METHOD FOR ADHESIVE BONDING BY MEANS OF HEAT-ACTIVATABLE ADHESIVE COMPOUNDS
    3.
    发明申请
    METHOD FOR ADHESIVE BONDING BY MEANS OF HEAT-ACTIVATABLE ADHESIVE COMPOUNDS 审中-公开
    通过热激性粘合剂粘合粘合的方法

    公开(公告)号:US20160121590A1

    公开(公告)日:2016-05-05

    申请号:US14895951

    申请日:2014-05-26

    Applicant: TESA SE

    Abstract: A method for adhesively bonding two substrates using an adhesive film that bonds adhesively by activation with heat, wherein the adhesive film is not adhesive at room temperature, in a first step the adhesive film is laminated in a heated state onto the first of the substrates to be adhesively bonded, after the lamination, the side of the adhesive film that is not in contact with the first substrate to be adhesively bonded is initially exposed in order to be able to be brought into contact with the second substrate to be adhesively bonded, the adhesive film is activated by irradiating with electromagnetic radiation in the near infrared range (NIR), by heating to a temperature TK above the lowest activation temperature TA,u, and the adhesive bonding with the second substrate to be adhesively bonded is brought about by means of the activation by the NIR radiation.

    Abstract translation: 一种使用粘合剂膜粘接两片基板的方法,所述粘合剂膜通过热激活粘结,其中所述粘合膜在室温下不粘合,在第一步骤中,所述粘合膜以加热状态层压到所述第一基板上, 在层压之后,粘合剂膜的与未粘合的第一基板接触的一侧最初被暴露以便能够与第二基板接触以进行粘合, 通过加热至高于最低活化温度TA,u的温度TK,通过在近红外范围(NIR)中照射电磁辐射来激活粘合膜,并且通过手段使与粘合粘合的第二基底的粘合剂粘合 的NIR辐射激活。

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