公开(公告)号：US20230093241A1

公开(公告)日：2023-03-23

申请号：US17909080

申请日：2021-03-04

Applicant: TDK CORPORATION

Inventor： Hiroshi KOIZUMI ,  Yasuo KATO ,  Makoto YAMASHITA ,  Mitsuyoshi MAKIDA ,  Ryo SHINDO ,  Osamu SHINDO ,  Hiroshi IIZUKA ,  Seijiro SUNAGA ,  Toshinobu MIYAGOSHI

IPC: H01L33/00

Abstract: An element array pressurizing device has a pressurizing plate having a pressurizing unit that pressurizes an element array comprising a plurality of elements disposed on a mounting substrate. The pressurizing unit has a plate-shaped hard material for which a surface precision is higher than that of a surface of the pressurizing plate.

公开(公告)号：US20230382070A1

公开(公告)日：2023-11-30

申请号：US18323745

申请日：2023-05-25

Applicant: TDK CORPORATION

Inventor： Yohei SATO ,  Hiroshi KOIZUMI ,  Toshinobu MIYAGOSHI ,  Osamu SHINDO ,  Seijiro SUNAGA ,  Mitsuyoshi MAKIDA ,  Makoto YAMASHITA ,  Yasuo KATO ,  Ryo SHINDO ,  Masashi MATSUMOTO

IPC: B30B12/00 ,  B30B15/04 ,  B30B15/06

CPC classification number: B30B12/00 ,  B30B15/062 ,  B30B15/04

Abstract: A substrate processing apparatus 10 applies pressure to a substrate 2 which is an object to be pressurized arranged on an upper jig plate 44. The substrate processing apparatus 10 includes a lower jig plate 46 arranged below the upper jig plate 44, an installation base 47 provided on the lower jig plate 46 and the substrate 2 is arranged; and the installation base is temporarily fixed to the installation base 47 in a deformable manner.

公开(公告)号：US20230381903A1

公开(公告)日：2023-11-30

申请号：US18323820

申请日：2023-05-25

Applicant: TDK CORPORATION

Inventor： Yohei SATO ,  Hiroshi KOIZUMI ,  Osamu SHINDO ,  Mitsuyoshi MAKIDA ,  Masashi MATSUMOTO

IPC: B23Q1/03

CPC classification number: B23Q1/032

Abstract: A substrate processing apparatus including a lower jig plate for arranging a substrate which is an object to be pressurized, columnar members supporting the lower jig plate, and a heat dissipating column contacting the lower jig plate directly or indirectly and having a higher heat dissipation property than the columnar members.

公开(公告)号：US20200227468A1

公开(公告)日：2020-07-16

申请号：US16713513

申请日：2019-12-13

Applicant: TDK CORPORATION

Inventor： Toshinobu MIYAGOSHI ,  Seijiro SUNAGA ,  Osamu SHINDO ,  Yasuo KATO

IPC: H01L27/15 ,  C09J201/00 ,  H01L33/00

Abstract: In a method of manufacturing an element array, prepared is an adhesive sheet in which elements are arranged in a predetermined array on an adhesive layer. A specific element among the arrayed elements is removed from the adhesive sheet by radiating a laser to the specific element. The arrayed elements are directly or indirectly transferred onto a mounting substrate.

公开(公告)号：US20200215809A1

公开(公告)日：2020-07-09

申请号：US16713763

申请日：2019-12-13

Applicant: TDK CORPORATION

Inventor： Toshinobu MIYAGOSHI ,  Seijiro SUNAGA ,  Osamu SHINDO ,  Yasuo KATO

IPC: B32B43/00 ,  H01L21/67

Abstract: An apparatus for manufacturing an element array includes a substrate hold means, a laser radiation device, and a collection mechanism. The substrate hold means holds a substrate including an adhesive layer on which elements are attached in a predetermined array while a surface of the adhesive layer is inclined relative to a horizontal surface at a predetermined angle. The laser radiation device radiates a laser to a specific element among the elements attached on the adhesive layer. The collection mechanism is disposed below the substrate and configured to receive the specific element falling by the laser radiation.

