公开(公告)号：US08603906B2

公开(公告)日：2013-12-10

申请号：US13779334

申请日：2013-02-27

申请人： Sunil Shim ,  Sunghoi Hur ,  Hansoo Kim ,  Jaehoon Jang ,  Hoosung Cho

发明人： Sunil Shim ,  Sunghoi Hur ,  Hansoo Kim ,  Jaehoon Jang ,  Hoosung Cho

IPC分类号： H01L21/3205 ,  H01L21/4763

CPC分类号： H01L21/02365 ,  H01L21/02697 ,  H01L27/11565 ,  H01L27/11575 ,  H01L27/11578 ,  H01L27/11582

摘要： Provided is a three-dimensional semiconductor memory device. The three-dimensional semiconductor memory device includes a substrate that has a cell array region including a pair of sub-cell regions and a strapping region interposed between the pair of sub-cell regions. A Plurality of sub-gates are sequentially stacked on the substrate in each of the sub-cell regions, and interconnections are electrically connected to extensions of the stacked sub-gates, respectively, which extend into the strapping region. Each of the interconnections is electrically connected to the extensions of the sub-gate which are disposed in the pair of the sub-cell regions, respectively, and which are located at the same level.

摘要翻译： 提供一种三维半导体存储器件。 三维半导体存储器件包括具有包括一对子单元区域的单元阵列区域和插入该一对子单元区域之间的带状区域的基板。 多个子栅极依次层叠在每个子单元区域中的衬底上，并且互连电连接到延伸到捆扎区域中的堆叠子栅极的延伸部分。 每个互连电连接到分别设置在一对子单元区域中并且位于同一电平的子栅极的延伸部分。

公开(公告)号：US08395190B2

公开(公告)日：2013-03-12

申请号：US12943126

申请日：2010-11-10

申请人： Sunil Shim ,  Sunghoi Hur ,  Hansoo Kim ,  Jaehoon Jang ,  Hoosung Cho

发明人： Sunil Shim ,  Sunghoi Hur ,  Hansoo Kim ,  Jaehoon Jang ,  Hoosung Cho

IPC分类号： H01L23/52

CPC分类号： H01L21/02365 ,  H01L21/02697 ,  H01L27/11565 ,  H01L27/11575 ,  H01L27/11578 ,  H01L27/11582

摘要： Provided is a three-dimensional semiconductor memory device. The three-dimensional semiconductor memory device includes a substrate that has a cell array region including a pair of sub-cell regions and a strapping region interposed between the pair of sub-cell regions. A Plurality of sub-gates are sequentially stacked on the substrate in each of the sub-cell regions, and interconnections are electrically connected to extensions of the stacked sub-gates, respectively, which extend into the strapping region. Each of the interconnections is electrically connected to the extensions of the sub-gate which are disposed in the pair of the sub-cell regions, respectively, and which are located at the same level.

摘要翻译： 提供一种三维半导体存储器件。 三维半导体存储器件包括具有包括一对子单元区域的单元阵列区域和插入该一对子单元区域之间的带状区域的基板。 多个子栅极依次层叠在每个子单元区域中的衬底上，并且互连电连接到延伸到捆扎区域中的堆叠子栅极的延伸部分。 每个互连电连接到分别设置在一对子单元区域中并且位于同一电平的子栅极的延伸部分。

公开(公告)号：US20130171806A1

公开(公告)日：2013-07-04

申请号：US13779334

申请日：2013-02-27

申请人： Sunil Shim ,  Sunghoi Hur ,  Hansoo Kim ,  Jaehoon Jang ,  Hoosung Cho

发明人： Sunil Shim ,  Sunghoi Hur ,  Hansoo Kim ,  Jaehoon Jang ,  Hoosung Cho

IPC分类号： H01L21/02

CPC分类号： H01L21/02365 ,  H01L21/02697 ,  H01L27/11565 ,  H01L27/11575 ,  H01L27/11578 ,  H01L27/11582

摘要： Provided is a three-dimensional semiconductor memory device. The three-dimensional semiconductor memory device includes a substrate that has a cell array region including a pair of sub-cell regions and a strapping region interposed between the pair of sub-cell regions. A Plurality of sub-gates are sequentially stacked on the substrate in each of the sub-cell regions, and interconnections are electrically connected to extensions of the stacked sub-gates, respectively, which extend into the strapping region. Each of the interconnections is electrically connected to the extensions of the sub-gate which are disposed in the pair of the sub-cell regions, respectively, and which are located at the same level.

