HIGH TILT ANGLE PLUS TWIST DRAIN EXTENSION IMPLANT FOR CHC LIFETIME IMPROVEMENT
    3.
    发明申请
    HIGH TILT ANGLE PLUS TWIST DRAIN EXTENSION IMPLANT FOR CHC LIFETIME IMPROVEMENT 审中-公开
    高度倾斜角度加强两侧排水延伸植入物用于改善生活质量

    公开(公告)号:US20160027647A1

    公开(公告)日:2016-01-28

    申请号:US14874234

    申请日:2015-10-02

    Abstract: An integrated circuit containing an analog MOS transistor may be formed by implanting drain extensions with exactly four sub-implants wherein at least one sub-implant implants dopants in a substrate of the integrated circuit at a source/drain gate edge of the analog MOS transistor at a twist angle having a magnitude of 5 degrees to 40 degrees with respect to the source/drain gate edge of the analog MOS transistor, for each source/drain gate edge of the analog MOS transistor, wherein a zero twist angle sub-implant is perpendicular to the source/drain gate edge. No more than two sub-implants put the dopants in the substrate at any source/drain gate edge of the analog MOS transistor. All four sub-implants are performed at a same tilt angle. No halo implants are performed on the analog MOS transistor.

    Abstract translation: 包含模拟MOS晶体管的集成电路可以通过以正好四个子植入物注入漏极延伸来形成,其中至少一个子注入在模拟MOS晶体管的源极/漏极栅极边缘处将集成电路的衬底中的掺杂物注入 对于模拟MOS晶体管的每个源极/漏极栅极边缘,相对于模拟MOS晶体管的源极/漏极栅极边缘具有5度至40度的幅度的扭曲角,其中零扭转角子植入物是垂直的 到源极/漏极栅极边缘。 在模拟MOS晶体管的任何源/漏极边缘处,不超过两个子植入物将掺杂剂放置在衬底中。 所有四个子植入物以相同的倾斜角度执行。 在模拟MOS晶体管上不进行光晕注入。

    HIGH TILT ANGLE PLUS TWIST DRAIN EXTENSION IMPLANT FOR CHC LIFETIME IMPROVEMENT
    4.
    发明申请
    HIGH TILT ANGLE PLUS TWIST DRAIN EXTENSION IMPLANT FOR CHC LIFETIME IMPROVEMENT 有权
    高度倾斜角度加强两侧排水延伸植入物用于改善生活质量

    公开(公告)号:US20140187008A1

    公开(公告)日:2014-07-03

    申请号:US14142251

    申请日:2013-12-27

    Abstract: An integrated circuit containing an analog MOS transistor may be formed by implanting drain extensions with exactly four sub-implants wherein at least one sub-implant implants dopants in a substrate of the integrated circuit at a source/drain gate edge of the analog MOS transistor at a twist angle having a magnitude of 5 degrees to 40 degrees with respect to the source/drain gate edge of the analog MOS transistor, for each source/drain gate edge of the analog MOS transistor, wherein a zero twist angle sub-implant is perpendicular to the source/drain gate edge. No more than two sub-implants put the dopants in the substrate at any source/drain gate edge of the analog MOS transistor. All four sub-implants are performed at a same tilt angle. No halo implants are performed on the analog MOS transistor.

    Abstract translation: 包含模拟MOS晶体管的集成电路可以通过以正好四个子植入物注入漏极延伸来形成,其中至少一个子注入在模拟MOS晶体管的源极/漏极栅极边缘处将集成电路的衬底中的掺杂物注入 对于模拟MOS晶体管的每个源极/漏极栅极边缘,相对于模拟MOS晶体管的源极/漏极栅极边缘具有5度至40度的幅度的扭曲角,其中零扭转角子植入物是垂直的 到源极/漏极栅极边缘。 在模拟MOS晶体管的任何源/漏极边缘处,不超过两个子植入物将掺杂剂放置在衬底中。 所有四个子植入物以相同的倾斜角度执行。 在模拟MOS晶体管上不进行光晕注入。

    High tilt angle plus twist drain extension implant for CHC lifetime improvement
    5.
    发明授权
    High tilt angle plus twist drain extension implant for CHC lifetime improvement 有权
    高倾斜角加捻线延长植入物,用于CHC寿命改善

