公开(公告)号：US20240128463A1

公开(公告)日：2024-04-18

申请号：US18277430

申请日：2021-02-18

Applicant: TDK CORPORATION

Inventor： Makoto ENDO ,  Mingyu CHEN ,  Yoshihiro KANBAYASHI ,  Takasi SATOU ,  Natsumi KOZAI ,  Yoshihiko TANABE ,  Syuji TSUKAMOTO ,  Miyuki YANAGIDA

IPC: H01M4/66

CPC classification number: H01M4/667 ,  H01M4/661

Abstract: A laminated resin film includes: a resin layer; and a Cu film provided on one surface or both surfaces of the resin layer, in which in the Cu film, a peak intensity y of a (200) plane is 2 to 30 when a peak intensity of a (111) plane in X-ray diffraction measurement is set to 100, and Expression (1) is satisfied.


y≥2.5×−7.5  Expression (1)



(in Expression (1), y is the peak intensity of the (200) plane when the peak intensity of the (111) plane in the X-ray diffraction measurement is set to 100, and x is a peak intensity of a (220) plane when the peak intensity of the (111) plane in the X-ray diffraction measurement is set to 100.)

公开(公告)号：US20140041913A1

公开(公告)日：2014-02-13

申请号：US13958887

申请日：2013-08-05

Applicant: TDK CORPORATION

Inventor： Miyuki YANAGIDA ,  Hisayuki ABE

IPC: H05K1/18

CPC classification number: H05K1/18 ,  H01G2/065 ,  H01G4/232 ,  H01G4/30 ,  H05K3/3442 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: One aspect of an electronic circuit module component is an electronic circuit module component formed by joining a board and an electronic component comprising an element body having a mounting surface and a plurality of side faces to each other with solder; the electronic component comprising a first terminal electrode formed on the mounting surface and one of the plurality of side faces, a second terminal electrode formed on the mounting surface and another side face in the plurality of side faces, and an oxide film covering at least a part of surfaces of side face parts of the first and second terminal electrodes formed on the side faces; wherein mounting parts of the first and second terminal electrodes formed on the mounting surface are joined to the board with the solder.

Abstract translation: 电子电路模块部件的一个方面是电子电路模块部件，该电子电路模块部件通过将焊料与包含具有安装面的元件体和多个侧面的电子部件接合而形成， 所述电子部件包括形成在所述安装面和所述多个侧面中的一个侧面上的第一端子电极，形成在所述安装面上的第二端子电极和所述多个侧面的另一侧面，以及覆盖至少一个 形成在侧面上的第一和第二端子电极的侧面部分的表面的一部分; 其中形成在安装表面上的第一和第二端子电极的安装部分与焊料接合到板上。

公开(公告)号：US20240047695A1

公开(公告)日：2024-02-08

申请号：US18268643

申请日：2021-12-16

Applicant: TDK CORPORATION

Inventor： Yuhei HORIKAWA ,  Makoto ENDO ,  Takuya KAKIUCHI ,  Miyuki YANAGIDA ,  Yuki NAITO ,  Takahiro TASHIRO

IPC: H01M4/66 ,  H01M10/0525 ,  H01M4/38

CPC classification number: H01M4/667 ,  H01M10/0525 ,  H01M4/386 ,  H01M4/661 ,  H01M2004/027

Abstract: A laminated body contains a first metal layer containing copper; and a second metal layer containing nickel and laminated directly on the first metal layer. A first surface of the second metal layer is a surface in contact with the first metal layer. A second surface of the second metal layer is a reverse face of the first surface. A thickness direction of the second metal layer is a direction approximately perpendicular to the first surface and oriented from the first surface toward the second surface. A unit of a content of nickel in the second metal layer is % by mass. The content of nickel in the second metal layer 2 decreases along the thickness direction D.

公开(公告)号：US20240047694A1

公开(公告)日：2024-02-08

申请号：US18268640

申请日：2021-12-16

Applicant: TDK CORPORATION

Inventor： Yuhei HORIKAWA ,  Makoto ENDO ,  Takuya KAKIUCHI ,  Miyuki YANAGIDA ,  Yuki NAITO ,  Takahiro TASHIRO

IPC: H01M4/66 ,  H01M4/134

CPC classification number: H01M4/667 ,  H01M4/662 ,  H01M4/134 ,  H01M2004/027

Abstract: A laminated body contains a first metal layer containing copper and a second metal layer containing nickel and laminated directly on the first metal layer. A first surface of the second metal layer is a surface in contact with the first metal layer. A second surface of the second metal layer is a reverse surface of the first surface. A thickness direction of the second metal layer is a direction approximately perpendicular to the first surface and oriented from the first surface toward the second surface. A unit of a content of nickel in the second metal layer is % by mass. The content of nickel in the second metal layer increases along the thickness direction.

公开(公告)号：US20240072239A1

公开(公告)日：2024-02-29

申请号：US18268394

申请日：2021-12-13

Applicant: TDK CORPORATION

Inventor： Yuhei HORIKAWA ,  Makoto ENDO ,  Takuya KAKIUCHI ,  Miyuki YANAGIDA ,  Yuki NAITO ,  Takahiro TASHIRO

IPC: H01M4/134 ,  H01M4/66 ,  H01M10/0525

CPC classification number: H01M4/134 ,  H01M4/661 ,  H01M10/0525

Abstract: A laminated body contains a first metal layer containing copper and a second metal layer containing nickel and directly laminated on the first metal layer. A full width at half maximum of an X-ray diffraction peak having the maximum intensity among at least one X-ray diffraction peak derived from a nickel-containing crystal in the second metal layer is 0.3° or more and 1.2° or less.

