PROGRAMMING METHODS FOR THREE-DIMENSIONAL MEMORY DEVICES HAVING MULTI-BIT PROGRAMMING, AND THREE-DIMENSIONAL MEMORY DEVICES PROGRAMMED THEREBY
    6.
    发明申请
    PROGRAMMING METHODS FOR THREE-DIMENSIONAL MEMORY DEVICES HAVING MULTI-BIT PROGRAMMING, AND THREE-DIMENSIONAL MEMORY DEVICES PROGRAMMED THEREBY 有权
    具有多位编程的三维存储器件的编程方法,以及编程的三维存储器件

    公开(公告)号:US20100322000A1

    公开(公告)日:2010-12-23

    申请号:US12818285

    申请日:2010-06-18

    IPC分类号: G11C16/04

    摘要: In a method of multiple-bit programming of a three-dimensional memory device having arrays of memory cells that extend in horizontal and vertical directions relative to a substrate, the method comprises first programming a memory cell to be programmed to one among a first set of states. At least one neighboring memory cell that neighbors the memory cell to be programmed to one among the first set of states is then first programmed. Following the first programming of the at least one neighboring memory cell, second programming the memory cell to be programmed to one among a second set of states, wherein the second set of states has a number of states that is greater than the number of states in the first set of states.

    摘要翻译: 在具有相对于衬底在水平和垂直方向上延伸的存储器单元阵列的三维存储器件的多位编程的方法中,该方法包括首先将要编程的存储器单元编程为第一组 状态。 然后,首先对与第一组状态中的一个相邻的要存储单元相邻的至少一个相邻存储单元进行编程。 在对所述至少一个相邻存储器单元进行第一编程之后,将要编程的存储器单元的第二编程为第二组状态之一,其中所述第二组状态具有大于所述状态数 第一套状态。

    PROGRAMMING METHODS FOR THREE-DIMENSIONAL MEMORY DEVICES HAVING MULTI-BIT PROGRAMMING, AND THREE-DIMENSIONAL MEMORY DEVICES PROGRAMMED THEREBY
    7.
    发明申请
    PROGRAMMING METHODS FOR THREE-DIMENSIONAL MEMORY DEVICES HAVING MULTI-BIT PROGRAMMING, AND THREE-DIMENSIONAL MEMORY DEVICES PROGRAMMED THEREBY 有权
    具有多位编程的三维存储器件的编程方法,以及编程的三维存储器件

    公开(公告)号:US20130322172A1

    公开(公告)日:2013-12-05

    申请号:US13962451

    申请日:2013-08-08

    IPC分类号: G11C16/10

    摘要: In a method of multiple-bit programming of a three-dimensional memory device having arrays of memory cells that extend in horizontal and vertical directions relative to a substrate, the method comprises first programming a memory cell to be programmed to one among a first set of states. At least one neighboring memory cell that neighbors the memory cell to be programmed to one among the first set of states is then first programmed. Following the first programming of the at least one neighboring memory cell, second programming the memory cell to be programmed to one among a second set of states, wherein the second set of states has a number of states that is greater than the number of states in the first set of states.

    摘要翻译: 在具有相对于衬底在水平和垂直方向上延伸的存储器单元阵列的三维存储器件的多位编程的方法中,该方法包括首先将要编程的存储器单元编程为第一组 状态。 然后,首先对与第一组状态中的一个相邻的要存储单元相邻的至少一个相邻存储单元进行编程。 在对所述至少一个相邻存储器单元进行第一编程之后,将要编程的存储器单元的第二编程为第二组状态之一,其中所述第二组状态具有大于所述状态数 第一套状态。

    Programming methods for three-dimensional memory devices having multi-bit programming, and three-dimensional memory devices programmed thereby
    8.
    发明授权
    Programming methods for three-dimensional memory devices having multi-bit programming, and three-dimensional memory devices programmed thereby 有权
    具有多位编程的三维存储器件的编程方法以及由此编程的三维存储器件

    公开(公告)号:US08514625B2

    公开(公告)日:2013-08-20

    申请号:US12818285

    申请日:2010-06-18

    IPC分类号: G11C16/00

    摘要: In a method of multiple-bit programming of a three-dimensional memory device having arrays of memory cells that extend in horizontal and vertical directions relative to a substrate, the method comprises first programming a memory cell to be programmed to one among a first set of states. At least one neighboring memory cell that neighbors the memory cell to be programmed to one among the first set of states is then first programmed. Following the first programming of the at least one neighboring memory cell, second programming the memory cell to be programmed to one among a second set of states, wherein the second set of states has a number of states that is greater than the number of states in the first set of states.

    摘要翻译: 在具有相对于衬底在水平和垂直方向上延伸的存储器单元阵列的三维存储器件的多位编程的方法中,该方法包括首先将要编程的存储器单元编程为第一组 状态。 然后,首先对与第一组状态中的一个相邻的要存储单元相邻的至少一个相邻存储单元进行编程。 在对所述至少一个相邻存储器单元进行第一编程之后,将要编程的存储器单元的第二编程为第二组状态之一,其中所述第二组状态具有大于所述状态数 第一套状态。

    Three-Dimensional Memory Device
    9.
    发明申请
    Three-Dimensional Memory Device 有权
    三维存储器件

    公开(公告)号:US20100193861A1

    公开(公告)日:2010-08-05

    申请号:US12694339

    申请日:2010-01-27

    IPC分类号: H01L29/78

    摘要: A three-dimensional semiconductor device includes a semiconductor substrate, vertical channel structures arranged on the semiconductor substrate in a matrix, a P-type semiconductor layer disposed at the semiconductor substrate to be in direct with the vertical channel structures, and a common source line disposed at the semiconductor substrate between the vertical channel structures. The common source line may be in contact with the P-type semiconductor layer.

    摘要翻译: 三维半导体器件包括:半导体衬底,以矩阵形式布置在半导体衬底上的垂直沟道结构;设置在半导体衬底处以与垂直沟道结构直接相连的P型半导体层;以及布置的公共源极线 在垂直沟道结构之间的半导体衬底处。 公共源极线可以与P型半导体层接触。

    Three-dimensional memory device
    10.
    发明授权
    Three-dimensional memory device 有权
    三维存储设备

    公开(公告)号:US08115259B2

    公开(公告)日:2012-02-14

    申请号:US12694339

    申请日:2010-01-27

    IPC分类号: H01L21/70

    摘要: A three-dimensional semiconductor device includes a semiconductor substrate, vertical channel structures arranged on the semiconductor substrate in a matrix, a P-type semiconductor layer disposed at the semiconductor substrate to be in direct with the vertical channel structures, and a common source line disposed at the semiconductor substrate between the vertical channel structures. The common source line may be in contact with the P-type semiconductor layer.

    摘要翻译: 三维半导体器件包括:半导体衬底,以矩阵形式布置在半导体衬底上的垂直沟道结构;设置在半导体衬底处以与垂直沟道结构直接相连的P型半导体层;以及布置的公共源极线 在垂直沟道结构之间的半导体衬底处。 公共源极线可以与P型半导体层接触。