    公开(公告)号:US09177802B2

    公开(公告)日:2015-11-03

    申请号:US14142251

    申请日:2013-12-27

    Abstract: An integrated circuit containing an analog MOS transistor may be formed by implanting drain extensions with exactly four sub-implants wherein at least one sub-implant implants dopants in a substrate of the integrated circuit at a source/drain gate edge of the analog MOS transistor at a twist angle having a magnitude of 5 degrees to 40 degrees with respect to the source/drain gate edge of the analog MOS transistor, for each source/drain gate edge of the analog MOS transistor, wherein a zero twist angle sub-implant is perpendicular to the source/drain gate edge. No more than two sub-implants put the dopants in the substrate at any source/drain gate edge of the analog MOS transistor. All four sub-implants are performed at a same tilt angle. No halo implants are performed on the analog MOS transistor.

    Abstract translation: 包含模拟MOS晶体管的集成电路可以通过以正好四个子植入物注入漏极延伸来形成,其中至少一个子注入在模拟MOS晶体管的源极/漏极栅极边缘处将集成电路的衬底中的掺杂物注入 对于模拟MOS晶体管的每个源极/漏极栅极边缘,相对于模拟MOS晶体管的源极/漏极栅极边缘具有5度至40度的幅度的扭曲角,其中零扭转角子植入物是垂直的 到源极/漏极栅极边缘。 在模拟MOS晶体管的任何源/漏极边缘处,不超过两个子植入物将掺杂剂放置在衬底中。 所有四个子植入物以相同的倾斜角度执行。 在模拟MOS晶体管上不进行光晕注入。

    Transistors with dual wells
    6.
    发明授权

    公开(公告)号:US10811534B2

    公开(公告)日:2020-10-20

    申请号:US15871785

    申请日:2018-01-15

    Abstract: In some examples, a transistor includes a first well doped with a first-type dopant having a first concentration. The transistor also includes a gate oxide layer on a portion of the first well and a gate layer on the gate oxide layer. The transistor further includes a first segment of a second well doped with the first-type dopant having a second concentration, the first segment underlapping a first portion of the gate layer. The transistor also includes a source region doped with a second-type dopant having a third concentration, the source region in the first segment. The transistor further includes a drain region doped with the second-type dopant having a concentration that is substantially the same as the third concentration.

    Three Dimensional Three Semiconductor High-Voltage Capacitors
    7.
    发明申请
    Three Dimensional Three Semiconductor High-Voltage Capacitors 有权
    三维三芯半导体高压电容器

    公开(公告)号:US20150076577A1

    公开(公告)日:2015-03-19

    申请号:US14489403

    申请日:2014-09-17

    Abstract: An integrated circuit capacitor. The capacitor includes a substrate, a first conductor, and a first insulating region between the first conductor and the substrate. The capacitor also includes a second conductor, a second insulating region between the first conductor and the second conductor, a third conductor, and a third insulating region between the first conductor and the third conductor. The capacitor also includes a fourth conductor and a fourth insulating region between the first conductor and the fourth conductor.

    Abstract translation: 集成电路电容器。 电容器包括基板,第一导体和第一导体与基板之间的第一绝缘区域。 电容器还包括第二导体,在第一导体和第二导体之间的第二绝缘区,第三导体和第一导体与第三导体之间的第三绝缘区。 电容器还包括在第一导体和第四导体之间的第四导体和第四绝缘区域。

    Three dimensional three semiconductor high-voltage capacitors
    10.
    发明授权
    Three dimensional three semiconductor high-voltage capacitors 有权
    三维三极管高压电容器

    公开(公告)号:US09318337B2

    公开(公告)日:2016-04-19

    申请号:US14489403

    申请日:2014-09-17

    Abstract: An integrated circuit capacitor. The capacitor includes a substrate, a first conductor, and a first insulating region between the first conductor and the substrate. The capacitor also includes a second conductor, a second insulating region between the first conductor and the second conductor, a third conductor, and a third insulating region between the first conductor and the third conductor. The capacitor also includes a fourth conductor and a fourth insulating region between the first conductor and the fourth conductor.

    Abstract translation: 集成电路电容器。 电容器包括基板,第一导体和第一导体与基板之间的第一绝缘区域。 电容器还包括第二导体,在第一导体和第二导体之间的第二绝缘区,第三导体和第一导体与第三导体之间的第三绝缘区。 电容器还包括在第一导体和第四导体之间的第四导体和第四绝缘区域。

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