公开(公告)号：US20250155658A1

公开(公告)日：2025-05-15

申请号：US18944725

申请日：2024-11-12

Applicant: TDK Corporation

Inventor： Takashi HONDA ,  Ryohei Fukuzaki ,  Tsuyoshi Komaki

IPC: G02B6/42 ,  G02B6/12 ,  G02B6/132 ,  G02B26/08 ,  G02B27/01 ,  H01S5/02315

Abstract: A laser assembly of the present invention includes a plurality of laser element bases in which laser elements are installed on main surfaces, an optical waveguiding substrate in which an optical waveguiding layer is provided on a main surface, a plurality of spacer layers which are disposed away from each other at positions corresponding to the bases on a bonding surface of the substrate, and a plurality of metal laminate films which bond bonding surfaces of the plurality of laser element bases and the bonding surface of the optical waveguiding substrate. The plurality of metal laminate films are respectively disposed on the plurality of spacer layers and have a plurality of first metal films and second metal films that are disposed on the bonding surfaces of the plurality of laser element bases and made of metals capable of being eutectic with metals constituting the first metal films.

公开(公告)号：US20240283216A1

公开(公告)日：2024-08-22

申请号：US18524024

申请日：2023-11-30

Applicant: TDK CORPORATION

Inventor： Takashi HONDA ,  Takashi AOYAGI ,  Makoto FUKUDA ,  Tsuyoshi KOMAKI ,  Ryohei FUKUZAKI

IPC: H01S5/02315 ,  H01S5/02

CPC classification number: H01S5/02315 ,  H01S5/0201

Abstract: What is provided is a subcarrier wafer in which chipping, particles, cracking, and the like are curbed.
This subcarrier wafer is a subcarrier wafer for a laser module including a wafer, and a plurality of protective layers that are provided on a main surface of the wafer. The plurality of protective layers are arrayed separately, and a part on the main surface of the wafer is exposed.

公开(公告)号：US20160232928A1

公开(公告)日：2016-08-11

申请号：US14657436

申请日：2015-03-13

Applicant: SAE Magnetics (H.K.) Ltd. ,  TDK Corporation ,  ROHM CO., LTD.

Inventor： Takashi HONDA ,  Seiichi TAKAYAMA ,  Ryuji FUJII ,  Koji SHIMAZAWA ,  Tsuguki NOMA ,  Yoshiteru NAGAI

IPC: G11B5/48 ,  G01J1/44

CPC classification number: G11B5/4866 ,  G01J1/4257 ,  G01J1/44 ,  G11B5/6088 ,  G11B2005/0021

Abstract: A light source unit has a substrate, a light source that is mounted to the substrate. The light source includes; a first emission part that emits a forward light, the forward light being a laser light in an oscillation state; a second emission part that is located on a side opposite to the first emission part and that emits a rearward light, the rearward light being a laser light in an oscillation state; and a light leakage part located at a position different from the first emission part and the second emission part. The light source further includes a photodetector that is provided on the substrate, wherein the photodetector has a light receiving surface for detecting a leakage light that leaks from the light leakage part.

Abstract translation: 光源单元具有基板，安装在基板上的光源。 光源包括 第一发射部分，其发射向前的光，所述前向光是处于振荡状态的激光; 第二发射部分，其位于与第一发射部分相对的一侧，并且发射向后的光，所述后向光是处于振荡状态的激光; 以及位于与第一发射部分和第二发射部分不同的位置的漏光部分。 光源还包括设置在基板上的光电检测器，其中光电检测器具有用于检测从漏光部分泄漏的泄漏光的光接收表面。

公开(公告)号：US20240332912A1

公开(公告)日：2024-10-03

申请号：US18521217

申请日：2023-11-28

Applicant: TDK CORPORATION

Inventor： Takashi HONDA ,  Takashi AOYAGI ,  Makoto FUKUDA ,  Tsuyoshi KOMAKI ,  Ryohei FUKUZAKI

IPC: H01S5/40 ,  G02B27/01 ,  H01S5/00

CPC classification number: H01S5/4075 ,  G02B27/0172 ,  H01S5/0064 ,  H01S5/4093 ,  G02B2027/0178

Abstract: A laser assembly includes a plurality of laser light sources, a plurality of laser light source bases having main surfaces on which the laser light sources are placed and arranged apart from each other, an optical waveguide layer having at least an optical waveguide configured to guide laser light output from the laser light sources, an optical waveguide substrate having a main surface on which the optical waveguide layer is provided, and a plurality of metal films (M) configured to bond the laser light source bases with the optical waveguide substrate. The plurality of metal films (M) correspond to the plurality of laser light source bases and are arranged apart from each other.

公开(公告)号：US20240283215A1

公开(公告)日：2024-08-22

申请号：US18524007

申请日：2023-11-30

Applicant: TDK CORPORATION

Inventor： Takashi HONDA ,  Takashi AOYAGI ,  Makoto FUKUDA ,  Tsuyoshi KOMAKI ,  Ryohei FUKUZAKI

IPC: H01S5/02315 ,  H01S5/00

CPC classification number: H01S5/02315 ,  H01S5/0071

Abstract: What is provided is a subcarrier and a laser module in which, when an optical semiconductor element is formed on the subcarrier, blocking of an irradiation surface of the optical semiconductor element by a structure formed by melting is curbed.
This subcarrier is a subcarrier for a laser module including a wafer portion that is constituted of a base and a protective layer formed on a surface of the base, a first metal layer that is formed on the protective layer, a eutectic layer that is formed on the first metal layer, and a second metal layer that is formed on the eutectic layer. The wafer portion has a recessed portion formed in a region overlapping the eutectic layer in a width direction, that is, a region on an outward side of the first metal layer in a longitudinal direction.