摘要翻译： 提供一种三维半导体存储器件。 三维半导体存储器件包括具有包括一对子单元区域的单元阵列区域和插入该一对子单元区域之间的带状区域的基板。 多个子栅极依次层叠在每个子单元区域中的衬底上，并且互连电连接到延伸到捆扎区域中的堆叠子栅极的延伸部分。 每个互连电连接到分别设置在一对子单元区域中并且位于同一电平的子栅极的延伸部分。

公开(公告)号：US20110115010A1

公开(公告)日：2011-05-19

申请号：US12943126

申请日：2010-11-10

申请人： Sunil Shim ,  Sunghoi Hur ,  Hansoo Kim ,  Jaehoon Jang ,  Hoosung Cho

发明人： Sunil Shim ,  Sunghoi Hur ,  Hansoo Kim ,  Jaehoon Jang ,  Hoosung Cho

IPC分类号： H01L27/11

CPC分类号： H01L21/02365 ,  H01L21/02697 ,  H01L27/11565 ,  H01L27/11575 ,  H01L27/11578 ,  H01L27/11582

摘要： Provided is a three-dimensional semiconductor memory device. The three-dimensional semiconductor memory device includes a substrate that has a cell array region including a pair of sub-cell regions and a strapping region interposed between the pair of sub-cell regions. A Plurality of sub-gates are sequentially stacked on the substrate in each of the sub-cell regions, and interconnections are electrically connected to extensions of the stacked sub-gates, respectively, which extend into the strapping region. Each of the interconnections is electrically connected to the extensions of the sub-gate which are disposed in the pair of the sub-cell regions, respectively, and which are located at the same level.

摘要翻译： 提供一种三维半导体存储器件。 三维半导体存储器件包括具有包括一对子单元区域的单元阵列区域和插入该一对子单元区域之间的带状区域的基板。 多个子栅极依次层叠在每个子单元区域中的衬底上，并且互连电连接到延伸到捆扎区域中的堆叠子栅极的延伸部分。 每个互连电连接到分别设置在一对子单元区域中并且位于同一电平的子栅极的延伸部分。

公开(公告)号：US08278170B2

公开(公告)日：2012-10-02

申请号：US13165576

申请日：2011-06-21

申请人： Changhyun Lee ,  Sunil Shim ,  Jaehoon Jang ,  Sunghoi Hur ,  Hansoo Kim ,  Kihyun Kim

发明人： Changhyun Lee ,  Sunil Shim ,  Jaehoon Jang ,  Sunghoi Hur ,  Hansoo Kim ,  Kihyun Kim

IPC分类号： H01L21/336

CPC分类号： G11C16/28 ,  G11C16/14 ,  H01L27/11551 ,  H01L27/11556 ,  H01L27/11578 ,  H01L29/7889 ,  H01L29/7926

摘要： Methods of forming nonvolatile memory devices according to embodiments of the invention include techniques to form highly integrated vertical stacks of nonvolatile memory cells. These vertical stacks of memory cells can utilize dummy memory cells to compensate for process artifacts that would otherwise yield relatively poor functioning memory cell strings when relatively large numbers of memory cells are stacked vertically on a semiconductor substrate using a plurality of vertical sub-strings electrically connected in series.

摘要翻译： 形成根据本发明的实施例的非易失性存储器件的方法包括形成非易失性存储器单元的高度集成的垂直堆叠的技术。 这些垂直堆叠的存储器单元可以利用虚拟存储器单元来补偿当相对大量的存储单元垂直地堆叠在半导体衬底上时使用电连接的多个垂直子串的过程伪像，否则会产生相对较差的功能性存储单元串 系列。

公开(公告)号：US09012977B2

公开(公告)日：2015-04-21

申请号：US14154834

申请日：2014-01-14

申请人： Sunil Shim ,  Jaehun Jeong ,  Hansoo Kim ,  Su-Youn Yi ,  Jaehoon Jang ,  Sunghoi Hur

发明人： Sunil Shim ,  Jaehun Jeong ,  Hansoo Kim ,  Su-Youn Yi ,  Jaehoon Jang ,  Sunghoi Hur

IPC分类号： H01L29/792 ,  H01L29/66 ,  H01L27/02 ,  H01L27/115

CPC分类号： H01L27/0207 ,  H01L27/11565 ,  H01L27/11578 ,  H01L27/11582 ,  H01L29/7926

摘要： Provided is a semiconductor memory device. In the semiconductor memory device, a lower selection gate controls a first channel region that is defined at a semiconductor substrate and a second channel region that is defined at the lower portion of an active pattern disposed on the semiconductor substrate. The first threshold voltage of the first channel region is different from the second threshold voltage of the second channel region.

摘要翻译： 提供了一种半导体存储器件。 在半导体存储器件中，下部选择栅极控制限定在半导体衬底上的第一沟道区和限定在设置在半导体衬底上的有源图案的下部的第二沟道区。 第一沟道区的第一阈值电压不同于第二沟道区的第二阈值电压。

公开(公告)号：US08546869B2

公开(公告)日：2013-10-01

申请号：US13600829

申请日：2012-08-31

申请人： Changhyun Lee ,  Sunil Shim ,  Jaehoon Jang ,  Sunghoi Hur ,  Hansoo Kim ,  Kihyun Kim

发明人： Changhyun Lee ,  Sunil Shim ,  Jaehoon Jang ,  Sunghoi Hur ,  Hansoo Kim ,  Kihyun Kim

IPC分类号： H01L21/8239

CPC分类号： G11C16/28 ,  G11C16/14 ,  H01L27/11551 ,  H01L27/11556 ,  H01L27/11578 ,  H01L29/7889 ,  H01L29/7926

摘要： Methods of forming nonvolatile memory devices according to embodiments of the invention include techniques to form highly integrated vertical stacks of nonvolatile memory cells. These vertical stacks of memory cells can utilize dummy memory cells to compensate for process artifacts that would otherwise yield relatively poor functioning memory cell strings when relatively large numbers of memory cells are stacked vertically on a semiconductor substrate using a plurality of vertical sub-strings electrically connected in series.

