公开(公告)号：US10201086B2

公开(公告)日：2019-02-05

申请号：US15295010

申请日：2016-10-17

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Lu-Yi Chen ,  Cheng-Hsiang Liu ,  Chang-Lun Lu ,  Jun-Cheng Liao ,  Cheng-Yi Chen

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/34

Abstract: An electronic device includes a circuit board having a plurality of conductive contacts, and an electronic component disposed on the circuit board and having a plurality of electrode terminals. The conductive contacts include a plurality of solder pads spaced apart from each other, and are coupled to the electrode terminals, respectively. The stress generated by any one of the electrode terminals is distributed to all of the solder pads so as to prevent the electronic component from being offset during an assembly process.

公开(公告)号：US20180042112A1

公开(公告)日：2018-02-08

申请号：US15295010

申请日：2016-10-17

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Lu-Yi Chen ,  Cheng-Hsiang Liu ,  Chang-Lun Lu ,  Jun-Cheng Liao ,  Cheng-Yi Chen

IPC: H05K1/18 ,  H05K3/34 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/111 ,  H05K3/341 ,  H05K3/3442 ,  H05K2201/09663 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic device includes a circuit board having a plurality of conductive contacts, and an electronic component disposed on the circuit board and having a plurality of electrode terminals. The conductive contacts include a plurality of solder pads spaced apart from each other, and are coupled to the electrode terminals, respectively. The stress generated by any one of the electrode terminals is distributed to all of the solder pads so as to prevent the electronic component from being offset during an assembly process.