公开(公告)号：US20230268133A1

公开(公告)日：2023-08-24

申请号：US18012135

申请日：2020-12-24

Applicant: TDK Corporation

Inventor： Daiki ISHII ,  Yoshihiko YANO ,  Kenichi YOSHIDA ,  Tetsuhiro TAKAHASHI ,  Yuki YAMASHITA

IPC: H01G4/33 ,  H01G4/10 ,  H01G4/008 ,  H01G4/228 ,  H01G2/06

CPC classification number: H01G4/33 ,  H01G2/065 ,  H01G4/008 ,  H01G4/10 ,  H01G4/228

Abstract: To provide a thin film capacitor in which peeling-off of an electrode layer is less likely to occur. A thin film capacitor includes a metal foil having a roughened upper surface, a dielectric film covering the upper surface of the metal foil and having an opening for partly exposing the metal foil therethrough, a first electrode layer contacting the metal foil through the opening and further contacting the dielectric film, and a second electrode layer contacting the dielectric film without contacting the metal foil. With this configuration, both the first and second electrode layers can be disposed on the upper surface of the metal foil. In addition, the first electrode layer contacts not only the metal foil but also the dielectric film, making peeling of the first electrode layer less likely to occur.

公开(公告)号：US20230268120A1

公开(公告)日：2023-08-24

申请号：US18012530

申请日：2020-12-24

Applicant: TDK Corporation

Inventor： Daiki ISHII ,  Yoshihiko YANO ,  Yuki YAMASHITA ,  Kenichi YOSHIDA ,  Tetsuhiro TAKAHASHI

IPC: H01G4/005 ,  H01G4/33 ,  H05K1/18

CPC classification number: H01G4/005 ,  H01G4/33 ,  H05K1/18 ,  H05K2201/10015

Abstract: A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; a second electrode layer contacting the dielectric film without contacting the metal foil; and an insulating member separating the first and second electrode layers. The insulating member has a tapered shape in cross section. With the above configuration, both the first and second electrode layers can be disposed on the upper surface of the metal foil. In addition, since the insulating member has a tapered shape in cross section, adhesion performance of the insulating member can be enhanced, thus making it possible to prevent short-circuit between the first and second electrode layers.

公开(公告)号：US20140378295A1

公开(公告)日：2014-12-25

申请号：US14310212

申请日：2014-06-20

Applicant: TDK Corporation

Inventor： Toshihiko KANEKO ,  Saori TAKEDA ,  Yuki YAMASHITA ,  Junichi YAMAZAKI

IPC: C04B35/057 ,  C04B35/465 ,  C04B35/49

CPC classification number: C04B35/49 ,  C04B2235/3208 ,  C04B2235/3213 ,  C04B2235/3215 ,  C04B2235/6562 ,  H01L28/40

Abstract: The present invention aims to provide an amorphous dielectric film and an electronic component in which the relative permittivity and the temperature coefficient of electrostatic capacitance can be maintained and the withstand voltage can be increased even if the dielectric film is further thinned. The amorphous dielectric film of the present invention is characterized in that it is a dielectric film composed of an amorphous composition with A-B—O as the main component, wherein A contains at least two elements selected from the group consisting of Ba, Ca and Sr, and B contains Zr. When the main component of the dielectric film is represented by (BaxCaySrz)α—B—O, x, y and z meet the conditions of 0≦x≦1, 0≦y≦1, 0≦z≦1, respectively, x+y+z=1 and at least any two of x, y and z are 0.1 or more. When A/B is represented by α, 0.5≦α≦1.5.

Abstract translation: 本发明的目的在于提供一种非晶介质膜和电子元件，其中可以保持相对介电常数和静电电容的温度系数，并且即使电介质膜进一步薄化也可以提高耐电压。 本发明的非晶质介电体膜的特征在于，由作为主成分的无定形组合物构成的电介质膜，其中，A含有选自Ba，Ca，Sr中的至少2种以上的元素， B含有Zr。 当电介质膜的主要成分由（BaxCaySrz）α-B-O表示时，x，y和z分别满足0＆nlE; x＆nlE; 1,0，nlE; y＆nlE; 1,0和nlE; z＆nlE; 1的条件x + y + z = 1，x，y和z中的至少任意两个为0.1以上。 当A / B由α表示时，0.5＆nlE;α＆nlE; 1.5。

