公开(公告)号：US20200049888A1

公开(公告)日：2020-02-13

申请号：US16497001

申请日：2018-02-20

Applicant: TDK Corporation

Inventor： Hiroki HARA ,  Masahiro SHINKAI ,  Takashi KIKUKAWA ,  Masami SASAKI ,  Ryohei FUKUZAKI ,  Motohiro NAKAHARA ,  Tetsuo MIYA ,  Shuji TACHI ,  Koichi ARISHIMA

IPC: G02B6/26 ,  G02B6/42

Abstract: A first disclosure is an optical fiber member equipped with two holding members that hold an optical fiber such that an end surface of the optical fiber is located on one end and a curving portion having a coat of the optical fiber is curved to be extended at another end; the holding members are provided with holding flat portions that sandwich an end portion of the optical fiber where the coat is removed such that the end surface of the optical fiber is located on the one end; at least any of the holding flat portions has an aligning groove to fix a position of the end portion of the optical fiber; the holding member is provided with a curved surface at a position adjacent to the curving portion in the extending direction Dl; and the two holding members are equal in thermal expansion coefficient.

公开(公告)号：US20240329306A1

公开(公告)日：2024-10-03

申请号：US18620035

申请日：2024-03-28

Applicant: TDK CORPORATION

Inventor： Shuntaro KODAMA ,  Hiroshi TAKE ,  Kenji NAGASE ,  Ryohei FUKUZAKI

IPC: G02B6/122 ,  G02B6/12

CPC classification number: G02B6/122 ,  G02B2006/12097

Abstract: An optical device includes: a substrate having a pair of main surfaces opposite each other in a first direction and an end surface adjacent to the main surface, and an optical waveguide formed on the substrate and having a light incident surface or a light exit surface in a direction of a plane where the end surface is located, where at least a central portion of the light incident surface and/or light exit surface of the optical waveguide includes an inclined surface having a preset angle with respect to the end surface of the substrate.

公开(公告)号：US20230134378A1

公开(公告)日：2023-05-04

申请号：US17793596

申请日：2020-12-23

Applicant: TDK CORPORATION

Inventor： Ryohei FUKUZAKI ,  Masahiro SHINKAI

IPC: G02B6/36 ,  G02B6/12

Abstract: An integrated optical device includes: a mounting base; an optical semiconductor device which is provided on a surface of the mounting base; a substrate; and an optical waveguide which is provided on a surface of the substrate, wherein an incident surface of the optical waveguide is disposed to face an emission surface of the optical semiconductor device, wherein light emitted from the optical semiconductor device is able to be incident to the optical waveguide, wherein the optical semiconductor device is connected to the mounting base through a metal layer, wherein the mounting base is connected to the substrate through the other metal layer, and wherein a mounting base bottom surface on the side opposite to a surface of the mounting base and a substrate bottom surface on the side opposite to a surface of the substrate are provided on the substantially same plane.

公开(公告)号：US20240329340A1

公开(公告)日：2024-10-03

申请号：US18619829

申请日：2024-03-28

Applicant: TDK CORPORATION

Inventor： Kenji NAGASE ,  Hiroshi TAKE ,  Shuntaro KODAMA ,  Ryohei FUKUZAKI

IPC: G02B6/42

CPC classification number: G02B6/4239

Abstract: An optical device includes: a substrate having a pair of main surfaces opposite each other in a first direction, end surfaces adjacent to the main surfaces, and a pair of side surfaces, and an optical waveguide, disposed along the main surface of the substrate and having a light incidence end or a light exit end in the direction of a plane where the end surface is located, wherein, an adhesive for connection is coated on the end surface of the substrate, and at least one stepped portion is formed between the optical waveguide and the adhesive.

公开(公告)号：US20240283216A1

公开(公告)日：2024-08-22

申请号：US18524024

申请日：2023-11-30

Applicant: TDK CORPORATION

Inventor： Takashi HONDA ,  Takashi AOYAGI ,  Makoto FUKUDA ,  Tsuyoshi KOMAKI ,  Ryohei FUKUZAKI

IPC: H01S5/02315 ,  H01S5/02

CPC classification number: H01S5/02315 ,  H01S5/0201

Abstract: What is provided is a subcarrier wafer in which chipping, particles, cracking, and the like are curbed.
This subcarrier wafer is a subcarrier wafer for a laser module including a wafer, and a plurality of protective layers that are provided on a main surface of the wafer. The plurality of protective layers are arrayed separately, and a part on the main surface of the wafer is exposed.

公开(公告)号：US20240332912A1

公开(公告)日：2024-10-03

申请号：US18521217

申请日：2023-11-28

Applicant: TDK CORPORATION

Inventor： Takashi HONDA ,  Takashi AOYAGI ,  Makoto FUKUDA ,  Tsuyoshi KOMAKI ,  Ryohei FUKUZAKI

IPC: H01S5/40 ,  G02B27/01 ,  H01S5/00

CPC classification number: H01S5/4075 ,  G02B27/0172 ,  H01S5/0064 ,  H01S5/4093 ,  G02B2027/0178

Abstract: A laser assembly includes a plurality of laser light sources, a plurality of laser light source bases having main surfaces on which the laser light sources are placed and arranged apart from each other, an optical waveguide layer having at least an optical waveguide configured to guide laser light output from the laser light sources, an optical waveguide substrate having a main surface on which the optical waveguide layer is provided, and a plurality of metal films (M) configured to bond the laser light source bases with the optical waveguide substrate. The plurality of metal films (M) correspond to the plurality of laser light source bases and are arranged apart from each other.

公开(公告)号：US20240283215A1

公开(公告)日：2024-08-22

申请号：US18524007

申请日：2023-11-30

Applicant: TDK CORPORATION

Inventor： Takashi HONDA ,  Takashi AOYAGI ,  Makoto FUKUDA ,  Tsuyoshi KOMAKI ,  Ryohei FUKUZAKI

IPC: H01S5/02315 ,  H01S5/00

CPC classification number: H01S5/02315 ,  H01S5/0071

Abstract: What is provided is a subcarrier and a laser module in which, when an optical semiconductor element is formed on the subcarrier, blocking of an irradiation surface of the optical semiconductor element by a structure formed by melting is curbed.
This subcarrier is a subcarrier for a laser module including a wafer portion that is constituted of a base and a protective layer formed on a surface of the base, a first metal layer that is formed on the protective layer, a eutectic layer that is formed on the first metal layer, and a second metal layer that is formed on the eutectic layer. The wafer portion has a recessed portion formed in a region overlapping the eutectic layer in a width direction, that is, a region on an outward side of the first metal layer in a longitudinal direction.