公开(公告)号：US08878356B2

公开(公告)日：2014-11-04

申请号：US13660200

申请日：2012-10-25

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Hong-Da Chang ,  Cheng-Hsiang Liu ,  Kuang-Wei Huang ,  Chun-Hung Lin ,  Hsin-Yi Liao

IPC: H01L23/48 ,  H01L23/22 ,  H01L23/24 ,  H01L23/051 ,  H01L23/053 ,  H01L23/043

CPC classification number: H01L23/051 ,  B81B7/0064 ,  B81B2207/092 ,  B81C2203/0154 ,  H01L23/043 ,  H01L23/053 ,  H01L24/48 ,  H01L2224/48 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A package structure is provided, including: a substrate having a ground pad and an MEMS element; a lid disposed on the substrate for covering the MEMS element; a wire segment electrically connected to the ground pad; an encapsulant encapsulating the lid and the wire segment; and a circuit layer formed on the encapsulant and electrically connected to the wire segment and the lid so as to commonly ground the substrate and the lid, thereby releasing accumulated electric charges on the lid so as to improve the reliability of the MEMS system and reduce the number of I/O connections.

Abstract translation: 提供一种封装结构，包括：具有接地焊盘和MEMS元件的衬底; 设置在所述基板上用于覆盖所述MEMS元件的盖; 电连接到接地垫的线段; 封装盖和线段的密封剂; 以及形成在密封剂上并电连接到线段和盖子上的电路层，以便共同接地衬底和盖子，从而释放盖上的积累的电荷，从而提高MEMS系统的可靠性并减少 I / O连接数。

公开(公告)号：US10201086B2

公开(公告)日：2019-02-05

申请号：US15295010

申请日：2016-10-17

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Lu-Yi Chen ,  Cheng-Hsiang Liu ,  Chang-Lun Lu ,  Jun-Cheng Liao ,  Cheng-Yi Chen

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/34

Abstract: An electronic device includes a circuit board having a plurality of conductive contacts, and an electronic component disposed on the circuit board and having a plurality of electrode terminals. The conductive contacts include a plurality of solder pads spaced apart from each other, and are coupled to the electrode terminals, respectively. The stress generated by any one of the electrode terminals is distributed to all of the solder pads so as to prevent the electronic component from being offset during an assembly process.

公开(公告)号：US20180042112A1

公开(公告)日：2018-02-08

申请号：US15295010

申请日：2016-10-17

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Lu-Yi Chen ,  Cheng-Hsiang Liu ,  Chang-Lun Lu ,  Jun-Cheng Liao ,  Cheng-Yi Chen

IPC: H05K1/18 ,  H05K3/34 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/111 ,  H05K3/341 ,  H05K3/3442 ,  H05K2201/09663 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic device includes a circuit board having a plurality of conductive contacts, and an electronic component disposed on the circuit board and having a plurality of electrode terminals. The conductive contacts include a plurality of solder pads spaced apart from each other, and are coupled to the electrode terminals, respectively. The stress generated by any one of the electrode terminals is distributed to all of the solder pads so as to prevent the electronic component from being offset during an assembly process.