the package layer, the build-up layer including at least one dielectric layer and a plurality of conductive blind vias formed in the dielectric layer and electrically connected to one ends of the bonding wires. The package structure is easier to accurately control the location of an external electrical contact, and the compatibility of the manufacturing procedures is high.

Abstract translation: 封装结构包括具有多个电触头的微机电元件; 封装层，其包围微机电元件和电触点，微机电元件的底表面从封装层的下表面露出; 嵌入在所述封装层中的多个接合线，每个所述接合线的一端连接到所述电接触中的一个，另一端从所述封装层的下表面露出; 以及设置在所述封装层的下表面上的堆积层结构，所述堆积层包括形成在所述电介质层中并且电连接到所述接合线的一端的至少一个电介质层和多个导电盲孔 。 封装结构更容易准确地控制外部电触点的位置，并且制造程序的兼容性高。

公开(公告)号：US09487393B2

公开(公告)日：2016-11-08

申请号：US14821010

申请日：2015-08-07

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Hong-Da Chang ,  Hsin-Yi Liao ,  Chun-An Huang ,  Shih-Kuang Chiu ,  Chien-An Chen

IPC: H01L29/00 ,  B81C1/00 ,  H01L29/84

CPC classification number: B81C1/00301 ,  B81B2201/0264 ,  B81C1/00269 ,  B81C2203/0154 ,  H01L29/84 ,  H01L2224/48091 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A wafer level package having a pressure sensor and a fabrication method thereof are provided. A wafer having the pressure sensor is bonded to a lid, and electrical connecting pads are formed on the wafer. After the lid is cut, wire-bonding and packaging processes are performed. Ends of bonding wires are exposed and serve as an electrical connecting path. A bottom opening is formed on a bottom surface of the wafer, in order to form a pressure sensor path.

Abstract translation: 提供了具有压力传感器及其制造方法的晶片级封装。 将具有压力传感器的晶片接合到盖上，并且在晶片上形成电连接焊盘。 在切割盖子之后，进行引线键合和封装处理。 接合线的端部暴露并用作电连接路径。 为了形成压力传感器路径，在晶片的底面上形成底部开口。

公开(公告)号：US20140080242A1

公开(公告)日：2014-03-20

申请号：US14078845

申请日：2013-11-13

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chun-An Huang ,  Hsin-Yi Liao ,  Shih-Kuang Chiu

IPC: B81C1/00

CPC classification number: H01L29/84 ,  B81B7/007 ,  B81B2207/096 ,  B81C1/00301 ,  H01L21/50 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package structure includes a micro-electromechanical element having a plurality of electrical contacts; a package layer enclosing the micro-electromechanical element and the electrical contacts, with a bottom surface of the micro-electromechanical element exposed from a lower surface of the package layer; a plurality of bonding wires embedded in the package layer, each of the bonding wires having one end connected to one of the electrical contacts, and the other end exposed from the lower surface of the package layer; and a build-up layer structure provided on the lower surface of the package layer, the build-up layer including at least one dielectric layer and a plurality of conductive blind vias formed in the dielectric layer and electrically connected to one ends of the bonding wires. The package structure is easier to accurately control the location of an external electrical contact, and the compatibility of the manufacturing procedures is high.

Abstract translation: 封装结构包括具有多个电触头的微机电元件; 封装层，其包围微机电元件和电触点，微机电元件的底表面从封装层的下表面露出; 嵌入在所述封装层中的多个接合线，每个所述接合线的一端连接到所述电接触中的一个，另一端从所述封装层的下表面露出; 以及设置在所述封装层的下表面上的堆积层结构，所述堆积层包括至少一个电介质层和形成在所述电介质层中并且电连接到所述接合线的一端的多个导电盲孔 。 封装结构更容易精确地控制外部电触头的位置，并且制造程序的兼容性高。