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公开(公告)号：US20240329341A1
公开(公告)日：2024-10-03
申请号：US18382685
申请日：2023-10-23
Applicant: TDK CORPORATION
Inventor： Takashi AOYAGI
CPC classification number: G02B6/4267 , G02B6/426 , G02B27/0172 , G02B2027/0178
Abstract: A light source module includes a chip-on-carrier having a base and a laser diode, a planar lightwave circuit having a substrate and an optical waveguide, and a package having a housing portion configured to house the chip-on-carrier and the planar lightwave circuit. The housing portion has a substructure configured to form a bottom surface, one or more thermal vias penetrating through the substructure, and one or more bumps provided on the substructure. At least one of the bumps is arranged in contact with the planar lightwave circuit and arranged at a position at least partially overlapping the thermal vias when seen from above. The bumps come in contact with the thermal vias or the bumps and the thermal vias are bonded via a metallic pad.
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公开(公告)号：US20240283216A1
公开(公告)日：2024-08-22
申请号：US18524024
申请日：2023-11-30
Applicant: TDK CORPORATION
Inventor： Takashi HONDA , Takashi AOYAGI , Makoto FUKUDA , Tsuyoshi KOMAKI , Ryohei FUKUZAKI
IPC: H01S5/02315 , H01S5/02
CPC classification number: H01S5/02315 , H01S5/0201
Abstract: What is provided is a subcarrier wafer in which chipping, particles, cracking, and the like are curbed.
This subcarrier wafer is a subcarrier wafer for a laser module including a wafer, and a plurality of protective layers that are provided on a main surface of the wafer. The plurality of protective layers are arrayed separately, and a part on the main surface of the wafer is exposed.-
公开(公告)号：US20150340588A1
公开(公告)日：2015-11-26
申请号：US14718645
申请日：2015-05-21
Applicant: TDK CORPORATION
Inventor： Hirofumi NATORI , Kenichi TOCHI , Akihiro UNNO , Takashi AOYAGI
IPC: H01L41/047
CPC classification number: H01L41/047 , G01C19/56 , G01C19/5607
Abstract: In a piezoelectric element, a piezoelectric film, a first electrode film provided on one surface of the piezoelectric film, and a second electrode film provided on the other surface of the piezoelectric film form a layered structure, an outer contour of the first electrode film and an outer contour of the second electrode film are positioned outside an outer contour of the piezoelectric film as viewed in a layering direction, an organic resin film is in contact with the piezoelectric film, and generation of noise is suppressed.
Abstract translation: 在压电元件中，压电膜，设置在压电膜的一个表面上的第一电极膜和设置在压电膜的另一个表面上的第二电极膜形成层状结构，第一电极膜的外轮廓和 第二电极膜的外轮廓位于压电膜的外轮廓外侧，从分层方向看，有机树脂膜与压电膜接触，并且抑制噪声的产生。
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Patent Agency Ranking
公开(公告)号：US20240332912A1
公开(公告)日：2024-10-03
申请号：US18521217
申请日：2023-11-28
Applicant: TDK CORPORATION
Inventor： Takashi HONDA , Takashi AOYAGI , Makoto FUKUDA , Tsuyoshi KOMAKI , Ryohei FUKUZAKI
CPC classification number: H01S5/4075 , G02B27/0172 , H01S5/0064 , H01S5/4093 , G02B2027/0178
Abstract: A laser assembly includes a plurality of laser light sources, a plurality of laser light source bases having main surfaces on which the laser light sources are placed and arranged apart from each other, an optical waveguide layer having at least an optical waveguide configured to guide laser light output from the laser light sources, an optical waveguide substrate having a main surface on which the optical waveguide layer is provided, and a plurality of metal films (M) configured to bond the laser light source bases with the optical waveguide substrate. The plurality of metal films (M) correspond to the plurality of laser light source bases and are arranged apart from each other.
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公开(公告)号：US20240283215A1
公开(公告)日：2024-08-22
申请号：US18524007
申请日：2023-11-30
Applicant: TDK CORPORATION
Inventor： Takashi HONDA , Takashi AOYAGI , Makoto FUKUDA , Tsuyoshi KOMAKI , Ryohei FUKUZAKI
IPC: H01S5/02315 , H01S5/00
CPC classification number: H01S5/02315 , H01S5/0071
Abstract: What is provided is a subcarrier and a laser module in which, when an optical semiconductor element is formed on the subcarrier, blocking of an irradiation surface of the optical semiconductor element by a structure formed by melting is curbed.
This subcarrier is a subcarrier for a laser module including a wafer portion that is constituted of a base and a protective layer formed on a surface of the base, a first metal layer that is formed on the protective layer, a eutectic layer that is formed on the first metal layer, and a second metal layer that is formed on the eutectic layer. The wafer portion has a recessed portion formed in a region overlapping the eutectic layer in a width direction, that is, a region on an outward side of the first metal layer in a longitudinal direction.-
公开(公告)号：US20240222928A1
公开(公告)日：2024-07-04
申请号：US18392571
申请日：2023-12-21
Applicant: TDK CORPORATION
Inventor： Hideaki FUKUZAWA , Tomohito MIZUNO , Tsuyoshi KOMAKI , Takashi AOYAGI , Ardalan HESHMATI , Kit Chu LAM
IPC: H01S5/02255 , G02B27/01 , H01S5/02253
CPC classification number: H01S5/02255 , G02B27/0172 , H01S5/02253 , G02B2027/0178
Abstract: The optical module includes a laser light source part in which a laser light emitting element is formed on one main surface of a first substrate, a mirror part in which an optical scanning mirror element is formed on one main surface of a second substrate, and a lens part in which an optical lens is formed on one main surface of a third substrate, wherein the first substrate and the third substrate are bonded via a metal bonding layer, and the optical module is configured for laser light emitted from the laser light emitting element to be reflected by the optical scanning mirror element via the optical lens.
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公开(公告)号：US20230258998A1
公开(公告)日：2023-08-17
申请号：US18080129
申请日：2022-12-13
Applicant: TDK CORPORATION
Inventor： Takashi AOYAGI , Makoto FUKUDA
IPC: G02F1/16753 , F21V8/00
CPC classification number: G02F1/16753 , G02B6/0011
Abstract: An optical device is provided, the optical device having a laminated substrate in which a plurality of functional layers are laminated, and an optical part and an electronic part disposed on the laminated substrate, wherein one of the functional layers is a first functional layer that the optical part is placed one, and one of other of the functional layers is a second functional layer that is disposed below the first functional layer and the electronic part is placed on, a first wiring is provided on one surface of the first functional layer and a second wiring is provided on one surface of the second functional layer, and a connection terminal of the electronic part is electrically connected to both of the first wiring and the second wiring via a conductive material.
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公开(公告)号：US20190077655A1
公开(公告)日：2019-03-14
申请号：US15255757
申请日：2016-09-02
Applicant: TDK CORPORATION
Inventor： Jotaro AKIYAMA , Kenji ENDOU , Takashi AOYAGI , Katsunori OSANAI , Tohru INOUE
CPC classification number: B81B7/02 , B81B3/0097 , B81B7/008 , B81B2201/014 , B81B2203/0118 , B81B2203/04 , H01H1/00 , H01H1/0036 , H01H2001/0084 , H01H2057/006
Abstract: A MEMS switch includes a first signal line provided in a first beam, a first GND adjacent to the first signal line, a second signal line provided in a second beam, and a second GND adjacent to the second signal line. A contact terminal is fixed to any one of the first signal line and the second signal line and performs connection between the first signal line and the second signal line according to deformation of the first beam.
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