公开(公告)号：US20230260697A1

公开(公告)日：2023-08-17

申请号：US18012126

申请日：2020-12-24

Applicant: TDK Corporation

Inventor： Yuki YAMASHITA ,  Kenichi YOSHIDA ,  Yoshihiko YANO ,  Daiki ISHII

IPC: H01G4/01 ,  H01L25/16 ,  H01G4/33 ,  H01G4/012

CPC classification number: H01G4/01 ,  H01L25/16 ,  H01G4/33 ,  H01G4/012 ,  H01L24/16

Abstract: To provide a thin film capacitor in which a pair of terminal electrodes can be disposed on the same plane. A thin film capacitor includes a metal foil having a roughened upper surface, a dielectric film covering the upper surface of the metal foil and having an opening for partly exposing the metal foil therethrough, a first electrode layer contacting the metal foil through the opening, and a second electrode layer contacting the dielectric film without contacting the metal foil. With this configuration, both the first and second electrode layers can be disposed on the upper surface of the metal foil. In addition, since the metal foil is surface-roughened, a larger capacitance can be obtained.

公开(公告)号：US20150274600A1

公开(公告)日：2015-10-01

申请号：US14661881

申请日：2015-03-18

Applicant: TDK CORPORATION

Inventor： Raitarou MASAOKA ,  Toshihiko KANEKO ,  Yuki YAMASHITA ,  Hiroki UCHIYAMA ,  Saori TAKEDA ,  Yuji SEZAI ,  Shirou OOTSUKI

IPC: C04B35/49 ,  C04B35/47 ,  C04B35/48

CPC classification number: C04B35/49 ,  C04B35/47 ,  C04B35/48 ,  C04B35/486 ,  C04B35/638 ,  C04B2235/3208 ,  C04B2235/3213 ,  C04B2235/3215 ,  C04B2235/6562 ,  C04B2235/79 ,  C04B2235/80 ,  H01B3/12

Abstract: A dielectric composition contains major components that are an A-group containing major components that are at least two selected from the group consisting of Ba, Ca, and Sr and a B-group which contains a major component that is selected from Zr and Ti and which contains at least Zr. The dielectric composition contains an amorphous substance containing the A-group and the B-group and a crystalline substance containing the A-group and the B-group. In the dielectric composition, the inequality 0.5≦α≦1.5 holds, where α is the molar ratio of the A-group to the B-group.

Abstract translation: 电介质组合物包含主要成分，其为含有主要成分的主要成分，所述主成分为选自Ba，Ca和Sr中的至少两种，以及含有选自Zr和Ti的主要成分的B基，以及 其至少包含Zr。 电介质组合物含有含有A基团和B基团的无定形物质和含有A基团和B基团的结晶物质。 在电介质组成中，不等式为0.5＆nlE;α＆nlE; 1.5，其中α是A组与B基团的摩尔比。

公开(公告)号：US20150124373A1

公开(公告)日：2015-05-07

申请号：US14529623

申请日：2014-10-31

Applicant: TDK CORPORATION

Inventor： Saori TAKEDA ,  Toshihiko KANEKO ,  Yuki YAMASHITA ,  Yuji SEZAI

IPC: C04B35/453 ,  H01G4/12

CPC classification number: C04B35/453 ,  C04B35/16 ,  C04B2235/3298 ,  C04B2235/3427 ,  C04B2235/604 ,  C04B2235/6567 ,  C04B2235/80 ,  H01G4/085 ,  H01G4/1209 ,  H01G4/1272 ,  H01G4/33 ,  H01L28/55

Abstract: A dielectric composition containing a crystalline phase represented by a general formula of Bi12SiO20 and a crystalline phase represented by a general formula of Bi2SiO5 as the main components. The dielectric composition contains preferably 5 mass % to 99 mass % of the Bi2SiO5 crystalline phase, and more preferably 30 mass % to 99 mass %.

