公开(公告)号：US20230258998A1

公开(公告)日：2023-08-17

申请号：US18080129

申请日：2022-12-13

Applicant: TDK CORPORATION

Inventor： Takashi AOYAGI ,  Makoto FUKUDA

IPC: G02F1/16753 ,  F21V8/00

CPC classification number: G02F1/16753 ,  G02B6/0011

Abstract: An optical device is provided, the optical device having a laminated substrate in which a plurality of functional layers are laminated, and an optical part and an electronic part disposed on the laminated substrate, wherein one of the functional layers is a first functional layer that the optical part is placed one, and one of other of the functional layers is a second functional layer that is disposed below the first functional layer and the electronic part is placed on, a first wiring is provided on one surface of the first functional layer and a second wiring is provided on one surface of the second functional layer, and a connection terminal of the electronic part is electrically connected to both of the first wiring and the second wiring via a conductive material.

公开(公告)号：US20240332912A1

公开(公告)日：2024-10-03

申请号：US18521217

申请日：2023-11-28

Applicant: TDK CORPORATION

Inventor： Takashi HONDA ,  Takashi AOYAGI ,  Makoto FUKUDA ,  Tsuyoshi KOMAKI ,  Ryohei FUKUZAKI

IPC: H01S5/40 ,  G02B27/01 ,  H01S5/00

CPC classification number: H01S5/4075 ,  G02B27/0172 ,  H01S5/0064 ,  H01S5/4093 ,  G02B2027/0178

Abstract: A laser assembly includes a plurality of laser light sources, a plurality of laser light source bases having main surfaces on which the laser light sources are placed and arranged apart from each other, an optical waveguide layer having at least an optical waveguide configured to guide laser light output from the laser light sources, an optical waveguide substrate having a main surface on which the optical waveguide layer is provided, and a plurality of metal films (M) configured to bond the laser light source bases with the optical waveguide substrate. The plurality of metal films (M) correspond to the plurality of laser light source bases and are arranged apart from each other.

公开(公告)号：US20240283215A1

公开(公告)日：2024-08-22

申请号：US18524007

申请日：2023-11-30

Applicant: TDK CORPORATION

Inventor： Takashi HONDA ,  Takashi AOYAGI ,  Makoto FUKUDA ,  Tsuyoshi KOMAKI ,  Ryohei FUKUZAKI

IPC: H01S5/02315 ,  H01S5/00

CPC classification number: H01S5/02315 ,  H01S5/0071

Abstract: What is provided is a subcarrier and a laser module in which, when an optical semiconductor element is formed on the subcarrier, blocking of an irradiation surface of the optical semiconductor element by a structure formed by melting is curbed.
This subcarrier is a subcarrier for a laser module including a wafer portion that is constituted of a base and a protective layer formed on a surface of the base, a first metal layer that is formed on the protective layer, a eutectic layer that is formed on the first metal layer, and a second metal layer that is formed on the eutectic layer. The wafer portion has a recessed portion formed in a region overlapping the eutectic layer in a width direction, that is, a region on an outward side of the first metal layer in a longitudinal direction.

公开(公告)号：US20240283216A1

公开(公告)日：2024-08-22

申请号：US18524024

申请日：2023-11-30

Applicant: TDK CORPORATION

Inventor： Takashi HONDA ,  Takashi AOYAGI ,  Makoto FUKUDA ,  Tsuyoshi KOMAKI ,  Ryohei FUKUZAKI

IPC: H01S5/02315 ,  H01S5/02

CPC classification number: H01S5/02315 ,  H01S5/0201

Abstract: What is provided is a subcarrier wafer in which chipping, particles, cracking, and the like are curbed.
This subcarrier wafer is a subcarrier wafer for a laser module including a wafer, and a plurality of protective layers that are provided on a main surface of the wafer. The plurality of protective layers are arrayed separately, and a part on the main surface of the wafer is exposed.