公开(公告)号：US20150040390A1

公开(公告)日：2015-02-12

申请号：US14492244

申请日：2014-09-22

Applicant: TDK CORPORATION ,  ROHM CO., LTD. ,  SAE MAGNETICS (H.K.) LTD.

Inventor： Koji SHIMAZAWA ,  Osamu SHINDO ,  Yoshihiro TSUCHIYA ,  Yasuhiro ITO ,  Kenji SAKAI

IPC: H05K3/34

CPC classification number: H05K3/3421 ,  B23K1/0016 ,  H01S5/02236 ,  H01S5/02272 ,  Y10T29/49144

Abstract: A manufacturing method of laser diode unit of the present invention includes steps: placing a laser diode on top of a solder member formed on a mounting surface of a submount, applying a pressing load to the laser diode and pressing the laser diode against the solder member, next, melting the solder member by heating the solder member at a temperature higher than a melting point of the solder member while the pressing load is being applied, and thereafter, bonding the laser diode to the submount by cooling and solidifying the solder member, thereafter, removing the pressing load, and softening the solidified solder member by heating the solder member at a temperature lower than the melting point of the solder member after the pressing load has been removed, and thereafter cooling and re-solidifying the solder member.

Abstract translation: 本发明的激光二极管单元的制造方法包括以下步骤：将激光二极管放置在形成在基座的安装表面上的焊料构件的顶部上，向激光二极管施加按压负载并将激光二极管按压在焊料构件上 接下来，在施加加压负荷的同时，通过在高于焊料构件的熔点的温度下加热焊料部件来熔化焊料部件，之后，通过冷却固化焊料部件将激光二极管接合到副安装台， 然后，除去加压负荷，通过在除去加压负荷后，在低于焊料构件的熔点的温度下加热焊料，软化固化的焊料，然后冷却并重新固化焊料。

公开(公告)号：US20230382069A1

公开(公告)日：2023-11-30

申请号：US18323467

申请日：2023-05-25

Applicant: TDK CORPORATION

Inventor： Yohei SATO ,  Osamu SHINDO ,  Hiroshi KOIZUMI ,  Makoto YAMASHITA ,  Yasuo KATO ,  Mitsuyoshi MAKIDA ,  Masashi MATSUMOTO

IPC: B30B12/00 ,  B30B15/04 ,  B30B15/06

CPC classification number: B30B12/00 ,  B30B15/04 ,  B30B15/062

Abstract: Provided is a substrate processing apparatus capable applying a uniform load to an object to be pressurized. The substrate processing apparatus includes a lower jig plate 46 for arranging a substrate 2 which is an object to be pressurized, an upper jig plate 44 applying pressure to the substrate 2 arranged to the lower jig plate 46, and a support member 45 supporting the lower jig plate 46 and providing a support force to the lower jig plate 46 in accordance with a in-plane distribution of a load applied to the lower jig plate 46.

公开(公告)号：US20230381904A1

公开(公告)日：2023-11-30

申请号：US18323618

申请日：2023-05-25

Applicant: TDK CORPORATION

Inventor： Yohei SATO ,  Hiroshi KOIZUMI ,  Toshinobu MIYAGOSHI ,  Osamu SHINDO ,  Seijiro SUNAGA ,  Makoto YAMASHITA ,  Yasuo KATO ,  Mitsuyoshi MAKIDA ,  Masashi MATSUMOTO

IPC: B23Q3/02

CPC classification number: B23Q3/02

Abstract: A substrate processing apparatus 10 having a lower jig plate 46 for arranging a substrate 2 as an object to be pressurized, a support member 45 including an installation portion 52 for installing columnar members 50 supporting the lower jig plate 46, in which the columnar members 50 are placed to the installation portion 52 in accordance with a in-plane distribution of a load applied to the lower jig plate 46.