公开(公告)号：US10396016B2

公开(公告)日：2019-08-27

申请号：US15395429

申请日：2016-12-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Joyce Marie Mullenix ,  Roberto Giampiero Massolini ,  Kristen Nguyen Parrish ,  Osvalod Jorge Lopez ,  Jonathan Almeria Noquil

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/552 ,  H01L23/64

Abstract: One example includes a device that is comprised of a die, a leadframe, and an electrically conductive material. The die includes a circuit therein. The leadframe is coupled with the die and the circuit therein. The electrically conductive material is disposed in a space above the die opposite the leadframe, the electrically conductive material being coupled to the leadframe and configured as one or more turns thereof to form at least one inductor.

公开(公告)号：US11257739B2

公开(公告)日：2022-02-22

申请号：US16927694

申请日：2020-07-13

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Joyce Marie Mullenix ,  Roberto Giampiero Massolini ,  Rajeev D. Joshi

IPC: H01L23/495 ,  H01L23/00

Abstract: A method includes forming a first magnetic material on a first surface of a conductive loop, forming a second magnetic material on a second surface of the conductive loop opposite the first surface to form an inductor, attaching a semiconductor die to a leadframe, and attaching the inductor to the leadframe with solder balls. The semiconductor die is between the inductor and the leadframe. The conductive loop: spans parallel to the leadframe; or is between the first magnetic material and the second magnetic material.

公开(公告)号：US10714412B2

公开(公告)日：2020-07-14

申请号：US15820736

申请日：2017-11-22

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Joyce Marie Mullenix ,  Roberto Giampiero Massolini ,  Rajeev D. Joshi

IPC: H01L23/495 ,  H01L23/00

Abstract: A semiconductor package includes a leadframe comprising input/output pins accessible external to the semiconductor package and a semiconductor die electrically connected to the leadframe. The semiconductor package also includes a passive electrical component mounted on a side of the semiconductor die opposite the leadframe. Mold compound encapsulates the passive electrical component, semiconductor die, and leadframe to form the semiconductor package. Associated methods are disclosed as well.

公开(公告)号：US11270937B2

公开(公告)日：2022-03-08

申请号：US16232684

申请日：2018-12-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Dongbin Hou ,  Steven Alfred Kummerl ,  Roberto Giampiero Massolini ,  Joyce Marie Mullenix

IPC: H01L23/522 ,  H01L23/00 ,  H01L23/495 ,  H01L23/29 ,  H01L21/56 ,  H01L49/02

Abstract: An integrated circuit (IC) package comprises a semiconductor die, a leadframe comprising a plurality of leads coupled to bond pads on the semiconductor die, and an electrically conductive member electrically coupled to the leadframe. A magnetic mold compound encapsulates the electrically conductive member to form an inductor. A non-magnetic mold compound encapsulates the semiconductor die, the leadframe, and the magnetic mold compound.

公开(公告)号：US20200343164A1

公开(公告)日：2020-10-29

申请号：US16927694

申请日：2020-07-13

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Joyce Marie Mullenix ,  Roberto Giampiero Massolini ,  Rajeev D. Joshi

IPC: H01L23/495

Abstract: A method includes forming a first magnetic material on a first surface of a conductive loop, forming a second magnetic material on a second surface of the conductive loop opposite the first surface to form an inductor, attaching a semiconductor die to a leadframe, and attaching the inductor to the leadframe with solder balls. The semiconductor die is between the inductor and the leadframe. The conductive loop: spans parallel to the leadframe; or is between the first magnetic material and the second magnetic material.

公开(公告)号：US20190204269A1

公开(公告)日：2019-07-04

申请号：US15856490

申请日：2017-12-28

Applicant: Texas Instruments Incorporated

Inventor： Peter Smeys ,  Joyce Marie Mullenix

IPC: G01N27/60 ,  G01D5/20 ,  H01F27/24 ,  H01F17/00

CPC classification number: G01N27/605 ,  G01D5/2006 ,  H01F17/0006 ,  H01F27/24

Abstract: Described examples include devices and methods for measuring relative humidity of an environment using inductance. The devices can include a resonant circuit, including a capacitor and an inductor. The inductor includes a moisture-absorbing core with at least a portion thereof exposed to an environment, with at least one magnetic property of the core being variable in response to changing levels of moisture in the environment. An excitation circuit provides an AC excitation signal to the resonant circuit. A sense circuit determines an inductance of the inductor according to a sense signal from the resonant circuit. The sense circuit is coupled to generate an output signal that indicates a humidity level of the environment according to the sense signal.

