公开(公告)号：US11062982B2

公开(公告)日：2021-07-13

申请号：US16681221

申请日：2019-11-12

Applicant: Texas Instruments Incorporated

Inventor： Vikas Gupta ,  Daniel Yong Lin

IPC: H01L23/495 ,  H01L23/31

Abstract: A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame. A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame and with a reflow wall that surrounds a portion of the solder joint that couples the semiconductor device to the lead frame. A packaged semiconductor device with a reflow wall that surrounds a portion of a solder joint that couples a semiconductor device to a lead frame.

公开(公告)号：US10186478B2

公开(公告)日：2019-01-22

申请号：US15842608

申请日：2017-12-14

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Vikas Gupta ,  Daniel Yong Lin

IPC: H01L23/495 ,  H01L23/31

Abstract: A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame. A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame and with a reflow wall that surrounds a portion of the solder joint that couples the semiconductor device to the lead frame. A packaged semiconductor device with a reflow wall that surrounds a portion of a solder joint that couples a semiconductor device to a lead frame.

公开(公告)号：US20180240741A1

公开(公告)日：2018-08-23

申请号：US15913648

申请日：2018-03-06

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Benjamin Stassen Cook ,  Daniel Yong Lin

IPC: H01L23/495 ,  H01L23/29 ,  H01L21/56 ,  H01L21/48 ,  H01L21/67 ,  H01L23/00

CPC classification number: H01L23/49586 ,  H01L21/4825 ,  H01L21/4857 ,  H01L21/4867 ,  H01L21/56 ,  H01L21/67121 ,  H01L21/6715 ,  H01L23/293 ,  H01L23/49517 ,  H01L23/49558 ,  H01L23/49582 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/183 ,  H01L2924/186 ,  H01L2924/00014 ,  H01L2224/32225 ,  H01L2924/00

Abstract: Described examples include a substrate made of a first material and having a surface. First and second nozzles respectively dispense a first solvent paste including electrically conductive nanoparticles and a second solvent paste including non-conductive nanoparticles, while moving over the surface of the substrate. The first and second nozzles additively deposit a uniform layer including sequential and contiguous zones, alternating between the first solvent paste and the second solvent paste. Energy is applied to sinter together the nanoparticles and diffuse the nanoparticles into the substrate. The sintered nanoparticles form a layer composed of an alternating sequence of electrically conductive zones contiguous with electrically non-conductive zones.

公开(公告)号：US09941194B1

公开(公告)日：2018-04-10

申请号：US15437580

申请日：2017-02-21

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Benjamin Stassen Cook ,  Daniel Yong Lin

IPC: H01L21/00 ,  H01L23/495 ,  H01L23/00 ,  H01L21/67 ,  H01L21/48 ,  H01L21/56 ,  H01L23/29

CPC classification number: H01L23/49586 ,  H01L21/4825 ,  H01L21/4857 ,  H01L21/4867 ,  H01L21/56 ,  H01L21/67121 ,  H01L21/6715 ,  H01L23/293 ,  H01L23/49517 ,  H01L23/49558 ,  H01L23/49582 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48465 ,  H01L2924/183 ,  H01L2924/186

Abstract: In an embodiment, a substrate made of a first material and having a surface is provided. A first and second nozzle dispense a first solvent paste including electrically conductive nanoparticles and a second solvent paste including non-conductive nanoparticles respectively while moving over the surface of the substrate. The first and second nozzles additively deposit a uniform layer comprising sequential and contiguous zones alternating between the first solvent paste and the second solvent paste. Energy is applied to the nanoparticles to sinter together the nanoparticles and diffuse the nanoparticles into the substrate. The sintered nanoparticles form a layer composed of an alternating sequence of electrically conductive zones contiguous with electrically non-conductive zones.

公开(公告)号：US11437333B2

公开(公告)日：2022-09-06

申请号：US15840497

申请日：2017-12-13

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Vikas Gupta ,  Daniel Yong Lin

IPC: H01L23/00 ,  H01L21/48 ,  H01L23/495 ,  H01L23/31

Abstract: A packaged semiconductor device includes a lead frame and a semiconductor device. A solder joint is coupled between the lead frame and a terminal on the semiconductor device. A reflow wall is on a portion of the lead frame and is in contact with the solder joint. A molding compound covers portions of the semiconductor device, the lead frame, the solder joint, and the reflow wall.

公开(公告)号：US20190157195A1

公开(公告)日：2019-05-23

申请号：US16252412

申请日：2019-01-18

Applicant: Texas Instruments Incorporated

Inventor： Vikas Gupta ,  Daniel Yong Lin

IPC: H01L23/495 ,  H01L23/31

Abstract: A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame. A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame and with a reflow wall that surrounds a portion of the solder joint that couples the semiconductor device to the lead frame. A packaged semiconductor device with a reflow wall that surrounds a portion of a solder joint that couples a semiconductor device to a lead frame.

公开(公告)号：US20180190577A1

公开(公告)日：2018-07-05

申请号：US15842608

申请日：2017-12-14

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Vikas Gupta ,  Daniel Yong Lin

IPC: H01L23/495

CPC classification number: H01L23/49579 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49575 ,  H01L23/49582 ,  H01L23/49586 ,  H01L2224/80815

Abstract: A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame. A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame and with a reflow wall that surrounds a portion of the solder joint that couples the semiconductor device to the lead frame. A packaged semiconductor device with a reflow wall that surrounds a portion of a solder joint that couples a semiconductor device to a lead frame.

公开(公告)号：US20200083149A1

公开(公告)日：2020-03-12

申请号：US16681221

申请日：2019-11-12

Applicant: Texas Instruments Incorporated

Inventor： Vikas Gupta ,  Daniel Yong Lin

IPC: H01L23/495 ,  H01L23/31

Abstract: A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame. A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame and with a reflow wall that surrounds a portion of the solder joint that couples the semiconductor device to the lead frame. A packaged semiconductor device with a reflow wall that surrounds a portion of a solder joint that couples a semiconductor device to a lead frame.

公开(公告)号：US10573586B2

公开(公告)日：2020-02-25

申请号：US15913648

申请日：2018-03-06

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Benjamin Stassen Cook ,  Daniel Yong Lin

IPC: H01L23/495 ,  H01L21/67 ,  H01L21/48 ,  H01L21/56 ,  H01L23/29 ,  H01L23/00

Abstract: Described examples include a substrate made of a first material and having a surface. First and second nozzles respectively dispense a first solvent paste including electrically conductive nanoparticles and a second solvent paste including non-conductive nanoparticles, while moving over the surface of the substrate. The first and second nozzles additively deposit a uniform layer including sequential and contiguous zones, alternating between the first solvent paste and the second solvent paste. Energy is applied to sinter together the nanoparticles and diffuse the nanoparticles into the substrate. The sintered nanoparticles form a layer composed of an alternating sequence of electrically conductive zones contiguous with electrically non-conductive zones.

公开(公告)号：US10475729B2

公开(公告)日：2019-11-12

申请号：US16252412

申请日：2019-01-18

Applicant: Texas Instruments Incorporated

Inventor： Vikas Gupta ,  Daniel Yong Lin

IPC: H01L23/495 ,  H01L23/31

Abstract: A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame. A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame and with a reflow wall that surrounds a portion of the solder joint that couples the semiconductor device to the lead frame. A packaged semiconductor device with a reflow wall that surrounds a portion of a solder joint that couples a semiconductor device to a lead frame.