公开(公告)号：US20190013455A1

公开(公告)日：2019-01-10

申请号：US16082610

申请日：2017-03-03

Applicant: TEKNOLOGIAN TUTKIMUSKESKUS VTT OY

Inventor： Mika PRUNNILA ,  Jouni AHOPELTO ,  Andrey TIMOFEEV ,  Kestutis GRIGORAS ,  Andrey SHCHEPETOV

IPC: H01L35/32 ,  G01J5/14 ,  G01J5/08 ,  G01J5/06 ,  H01L35/22

CPC classification number: H01L35/32 ,  G01J5/061 ,  G01J5/0809 ,  G01J5/12 ,  G01J5/14 ,  H01L35/22

Abstract: A thermoelectric device (1) comprising a frame (2), a membrane (3) made of thermoelectric material, and an element (4) for absorbing or releasing energy. The element (4) is supported to the frame (2) solely by the membrane (3).

公开(公告)号：US20240015936A1

公开(公告)日：2024-01-11

申请号：US18470777

申请日：2023-09-20

Applicant: Teknologian tutkimuskeskus VTT Oy

Inventor： Mika PRUNNILA ,  Alberto RONZANI ,  Emma MYKKÄNEN ,  Antti KEMPPINEN ,  Janne LEHTINEN

IPC: H05K7/20 ,  F28F21/08 ,  H01L23/373 ,  F25D19/00 ,  H10N60/10

CPC classification number: H05K7/20509 ,  F28F21/08 ,  H01L23/3738 ,  H05K7/20372 ,  H05K7/20481 ,  F25D19/006 ,  H10N60/10 ,  F28F2013/006

Abstract: A thermalization arrangement at cryogenic temperatures is disclosed. The arrangement comprises a dielectric substrate layer on which substrate a device/s or component/s are positionable, and a heat sink component is attached on another side of the substrate. The arrangement further comprises a conductive layer between the substrate layer and the heat sink component. A joint between the substrate layer and the conductive layer has minimal phonon thermal boundary resistance. Energy of conductive layer phonons are arranged to be absorbed by electrons. Another joint between the conductive layer and the heat sink component is electrically conductive. The substrate layer and the conductive layer have similar acoustic properties

公开(公告)号：US20240038680A1

公开(公告)日：2024-02-01

申请号：US18278241

申请日：2022-02-17

Applicant: TEKNOLOGIAN TUTKIMUSKESKUS VTT OY

Inventor： Janne LEHTINEN ,  Antti KEMPPINEN ,  Emma MYKKÄNEN ,  Mika PRUNNILA ,  Alberto RONZANI

IPC: H01L23/552 ,  H10N60/81 ,  H01L29/66

CPC classification number: H01L23/552 ,  H10N60/81 ,  H01L29/66977

Abstract: A device for shielding at least one component from thermal radiation, the device comprising at least a first substrate with a first surface and a second surface and a second substrate with a first surface and second surface, the first surface of the second substrate being arranged to at least partially face the second surface of the first substrate. The device additionally comprises at least a first component arranged on the first surface of the second substrate or the second surface of the first substrate and a shielding arrangement comprising a plurality of shielding elements-comprising electrically conductive material, the shielding elements being configured to essentially surround at least the first component to provide a shielded area within which the first component is located, wherein electromagnetic radiation having wavelength longer than a selected first wavelength is essentially prevented from reaching the shielded area.

公开(公告)号：US20220272869A1

公开(公告)日：2022-08-25

申请号：US17676581

申请日：2022-02-21

Applicant: Teknologian tutkimuskeskus VTT Oy

Inventor： Mika PRUNNILA ,  Alberto RONZANI ,  Emma MYKKÄNEN ,  Antti KEMPPINEN ,  Janne LEHTINEN

IPC: H05K7/20 ,  F28F21/08

Abstract: An inventive embodiment comprises a thermalization arrangement at cryogenic temperatures. The arrangement comprises a dielectric substrate (2) layer on which substrate a device/s or component/s (1) are positionable. A heat sink component (4) is attached on another side of the substrate. The arrangement further comprises a conductive layer (5) between the substrate layer (2) and the heat sink component (4). A joint between the substrate layer (2) and the conductive layer (5) has minimal thermal boundary resistance. Another joint between the conductive layer (5) and the cooling heat sink layer (4) is electrically conductive.

公开(公告)号：US20210404880A1

公开(公告)日：2021-12-30

申请号：US17290046

申请日：2019-10-30

Applicant: Teknologian tutkimuskeskus VTT Oy

Inventor： Kirsi TAPPURA ,  Aapo VARPULA ,  Mika PRUNNILA

IPC: G01J5/20

Abstract: An absorber structure for a thermal detector, the absorber structure including edges defining a basic form, a plurality of first legs of electrically conducting material joined in an electrically conductive manner to form, between the edges of the absorber structure, a grid having openings, the first legs forming at least one continuous connection between the edges of the absorber structure; and a plurality of second legs of electrically conducting material joined in an electrically conductive manner to the first legs, wherein the second legs protrude from the first legs into the openings of the grid and terminate at points of termination located at a distance from adjacent first legs.

公开(公告)号：US20190112181A1

公开(公告)日：2019-04-18

申请号：US16090308

申请日：2017-03-31

Applicant: TEKNOLOGIAN TUTKIMUSKESKUS VTT OY

Inventor： Antti JAAKKOLA ,  Tuomas PENSALA ,  Mika PRUNNILA ,  Panu PEKKO ,  Jyrki KIIHAMÄKI ,  Aarne OJA

IPC: B81B3/00 ,  B81C1/00

Abstract: The invention provides a micromechanical device comprising a support structure and a deflecting element connected to the support structure, wherein the deflecting element comprises at least one deformable member adapted to deform extensionally, flexurally or torsionally with respect to a deformation axis for allowing deflection of the deflecting element with respect to the support structure. Further, there are means for statically deflecting the deflecting element or detecting the magnitude of static deflection of the deflecting element. According to the invention, the deformable member is made of silicon doped with an n-type doping agent to a doping concentration of at least 1.1*1020 cm−3. The invention allows for manufacturing micromechanical devices whose mechanical operation is not affected by prevailing temperature conditions.