ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
    1.
    发明申请
    ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT 审中-公开
    电子元件和制造电子元件的方法

    公开(公告)号:US20130208401A1

    公开(公告)日:2013-08-15

    申请号:US13757058

    申请日:2013-02-01

    CPC classification number: H01G13/06 H01G4/008 H01G4/12 H01G4/2325 H01G4/30

    Abstract: An electronic component has an element body and an external electrode arranged on the element body. The element body has a pair of end faces opposed to each other, a pair of principal faces opposed to each other, and a pair of side faces opposed to each other. The external electrode is formed so as to cover the end face and a partial region of the principal face and/or a partial region of the side face. The external electrode has a thick film electrode, a thin film electrode, and a plated layer. The thick film electrode is formed on the end face. The thin film electrode is formed so as to cover the thick film electrode and the partial region of the principal face and/or the partial region of the side face. The plated layer is formed outside the thin film electrode and contains Sn or an Sn alloy.

    Abstract translation: 电子部件具有设置在元件主体上的元件主体和外部电极。 元件主体具有彼此相对的一对端面,彼此相对的一对主面以及彼此相对的一对侧面。 外部电极形成为覆盖主面的端面和主面的部分区域和/或侧面的部分区域。 外部电极具有厚膜电极,薄膜电极和镀层。 厚膜电极形成在端面上。 形成薄膜电极以覆盖厚膜电极以及侧面的主面和/或部分区域的部分区域。 电镀层形成在薄膜电极的外侧,并含有Sn或Sn合金。

    LAMINATED ELECTRONIC COMPONENT
    2.
    发明申请

    公开(公告)号:US20220319777A1

    公开(公告)日:2022-10-06

    申请号:US17700608

    申请日:2022-03-22

    Abstract: A laminated electronic component includes an element body formed by laminating an insulating layer and having a bottom surface used as a mounting surface, and a bottom surface electrode formed on the bottom surface of the element body and containing glass and a sintered metal, wherein the bottom surface electrode includes a first electrode layer and a second electrode layer formed on the element body side from the first electrode layer, an edge portion of the second electrode layer is covered with an overcoat layer which is a part of the element body, the first electrode layer is laminated on the second electrode layer with the overcoat layer interposed therebetween, and a content of glass in the first electrode layer is larger than a content of glass in the second electrode layer.

    BLACK MARKER COMPOSITION AND ELECTRONIC COMPONENT USING THE SAME

    公开(公告)号:US20200308429A1

    公开(公告)日:2020-10-01

    申请号:US16830403

    申请日:2020-03-26

    Abstract: Provided is a more versatile black marker composition which achieves excellent adhesion between a mark and an electronic component element body and excellent contrast of a mark regardless of the composition of the electronic component element body, the black marker composition containing borosilicate glass and a black oxide, in which a crystallization temperature of the borosilicate glass is less than 910° C., and an amount of Zn in terms of ZnO is 0.05% by mass or less based on 100% by mass of an inorganic solid content in terms of an oxide contained in the black marker composition.

    ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT
    5.
    发明申请
    ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT 审中-公开
    电子元件和制造电子元件的方法

    公开(公告)号:US20160049257A1

    公开(公告)日:2016-02-18

    申请号:US14923999

    申请日:2015-10-27

    Abstract: An electronic component comprises an element body and an outer electrode. The element body has a pair of end faces opposing each other, a pair of main faces opposing each other while extending so as to connect the pair of end faces to each other, and a pair of side faces opposing each other while extending so as to connect the pair of main faces to each other. The outer electrode is formed on the end face side of the element body and covers a portion of the main and side faces adjacent to the end face. At least a surface of an electrode portion of the outer electrode located on the side face side thereof is covered with an insulating layer.

    Abstract translation: 电子部件包括元件主体和外部电极。 元件主体具有彼此相对的一对端面,一对主面相互延伸,同时延伸以将一对端面彼此连接,并且一对侧面彼此相对延伸,以便 将一对主面相互连接。 外电极形成在元件体的端面侧,并且覆盖与端面相邻的主面和侧面的一部分。 至少位于其侧面侧的外电极的电极部分的表面被绝缘层覆盖。

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