摘要翻译： 形成根据本发明的实施例的非易失性存储器件的方法包括形成非易失性存储器单元的高度集成的垂直堆叠的技术。 这些垂直堆叠的存储器单元可以利用虚拟存储器单元来补偿当相对大量的存储单元垂直地堆叠在半导体衬底上时使用电连接的多个垂直子串的过程伪像，否则会产生相对较差的功能性存储单元串 系列。

公开(公告)号：US20130075807A1

公开(公告)日：2013-03-28

申请号：US13684857

申请日：2012-11-26

申请人： Sunil Shim ,  Jaehun Jeong ,  Hansoo Kim ,  Sunghoi Hur ,  Jaehoon Jang ,  Su-Youn Yi

发明人： Sunil Shim ,  Jaehun Jeong ,  Hansoo Kim ,  Sunghoi Hur ,  Jaehoon Jang ,  Su-Youn Yi

IPC分类号： H01L29/792

CPC分类号： H01L27/0207 ,  H01L27/11565 ,  H01L27/11578 ,  H01L27/11582 ,  H01L29/7926

摘要： Provided is a semiconductor memory device. In the semiconductor memory device, a lower selection gate controls a first channel region that is defined at a semiconductor substrate and a second channel region that is defined at the lower portion of an active pattern disposed on the semiconductor substrate. The first threshold voltage of the first channel region is different from the second threshold voltage of the second channel region.

摘要翻译： 提供了一种半导体存储器件。 在半导体存储器件中，下部选择栅极控制限定在半导体衬底上的第一沟道区和限定在设置在半导体衬底上的有源图案的下部的第二沟道区。 第一沟道区的第一阈值电压不同于第二沟道区的第二阈值电压。

公开(公告)号：US20120327715A1

公开(公告)日：2012-12-27

申请号：US13600829

申请日：2012-08-31

申请人： Changhyun Lee ,  Sunil Shim ,  Jaehoon Jang ,  Sunghoi Hur ,  Hansoo Kim ,  Kihyun Kim

发明人： Changhyun Lee ,  Sunil Shim ,  Jaehoon Jang ,  Sunghoi Hur ,  Hansoo Kim ,  Kihyun Kim

IPC分类号： G11C16/06

CPC分类号： G11C16/28 ,  G11C16/14 ,  H01L27/11551 ,  H01L27/11556 ,  H01L27/11578 ,  H01L29/7889 ,  H01L29/7926

摘要： Methods of forming nonvolatile memory devices according to embodiments of the invention include techniques to form highly integrated vertical stacks of nonvolatile memory cells. These vertical stacks of memory cells can utilize dummy memory cells to compensate for process artifacts that would otherwise yield relatively poor functioning memory cell strings when relatively large numbers of memory cells are stacked vertically on a semiconductor substrate using a plurality of vertical sub-strings electrically connected in series.

摘要翻译： 形成根据本发明的实施例的非易失性存储器件的方法包括形成非易失性存储器单元的高度集成的垂直堆叠的技术。 这些垂直堆叠的存储器单元可以利用虚拟存储器单元来补偿当相对大量的存储单元垂直地堆叠在半导体衬底上时使用电连接的多个垂直子串的过程伪像，否则会产生相对较差的功能性存储单元串 系列。

公开(公告)号：US20140124846A1

公开(公告)日：2014-05-08

申请号：US14154834

申请日：2014-01-14

申请人： Sunil Shim ,  Jaehun Jeong ,  Hansoo Kim ,  Su-Youn Yi ,  Jaehoon Jang ,  Sunghoi Hur

发明人： Sunil Shim ,  Jaehun Jeong ,  Hansoo Kim ,  Su-Youn Yi ,  Jaehoon Jang ,  Sunghoi Hur

IPC分类号： H01L27/02

CPC分类号： H01L27/0207 ,  H01L27/11565 ,  H01L27/11578 ,  H01L27/11582 ,  H01L29/7926

摘要： Provided is a semiconductor memory device. In the semiconductor memory device, a lower selection gate controls a first channel region that is defined at a semiconductor substrate and a second channel region that is defined at the lower portion of an active pattern disposed on the semiconductor substrate. The first threshold voltage of the first channel region is different from the second threshold voltage of the second channel region.

摘要翻译： 提供了一种半导体存储器件。 在半导体存储器件中，下部选择栅极控制限定在半导体衬底上的第一沟道区和限定在设置在半导体衬底上的有源图案的下部的第二沟道区。 第一沟道区的第一阈值电压不同于第二沟道区的第二阈值电压。