Abstract translation: 含有由通式Bi 12 SiO 20表示的结晶相和由通式Bi 2 SiO 5表示的结晶相作为主要成分的电介质组合物。 电介质组合物优选含有5质量％〜99质量％的Bi 2 SiO 5结晶相，更优选含有30质量％〜99质量％。

公开(公告)号：US20230335579A1

公开(公告)日：2023-10-19

申请号：US18012553

申请日：2020-12-24

Applicant: TDK Corporation

Inventor： Daiki ISHII ,  Yoshihiko YANO ,  Yuki YAMASHITA ,  Kenichi YOSHIDA ,  Tetsuhiro TAKAHASHI

IPC: H01L23/495 ,  H01L25/16

CPC classification number: H01L28/84 ,  H01L25/16

Abstract: A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; a second electrode layer contacting the dielectric film without contacting the metal foil; and an insulating member provided on the upper surface of the metal foil to surround the first and second electrode layers. The metal foil has an outer peripheral area which is positioned outside an area surrounded by the insulating member and which is not covered with the first and second electrode layers. A height of the electrode layer is equal to or higher than a height of the insulating member. This makes the outer peripheral portion of the thin film capacitor have a step-like shape.

公开(公告)号：US20230260713A1

公开(公告)日：2023-08-17

申请号：US18012820

申请日：2020-12-24

Applicant: TDK Corporation

Inventor： Daiki ISHII ,  Yoshihiko YANO ,  Yuki YAMASHITA ,  Kenichi YOSHIDA ,  Tetsuhiro TAKAHASHI

IPC: H01G4/33 ,  H01G4/228 ,  H01G4/005 ,  H01G4/06

CPC classification number: H01G4/33 ,  H01G4/228 ,  H01G4/005 ,  H01G4/06

Abstract: To provide a thin film capacitor having high adhesion with respect to a circuit substrate. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the dielectric film without contacting the metal foil. An angle θa formed by the other main surface of the metal foil and a side surface thereof is more than 20° and less than 80°. The side surface is thus tapered at an angle of more than 20° and less than 80°, so that it is possible to suppress warpage and to enhance adhesion with respect to a multilayer substrate when the thin film capacitor is embedded in the multilayer substrate.

公开(公告)号：US20230253161A1

公开(公告)日：2023-08-10

申请号：US18012518

申请日：2020-12-24

Applicant: TDK Corporation

Inventor： Daiki ISHII ,  Yoshihiko YANO ,  Yuki YAMASHITA ,  Kenichi YOSHIDA ,  Tetsuhiro TAKAHASHI

IPC: H01G4/33 ,  H01L25/16 ,  H01G4/01 ,  H01G4/012 ,  H01G4/10 ,  H01G4/12

CPC classification number: H01G4/33 ,  H01L25/16 ,  H01G4/01 ,  H01G4/012 ,  H01G4/10 ,  H01G4/1218 ,  H01G4/1254 ,  H01G4/1209 ,  H01L24/16

Abstract: To provide a thin film capacitor having high adhesion performance with respect to a circuit substrate. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the dielectric film without contacting the metal foil. The first and second electrode layers are formed in an area surrounded by an outer peripheral area of the upper surface of the metal foil so as not to cover the outer peripheral area. The outer peripheral area of the roughened upper surface of the metal foil is thus exposed, so that adhesion performance with respect to a circuit substrate can be enhanced.

公开(公告)号：US20230268125A1

公开(公告)日：2023-08-24

申请号：US18012145

申请日：2020-12-24

Applicant: TDK Corporation

Inventor： Daiki ISHII ,  Yoshihiko YANO ,  Yuki YAMASHITA ,  Kenichi YOSHIDA ,  Tetsuhiro TAKAHASHI

IPC: H01G4/06 ,  H01G4/33 ,  H01G4/005 ,  H05K1/18

CPC classification number: H01G4/06 ,  H01G4/33 ,  H01G4/005 ,  H05K1/18 ,  H05K2201/10015

Abstract: To provide a thin film capacitor in which warpage is less likely to occur. A thin film capacitor includes: a metal foil having roughened upper and lower surfaces; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a dielectric film covering the lower surface of the metal foil and made of a dielectric material having a thermal expansion coefficient smaller than that of the metal foil; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the first dielectric film without contacting the metal foil. The lower surface of the metal foil is thus covered with the dielectric film having a small thermal expansion coefficient, thereby making it possible to prevent the occurrence of warpage.