公开(公告)号：US11506630B2

公开(公告)日：2022-11-22

申请号：US15856490

申请日：2017-12-28

Applicant: Texas Instruments Incorporated

Inventor： Peter Smeys ,  Joyce Marie Mullenix

IPC: G01N27/60 ,  H01F17/00 ,  H01F27/24 ,  G01D5/20 ,  H01F27/255 ,  G01N27/22 ,  H01F21/08 ,  H01F27/40

Abstract: Described examples include devices and methods for measuring relative humidity of an environment using inductance. The devices can include a resonant circuit, including a capacitor and an inductor. The inductor includes a moisture-absorbing core with at least a portion thereof exposed to an environment, with at least one magnetic property of the core being variable in response to changing levels of moisture in the environment. An excitation circuit provides an AC excitation signal to the resonant circuit. A sense circuit determines an inductance of the inductor according to a sense signal from the resonant circuit. The sense circuit is coupled to generate an output signal that indicates a humidity level of the environment according to the sense signal.

公开(公告)号：US10727754B2

公开(公告)日：2020-07-28

申请号：US16367691

申请日：2019-03-28

Applicant: Texas Instruments Incorporated

Inventor： Pierluigi Albertini ,  Maurizio Granato ,  Giacomo Calabrese ,  Roberto Giampiero Massolini ,  Joyce Marie Mullenix ,  Giovanni Frattini

IPC: H02M3/335 ,  H03L7/08 ,  H02M1/00

Abstract: Disclosed examples include isolated dual active bridge (DAB) DC to DC converters with first and second bridge circuits, a transformer with a sense coil, and a secondary side control circuit to provide secondary side switching control signals to regulate an output voltage or current signal by controlling a phase shift angle between switching transitions of the secondary side switching control signals and switching transitions of a secondary side clock signal, where the secondary side control circuit includes a clock recovery circuit to synchronize the secondary side clock signal to transitions in a sense coil voltage signal of the sense coil.

公开(公告)号：US10291138B2

公开(公告)日：2019-05-14

申请号：US15712330

申请日：2017-09-22

Applicant: Texas Instruments Incorporated

Inventor： Pierluigi Albertini ,  Maurizio Granato ,  Giacomo Calabrese ,  Roberto Giampiero Massolini ,  Joyce Marie Mullenix ,  Giovanni Frattini

IPC: H02M3/335 ,  H03L7/08

CPC classification number: H02M3/33592 ,  H02M3/33584 ,  H02M2001/0003 ,  H03L7/0807

Abstract: Disclosed examples include isolated dual active bridge (DAB) DC to DC converters with first and second bridge circuits, a transformer with a sense coil, and a secondary side control circuit to provide secondary side switching control signals to regulate an output voltage or current signal by controlling a phase shift angle between switching transitions of the secondary side switching control signals and switching transitions of a secondary side clock signal, where the secondary side control circuit includes a clock recovery circuit to synchronize the secondary side clock signal to transitions in a sense coil voltage signal of the sense coil.

公开(公告)号：US11756718B2

公开(公告)日：2023-09-12

申请号：US16236571

申请日：2018-12-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Zhemin Zhang ,  Roberto Giampiero Massolini ,  Joyce Marie Mullenix

IPC: H01F17/00 ,  H01F19/08 ,  H01L25/16

CPC classification number: H01F19/08 ,  H01F17/0013 ,  H01F2017/0066 ,  H01F2017/0086 ,  H01F2019/085 ,  H01L25/16

Abstract: A transformer respectively includes a first isolation barrier, a first inductive element, a second isolation barrier, and a second inductive element. The first isolation barrier and second isolation barrier each comprise multiple isolation layers. The transformer also includes magnetic material including a top magnetic portion disposed above the first isolation barrier. The transformer also includes a bottom magnetic portion disposed below the second inductive element; The transformer further includes an intermediary magnetic portion extending from the top magnetic portion to the bottom magnetic portion via a through-hole within the first isolation barrier, first inductive element, second isolation barrier, and second inductive element. The transformer yet further includes at least one lateral magnetic portion extending from the top magnetic portion to the bottom magnetic portion. The at least one lateral magnetic portion is disposed laterally from the first isolation barrier, first inductive element, second isolation barrier, and second inductive element.