公开(公告)号：US07159758B1

公开(公告)日：2007-01-09

申请号：US10607400

申请日：2003-06-26

申请人： Stuart D. Downes ,  Larry Norris ,  Jin Liang

发明人： Stuart D. Downes ,  Larry Norris ,  Jin Liang

IPC分类号： B23K31/02

CPC分类号： B23K1/0016 ,  H05K3/1216 ,  H05K3/26 ,  H05K3/3484 ,  H05K2203/043 ,  H05K2203/0545

摘要： A circuit board processing system has a circuit board fabrication stage configured to fabricate a circuit board having a set of circuit board pads, and a solder fusing stage coupled to the circuit board fabrication stage. The solder fusing stage is configured to (i) apply flux and solder concurrently to the set of circuit board pads, and (ii) activate the flux and melt the solder to form a set of substantially flat solder coatings which is fused to the set of circuit board pads. The circuit board processing system further includes a washing stage coupled to the solder fusing stage. The washing stage is configured to remove contamination from a surface of the circuit board having the circuit board pads and from the set of substantially flat solder coatings which is fused to the set of circuit board pads. Such a system is well-suited for lead-free solder.

摘要翻译： 电路板处理系统具有电路板制造台，其被配置为制造具有一组电路板焊盘的电路板，以及耦合到电路板制造阶段的焊料熔合级。 焊料熔合阶段被配置为（i）同时向该组电路板焊盘施加焊剂和焊料，以及（ii）激活焊剂并熔化焊料以形成一组基本上平坦的焊料涂层，其熔合到该组焊接 电路板垫。 电路板处理系统还包括耦合到焊料熔合级的洗涤级。 洗涤阶段被配置为从具有电路板焊盘的电路板的表面以及熔融到该组电路板焊盘的一组基本上平坦的焊料涂层去除污染物。 这种系统非常适合无铅焊料。

公开(公告)号：US07416106B1

公开(公告)日：2008-08-26

申请号：US10674080

申请日：2003-09-29

申请人： Stuart D. Downes ,  Jin Liang ,  Larry Norris

发明人： Stuart D. Downes ,  Jin Liang ,  Larry Norris

IPC分类号： B23K31/02

CPC分类号： B23K1/0016 ,  B23K2101/40 ,  B23K2101/42 ,  H05K1/111 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/099 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

摘要： A technique for processing a circuit board involves placing a mask layer on the circuit board, where the mask layer defines a set of pad profiles for a component mounting location. Each pad profile has a set of rounded corners. The technique further involves forming, for each pad profile, a soldering pad having a set of radii corresponding to the set of rounded corners of that pad profile to create a set of soldering pads for the component mounting location. Each soldering pad is configured for a high bond strength solder joint. The technique further involves removing the mask layer from the circuit board and soldering a component to the component mounting location. This technique is well-suited for robustly mounting the component to the circuit board at solder joints with relatively high solder joint bond strengths.

摘要翻译： 一种用于处理电路板的技术包括将掩模层放置在电路板上，其中掩模层限定用于部件安装位置的一组焊盘轮廓。 每个垫子轮廓都有一组圆角。 该技术还涉及为每个焊盘型材形成具有与该焊盘型材的一组圆角对应的一组半径的焊盘，以形成用于部件安装位置的一组焊盘。 每个焊盘都配置为高粘结强度的焊点。 该技术还包括从电路板去除掩模层并将部件焊接到部件安装位置。 这种技术非常适合在具有相对高的焊点接合强度的焊点处牢固地将部件安装到电路板上。