公开(公告)号：US20240379969A1

公开(公告)日：2024-11-14

申请号：US18696750

申请日：2021-09-30

Applicant: TDK Corporation

Inventor： Ryo SASAKI ,  Makoto ENDO ,  Mignyu CHEN ,  Yoshihiro KANBAYASHI ,  Takasi SATOU ,  Natsumi KOZAI ,  Yoshihiko TANABE ,  Syuji TSUKAMOTO ,  Miyuki YANAGIDA ,  Kosuke TANAKA ,  Shun IKENARI

IPC: H01M4/66 ,  H01M4/13 ,  H01M10/0525 ,  H01M10/42

Abstract: A current collector includes a resin layer, a conductive layer, a first intermediate layer that is positioned between the resin layer and the conductive layer and a second intermediate layer that is positioned between the first intermediate layer and the resin layer, the first intermediate layer includes a metal as a main component, and the second intermediate layer includes a metal oxide as a main component.

公开(公告)号：US20200352061A1

公开(公告)日：2020-11-05

申请号：US16932046

申请日：2020-07-17

Applicant: TDK CORPORATION

Inventor： Takashi YAMADA ,  Miyuki YANAGIDA ,  Atsushi SATO ,  Kenichi KAWABATA

IPC: H05K9/00

Abstract: A method of forming a metal magnetic film includes forming the metal magnetic film by a plating process, wherein the metal magnetic film comprises a permalloy and carbon atoms and a content of the carbon atoms is 0.3 to 3.0 at % based on a total amount of the carbon atoms and metal elements.

公开(公告)号：US20150255401A1

公开(公告)日：2015-09-10

申请号：US14591427

申请日：2015-01-07

Applicant: TDK CORPORATION

Inventor： Miyuki YANAGIDA ,  Makoto ORIKASA ,  Susumu TANIGUCHI ,  Hisayuki ABE

IPC: H01L23/552 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L23/3114 ,  H01L23/562 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06537 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An electronic component module according to the present invention is provided with an electronic component, a sealing resin that seals the electronic component, and a metal film that covers a surface of the sealing resin. The sealing resin contains filler of oxide particles. Part of the filler in the sealing resin is exposed to the surface of the sealing resin. At least the part of the filler exposed to the surface of the sealing resin includes a crack that extends from an exposed surface of the filler into an inner portion. The crack is filled with at least one metal that constitutes the metal film.

Abstract translation: 根据本发明的电子部件模块设置有电子部件，密封电子部件的密封树脂和覆盖密封树脂的表面的金属膜。 密封树脂含有氧化物颗粒的填料。 密封树脂中的填料的一部分暴露于密封树脂的表面。 暴露于密封树脂表面的填料的至少一部分包括从填料的暴露表面延伸到内部的裂纹。 该裂纹填充有构成金属膜的至少一种金属。

公开(公告)号：US20140041930A1

公开(公告)日：2014-02-13

申请号：US13958966

申请日：2013-08-05

Applicant: TDK CORPORATION

Inventor： Miyuki YANAGIDA ,  Hisayuki ABE

IPC: H05K7/00

CPC classification number: H05K7/00 ,  H01G4/232

Abstract: One aspect of an electronic component is an electronic component comprising an element body having a mounting surface and a plurality of side faces, the electronic component further comprising a first terminal electrode formed on the mounting surface and one of the plurality of side faces, a second terminal electrode formed on the mounting surface and another side face in the plurality of side faces, a metal film disposed on a surface of a mounting part of the first and second terminal electrodes formed on the mounting surface, and an oxide film covering at least a part of surfaces of side face parts of the first and second terminal electrodes formed on the side faces.

Abstract translation: 电子部件的一个方面是电子部件，其包括具有安装面和多个侧面的元件主体，所述电子部件还包括形成在所述安装面上的第一端子电极和所述多个侧面中的一个， 形成在所述安装面上的端子电极和所述多个侧面中的另一个侧面，设置在形成在所述安装面上的所述第一和第二端子电极的安装部的表面上的金属膜，以及至少覆盖 形成在侧面上的第一和第二端子电极的侧面部分的表面的一部分。

公开(公告)号：US20250096280A1

公开(公告)日：2025-03-20

申请号：US18729348

申请日：2022-01-17

Applicant: TDK Corporation

Inventor： Mingyu CHEN ,  Makoto ENDO ,  Yoshihiro KANBAYASHI ,  Takasi SATOU ,  Natsumi KOZAI ,  Yoshihiko TANABE ,  Syuji TSUKAMOTO ,  Miyuki YANAGIDA

IPC: H01M4/66 ,  H01M4/04 ,  H01M10/0525

Abstract: A current collector including: a resin layer having first and second surfaces on opposites sides; and a metal layer including copper. The metal layer includes a first metal layer located on a side of the first surface of the resin layer. A yield stress σY1 of the current collector is smaller than a tensile fracture stress σB2 of the resin layer. The yield stress σY1 [MPa] is obtained by expressions (1) and (2) from a resin layer yield stress σY2 [MPa], a resin layer thickness D2 [μm], a yield stress σY3 [MPa] of the metal layer, and a thickness D3 [μm] of the metal layer: σ ⁢ Y ⁢ 1 = A × σ ⁢ Y ⁢ 3 + ( 1 - A ) × σ ⁢ Y ⁢ 2 ( 1 ) A = D ⁢ 3 / ( D ⁢ 2 + D ⁢ 3 ) . ( 2 ) The yield stress σY3 [MPa] is obtained by the following expression (3) from a half-value width β [°] of an X-ray diffraction peak having the highest intensity in an X-ray diffraction pattern of the metal layer σ ⁢ Y ⁢ 3 = ( - 103 + 1 ⁢ 6 ⁢ 44 × √ β ) . ( 3 )